United Microelectronics Corp
Sunnyvale, CA 94085
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Design Models, IP, Kits help produce stable high-quality auto ICs.
Available to- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 -µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help chip...
Read More »UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP
Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...
Read More »SDDI Foundry Process (80 nm) increases phone display resolution.
Applying aggressive foundry design rules to shrink bitcell size down to 0.714 -µm-², 80 nm SDDI (Small-panel Display Driver IC) SRAM bitcell enables HD720/WXGA smartphone resolutions. This foundry process is aimed at helping new and existing display driver customers realize higher resolution with lower power consumption for upcoming generations of smartphone displays.
Read More »True 12V eFlash Solution targets touchscreen applications.
Incorporating true 12 V solution, high voltage (HV) embedded flash (eFlash) process enables single-chip integration with improved SNR for mid to large panel touchscreen applications by combining HV component that drives sensor elements with eFlash memory that stores control algorithm. Solution is available in 0.11 and 0.18 -µm process generations.
Read More »BEoL Process offers aluminum process alternative to copper.
Offering alternative to and migration path for 0.18 -µm or existing 0.13/0.11 -µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 -µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS, I/O...
Read More »UMC and Synopsys Collaborate to Develop DesignWare IP for 28-Nanometer Technology
Collaboration on Embedded Memory and Logic Library for UMC's Enhanced Poly SiON 28HLP Process Enables Creation of High-Performance, Low-Power SoCs HSINCHU, Taiwan and MOUNTAIN VIEW, Calif. - United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, and Synopsys, Inc., (Nasdaq: SNPS), a world leader in software and IP used in the design,...
Read More »UMC Delivers Foundry Industry's Most Compact MTP IP Solution
Volume production on 0.18um expected 2H, 2011 HSINCHU, Taiwan - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced the successful completion of a joint development project with Yield Microelectronics Corporation (YMC) to deliver the foundry industry's most compact multiple-time programmable (MTP) non-volatile memory (NVM)...
Read More »UMC Delivers High Endurance, Variable Voltage Range Embedded EEPROM Solution
1.8V-5V I/O voltage range and 1 million program erase cycles vastly improve device battery life and reliability HSINCHU, Taiwan - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced that the company has achieved breakthroughs in its development of embedded electrically erasable programmable read-only memory (eEEPROM)...
Read More »Cypress and UMC Deliver ICs on New 65-Nanometer SONOS Embedded Flash Technology
High-Yield, Reliable UMC Process Offers Easy, Cost-Effective Manufacturing and Low Test Cost; Cypress to Employ Process for Next-Generation PSoC® Products, nvSRAMs and More SAN JOSE, Calif. and HSINCHU, Taiwan - Cypress Semiconductor Corp. (Nasdaq: CY) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced that they have...
Read More »UMC Produces Customer CMOS-MEMS Sensor Products
Volume production to begin this year HSINCHU, Taiwan - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced that the company has produced customer Micro-Electro-Mechanical Systems (MEMS) sensor products, with volume production scheduled for this year. This milestone follows three years of successful MEMS technology...
Read More »Design Models, IP, Kits help produce stable high-quality auto ICs.
Available to- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 -µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help chip...
Read More »UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP
Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...
Read More »SDDI Foundry Process (80 nm) increases phone display resolution.
Applying aggressive foundry design rules to shrink bitcell size down to 0.714 -µm-², 80 nm SDDI (Small-panel Display Driver IC) SRAM bitcell enables HD720/WXGA smartphone resolutions. This foundry process is aimed at helping new and existing display driver customers realize higher resolution with lower power consumption for upcoming generations of smartphone displays.
Read More »True 12V eFlash Solution targets touchscreen applications.
Incorporating true 12 V solution, high voltage (HV) embedded flash (eFlash) process enables single-chip integration with improved SNR for mid to large panel touchscreen applications by combining HV component that drives sensor elements with eFlash memory that stores control algorithm. Solution is available in 0.11 and 0.18 -µm process generations.
Read More »BEoL Process offers aluminum process alternative to copper.
Offering alternative to and migration path for 0.18 -µm or existing 0.13/0.11 -µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 -µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS, I/O...
Read More »UMC and Synopsys Collaborate to Develop DesignWare IP for 28-Nanometer Technology
Collaboration on Embedded Memory and Logic Library for UMC's Enhanced Poly SiON 28HLP Process Enables Creation of High-Performance, Low-Power SoCs HSINCHU, Taiwan and MOUNTAIN VIEW, Calif. - United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, and Synopsys, Inc., (Nasdaq: SNPS), a world leader in software and IP used in the design,...
Read More »UMC Delivers Foundry Industry's Most Compact MTP IP Solution
Volume production on 0.18um expected 2H, 2011 HSINCHU, Taiwan - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced the successful completion of a joint development project with Yield Microelectronics Corporation (YMC) to deliver the foundry industry's most compact multiple-time programmable (MTP) non-volatile memory (NVM)...
Read More »UMC Delivers High Endurance, Variable Voltage Range Embedded EEPROM Solution
1.8V-5V I/O voltage range and 1 million program erase cycles vastly improve device battery life and reliability HSINCHU, Taiwan - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced that the company has achieved breakthroughs in its development of embedded electrically erasable programmable read-only memory (eEEPROM)...
Read More »Cypress and UMC Deliver ICs on New 65-Nanometer SONOS Embedded Flash Technology
High-Yield, Reliable UMC Process Offers Easy, Cost-Effective Manufacturing and Low Test Cost; Cypress to Employ Process for Next-Generation PSoC® Products, nvSRAMs and More SAN JOSE, Calif. and HSINCHU, Taiwan - Cypress Semiconductor Corp. (Nasdaq: CY) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC ), a leading global semiconductor foundry, today announced that they have...
Read More »UMC Participates in EU's Seventh Framework Programme
First electronics firm in Taiwan to join as official member of the EU's primary aid program to support innovative R&D HSINCHU, Taiwan, March 9, 2011 - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ( UMC or The Company ), a leading global semiconductor foundry, today announced its successful participation in the European Union (EU) 7th Framework Programme for Research and...
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