Celsia Technologies

Electronic Components & Devices

Heat Sink cools AMD-based 1U servers.

Available to computer OEMs and ODMs, NanoSpreader(TM) model 401-AM-001 is used to cool AMD's quad core Opteron processors. Use results in both performance enhancements as well as weight savings, which minimizes stress on retention mechanism and processor. Offered as alternative to solid copper/copper fin heat sinks, vapor chamber-based heat sink can be used with any Socket F 1U server.

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Electronic Components & Devices

Copper-Encased Vapor Chambers cool microprocessors.

NanoSpreader Vapor Chambers are 2-phase chambers into which pure water is vacuum-sealed, absorbed by copper wick, and passed as vapor through micro-perforated copper sheet and returned as liquid to wick. Contained in packages from 1.5-70 mm, they attach directly to heat source and can cool power densities up to 150 W/cm2 while offering multidirectional thermal spreading as low as 0.02°C/W....

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Electronic Components & Devices

Cooler suits heat-intensive consumer and gaming CPUs.

With micro thermofluidic casing, Iceon(TM)1000C desktop cooler is built for cooling computers that are used for heat-intensive graphic and video-rich processing applications. Cooler includes fan along with lightweight 2-phase NanoSpreader(TM) heat spreader which uses razor-thin plates or tubes that integrate with any electronic device. Product offers quiet operation under extreme conditions.

Read More »
Electronic Components & Devices

Heat Sink cools AMD-based 1U servers.

Available to computer OEMs and ODMs, NanoSpreader(TM) model 401-AM-001 is used to cool AMD's quad core Opteron processors. Use results in both performance enhancements as well as weight savings, which minimizes stress on retention mechanism and processor. Offered as alternative to solid copper/copper fin heat sinks, vapor chamber-based heat sink can be used with any Socket F 1U server.

Read More »
Electronic Components & Devices

Copper-Encased Vapor Chambers cool microprocessors.

NanoSpreader Vapor Chambers are 2-phase chambers into which pure water is vacuum-sealed, absorbed by copper wick, and passed as vapor through micro-perforated copper sheet and returned as liquid to wick. Contained in packages from 1.5-70 mm, they attach directly to heat source and can cool power densities up to 150 W/cm2 while offering multidirectional thermal spreading as low as 0.02°C/W....

Read More »
Electronic Components & Devices

Cooler suits heat-intensive consumer and gaming CPUs.

With micro thermofluidic casing, Iceon(TM)1000C desktop cooler is built for cooling computers that are used for heat-intensive graphic and video-rich processing applications. Cooler includes fan along with lightweight 2-phase NanoSpreader(TM) heat spreader which uses razor-thin plates or tubes that integrate with any electronic device. Product offers quiet operation under extreme conditions.

Read More »

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