Micro-Epsilon
Raleigh, NC 27617
Height Measurement of Wafer Bumps
Computer chips are manufactured in large quantities on a wafer. On the chips there are countless small, spherical contact surfaces, so-called bumps. These must be of a uniform height in order to function properly when stacked later. Confocal sensors from Micro-Epsilon determine the height of the wafer bumps with micrometer precision in the production line. Confocal chromatic sensors from...
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New Confocal Sensor with Measuring Range of 0.8 mm
Measures distance and thickness where high accuracy and signal stability are required. High precision displacement and thickness measurements on diffuse, reflecting and transparent materials. Suitable for glass industry and enables high resolution thickness measurements from a layer thickness of 300 µm.
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New Confocal Sensor with Measuring Range of 0.8 mm
Measures distance and thickness where high accuracy and signal stability are required. High precision displacement and thickness measurements on diffuse, reflecting and transparent materials. Suitable for glass industry and enables high resolution thickness measurements from a layer thickness of 300 µm.
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New Laser Distance Sensors Measure Distances up to 150 m
Offers accuracy, surface independence and high signal quality. Robust aluminum die-cast housing is designed for industrial environments. Used in steel industry as well as in transport, logistics and conveyor system industries.
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New Laser Distance Sensors Measure Distances up to 150 m
Offers accuracy, surface independence and high signal quality. Robust aluminum die-cast housing is designed for industrial environments. Used in steel industry as well as in transport, logistics and conveyor system industries.
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New IMP-TH70 Sensor Offers Working Distance of 70 mm
Measures thickness of glass and film with a resolution of < 1 nm. Generates small light spot diameter of 5 µm and tolerates material tilt angle of ± 4.5°. Enables stable measurement results even on slightly curved surfaces.
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New IMP-TH70 Sensor Offers Working Distance of 70 mm
Measures thickness of glass and film with a resolution of < 1 nm. Generates small light spot diameter of 5 µm and tolerates material tilt angle of ± 4.5°. Enables stable measurement results even on slightly curved surfaces.
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New Infrared Pyrometer for Non-Contact Temperature Measurements
Measures temperatures from 0°C to 500°C with very high speed and precision. Works with a spectral range from 2.2 up to 6 µm wavelength. Measurements can be made on metals and non-metals such as ceramics and plastics.
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New Infrared Pyrometer for Non-Contact Temperature Measurements
Measures temperatures from 0°C to 500°C with very high speed and precision. Works with a spectral range from 2.2 up to 6 µm wavelength. Measurements can be made on metals and non-metals such as ceramics and plastics.
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New Video Endoscope for Harsh Environments
Works with two integrated cameras which can be switched between 0° and 90°. Tactile control unit can be used to angle the camera probe in every position up to 180°. High performance battery ensures long operating times of more than two hours.
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