Ascentech
Chester, CT 06412
Ascentech LLC, GEN3 Systems Exhibit New Nano-Coat, Cleanliness Test Solutions at IPC/APEX 2011
Chester, Connecticut, USA - Ascentech LLC, the North American distributor for GEN3 Systems products, and GEN3 Systems Ltd., will introduce new and improved products for electronics manufacturing at the IPC/Apex 2011 trade show and symposium. GEN3 has redesigned their line of precision, pneumatically-controlled Dip-Coaters and now introduces the Nano-Coat line of products. The Nano-Coat system...
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Ascentech Provides Product Reliability Testing to Henkel
February 20, 2008 Ascentech Provides Product Reliability Testing to Henkel Chester, Connecticut, USA - Ascentech, LLC, North American distributor for GEN3 Systems Ltd. products, recently provided Henkel Corporation's Electronics Technology Center in Irvine California, with laboratory equipment for Surface Insulation Resistance testing and for Solderability testing. In announcing the purchase,...
Read More »Solderability Test Equipment can conduct 6 separate tests.
ShareGen SPA 1000 Solder Paste Analyzer provides testing capabilities to help control and manage solder paste in production process. It can perform up to 6 separate tests in accordance to IEC 61189-5 and IPC-TM-650 standards and can also conduct solder paste Open Time tests. Capabilities minimize range of defects - missing components, tombstoning, component misalignment, non-wetting - to reduce...
Read More »
Test System measures solderability of terminations.
MUST System 3 measures solderability of PCB and/or component's metallic terminations by documenting wetting curve of unit under test. Using small solder bath or solder globule and vertical force measurements, system can test solderability of lead-free and leaded PCB lands and component leads. Tests performed are defined by IPC, IEC, MIL-STD, and EIA standards.
Read More »
Ascentech LLC, GEN3 Systems Exhibit New Nano-Coat, Cleanliness Test Solutions at IPC/APEX 2011
Chester, Connecticut, USA - Ascentech LLC, the North American distributor for GEN3 Systems products, and GEN3 Systems Ltd., will introduce new and improved products for electronics manufacturing at the IPC/Apex 2011 trade show and symposium. GEN3 has redesigned their line of precision, pneumatically-controlled Dip-Coaters and now introduces the Nano-Coat line of products. The Nano-Coat system...
Read More »Ascentech LLC Appointed NY, New England Rep for PCB Test Leader Atg Luther & Maelzer GmbH
Chester, Connecticut, USA - Ascentech LLC has been appointed Manufacturers Representative in the New England and New York territory for atg Luther & Maelzer GmbH products. Atg Luther & Maelzer GmbH, Wertheim Germany, is the world leader in electrical test equipment for printed circuit board manufactures. Atg Luther & Maelzer provide the industry with the most advanced flying probe and...
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Ascentech Provides Product Reliability Testing to Henkel
February 20, 2008 Ascentech Provides Product Reliability Testing to Henkel Chester, Connecticut, USA - Ascentech, LLC, North American distributor for GEN3 Systems Ltd. products, recently provided Henkel Corporation's Electronics Technology Center in Irvine California, with laboratory equipment for Surface Insulation Resistance testing and for Solderability testing. In announcing the purchase,...
Read More »Solderability Test Equipment can conduct 6 separate tests.
ShareGen SPA 1000 Solder Paste Analyzer provides testing capabilities to help control and manage solder paste in production process. It can perform up to 6 separate tests in accordance to IEC 61189-5 and IPC-TM-650 standards and can also conduct solder paste Open Time tests. Capabilities minimize range of defects - missing components, tombstoning, component misalignment, non-wetting - to reduce...
Read More »
Test System measures solderability of terminations.
MUST System 3 measures solderability of PCB and/or component's metallic terminations by documenting wetting curve of unit under test. Using small solder bath or solder globule and vertical force measurements, system can test solderability of lead-free and leaded PCB lands and component leads. Tests performed are defined by IPC, IEC, MIL-STD, and EIA standards.
Read More »