EV Group, Inc.

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Electronic Components & Devices

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini-® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC integration...

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EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Electronic Components & Devices

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's GeminiÂ-® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...

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Machinery & Machining Tools

Texas State University Selects EV Group Wafer Bonding System for Advanced Compound Semiconductor and Silicon-Based Power Device Research

EVG Scores with Highly Flexible Tool, Advanced Technology and Strong Process Support ST. FLORIAN, Austria and SAN MARCOS, Texas - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system at Texas State University. The highly flexible R&D system, which is...

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Machinery & Machining Tools

Texas State University Selects EV Group Wafer Bonding System for Advanced Compound Semiconductor and Silicon-Based Power Device Research

EVG Scores with Highly Flexible Tool, Advanced Technology and Strong Process Support ST. FLORIAN, Austria and SAN MARCOS, Texas - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system at Texas State University. The highly flexible R&D system, which is...

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Adhesives & Sealants

China-Based SOI Wafer Manufacturer Shenyang Silicon Technology Purchases EV Group's EVG850LT 300-mm SOI Production Bonding System

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, low-temperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI...

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Adhesives & Sealants

China-Based SOI Wafer Manufacturer Shenyang Silicon Technology Purchases EV Group's EVG850LT 300-mm SOI Production Bonding System

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, low-temperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI...

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Automated Resist Processing System handles high-volume jobs.
Fluid & Gas Flow Equipment

Automated Resist Processing System handles high-volume jobs.

Accommodating wafers from 50-200 mm dia, EVG150 provides flexible, modular platform that addresses production needs for back-end lithography, conformal coating, and planarization of devices with complicated structures and topographies. Up to 4 wet process modules can be combined with 2 stacks of hot plates, chill plates, and vapor prime modules. Specific capabilities include spin coating,...

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Automated Resist Processing System handles high-volume jobs.
Fluid & Gas Flow Equipment

Automated Resist Processing System handles high-volume jobs.

Accommodating wafers from 50-200 mm dia, EVG150 provides flexible, modular platform that addresses production needs for back-end lithography, conformal coating, and planarization of devices with complicated structures and topographies. Up to 4 wet process modules can be combined with 2 stacks of hot plates, chill plates, and vapor prime modules. Specific capabilities include spin coating,...

Read More »
Electrical Equipment & Systems

EV Group and Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution to Boost Power Output of Photovoltaics

SAN FRANCISCO - Intersolar North America - EV Group (EVG), a leading supplier of coating equipment for the photovoltaics (PV), nanotechnology and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today announced they are collaborating to provide a total solution for anti-reflective (AR) coatings for the PV market. Under a strategic cooperation...

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Electrical Equipment & Systems

EV Group and Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution to Boost Power Output of Photovoltaics

SAN FRANCISCO - Intersolar North America - EV Group (EVG), a leading supplier of coating equipment for the photovoltaics (PV), nanotechnology and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today announced they are collaborating to provide a total solution for anti-reflective (AR) coatings for the PV market. Under a strategic cooperation...

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