EV Group, Inc.

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Adhesives & Sealants

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

Read More »
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Adhesives & Sealants

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

Read More »
Wafer Bonding Systems support wafers up to 200 mm in diameter.
Adhesives & Sealants

Wafer Bonding Systems support wafers up to 200 mm in diameter.

Designed for universities and R&D groups, EVG-®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm...

Read More »
Wafer Bonding Systems support wafers up to 200 mm in diameter.
Adhesives & Sealants

Wafer Bonding Systems support wafers up to 200 mm in diameter.

Designed for universities and R&D groups, EVGÂ-®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with...

Read More »
Nanoimprint Lithography Process aids photonic device production.
Printing & Duplicating Equipment

Nanoimprint Lithography Process aids photonic device production.

Available on NIL platforms, including mask aligners as well as EVG-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at >40...

Read More »
Nanoimprint Lithography Process aids photonic device production.
Printing & Duplicating Equipment

Nanoimprint Lithography Process aids photonic device production.

Available on NIL platforms, including mask aligners as well as EVGÂ-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at...

Read More »
Wafer Bonding System operates in high-vacuum-process environment.
Adhesives & Sealants

Wafer Bonding System operates in high-vacuum-process environment.

Built to support high-volume manufacturing requirements, EVG-®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up...

Read More »
Wafer Bonding System operates in high-vacuum-process environment.
Adhesives & Sealants

Wafer Bonding System operates in high-vacuum-process environment.

Built to support high-volume manufacturing requirements, EVGÂ-®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder...

Read More »
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
Adhesives & Sealants

Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

GEMINI-®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for...

Read More »
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
Adhesives & Sealants

Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

GEMINIÂ-®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing...

Read More »
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Adhesives & Sealants

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

Read More »
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Adhesives & Sealants

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

Read More »
Wafer Bonding Systems support wafers up to 200 mm in diameter.
Adhesives & Sealants

Wafer Bonding Systems support wafers up to 200 mm in diameter.

Designed for universities and R&D groups, EVG-®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm...

Read More »
Wafer Bonding Systems support wafers up to 200 mm in diameter.
Adhesives & Sealants

Wafer Bonding Systems support wafers up to 200 mm in diameter.

Designed for universities and R&D groups, EVGÂ-®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with...

Read More »
Nanoimprint Lithography Process aids photonic device production.
Printing & Duplicating Equipment

Nanoimprint Lithography Process aids photonic device production.

Available on NIL platforms, including mask aligners as well as EVG-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at >40...

Read More »
Nanoimprint Lithography Process aids photonic device production.
Printing & Duplicating Equipment

Nanoimprint Lithography Process aids photonic device production.

Available on NIL platforms, including mask aligners as well as EVGÂ-®720 and EVG7200 UV-NIL systems, SmartNIL™ large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at...

Read More »
Wafer Bonding System operates in high-vacuum-process environment.
Adhesives & Sealants

Wafer Bonding System operates in high-vacuum-process environment.

Built to support high-volume manufacturing requirements, EVG-®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder processes up...

Read More »
Wafer Bonding System operates in high-vacuum-process environment.
Adhesives & Sealants

Wafer Bonding System operates in high-vacuum-process environment.

Built to support high-volume manufacturing requirements, EVGÂ-®580 ComBond® enables electrically conductive and oxide-free covalent bonds at room temperature. Integrated dedicated ComBond Activation Module optimizes surface preparation to achieve contamination-free and oxide-free bond interface. Able to operate in high-vacuum-process environment, room-temperature covalent bonder...

Read More »
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
Adhesives & Sealants

Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

GEMINI-®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for...

Read More »
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
Adhesives & Sealants

Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

GEMINIÂ-®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing...

Read More »

All Topics