D3 Engineering
Rochester, NY 14604
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Latest Radar Sensor Enables Algorithms to Measure, Detect, and Track
Features 1 in. cube form factor, heat-spreading metal body, and mounting tabs. Covers 60 GHz with bandwidths up to 4 GHz and offers 2 dBm transmit power and noise figure 15 dB or better across the band. Comes with header for connection to optional baseboards or hosts for additional interfaces and functionality.
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New mmWave Radar Sensors Feature Heat-Spreading Metal Body
RS-6843AOP and RS-6843AOPU covers 60 GHz with bandwidths up to 4 GHz and includes 1-inch cube form factor. Features 12 dBm transmit power and noise figure 15 dB or improved across the band. Applications include driver monitoring, collision avoidance, people counting and tracking.
Read More »
New RS-1843A mmWave Radar Sensor Evaluation Kit Comes with USB-Serial Interface for Testing and Evaluation
Features single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP, MCU and radar accelerator. Includes C674x DSP for FMCW signal processing, hardware accelerator for radar cube processing, and Cortex-R4F microcontroller for object tracking, classification, and communications. Applications include robotics, autonomous machines, industrial vehicle systems, tracking, and facility...
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New Rugged ECU Accelerates ADAS and Autonomous System Product Design
RVP-TDA4Vx production-intent kit features TDA4VM SoC processor and configurable SerDes interface. Supports multiple SerDes capture streams with different transport protocols through its configurable personality card. Ideal for automated valet park, neural networks, video analytics, driver notification, multi-camera display, mirror replacement and sensor fusion applications.
Read More »
New DesignCore Sensor Interface Card with On-Board FPGA
Allows user to quickly connect multiple cameras or sensors with NVIDIA Jetson AGX Xavier Developer Kit . Enables engineers to connect up to 16 streams of input data for computing power of Jetson AGX Xavier. Offered with high-speed SerDes input using FPD-Link™ III interface and power-over-coax.
Read More »
New Designcore NVIDIA Jetson RSP-TX2 Development Kit has Wi-Fi, Bluetooth, Gigabit Ethernet and USB 3.0 Interfaces
Features an NVIDIA Jetson TX2 processor and six high-speed SerDes inputs for vision and spatial sensors. SSD and eSATA expansion enable hours of raw data storage. Applications include artificial intelligence at the edge, camera monitoring systems, industrial vehicle systems, machine vision, robotics and autonomous machines.
Read More »
New DesignCore RVP-TDA2Px Development Kit Comes with Advanced Vision Software Framework
The DesignCore RVP-TDA2Px Development Kit is designed for autonomous systems development. The kit is embedded with a TDA2Px SoC processor and a 4Gbps FPD-Link™ III SerDes interface. It is suitable for automotive applications such as multi-camera/multi-display mirror replacement, 3D surround view with car black box and in-vehicle infotainment and telematics. The processor board supports eight...
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D3 Engineering Announces FPD-Link Module for Use in Transportation and Industrial Vision Systems
D3 Engineering’s new miniature FPD-Link III camera module is a small and lightweight rugged module designed to IP69K and validated for production for use in transportation and industrial vision systems. It is ideal for mirror replacement and camera monitoring systems on trucks, buses, industrial vehicles, heavy transportation machinery and earth moving, mining, construction, agriculture and...
Read More »
New Jetson SerDes Sensor Interface Card Comes with MIPI CSI-2 Input
The Jetson™ SerDes Sensor Interface Card is designed for use with NVIDIA Jetson Xavier™ and Jetson TX1/TX2 Developer Kits. The units allow engineers to interface multiple cameras and sensors to Jetson platform. It comes with FPD-Link™ III and GMSL2 SerDes standards. The sensor streams are offered with over a serial link and can be de-serialized into MIPI CSI-2 data. The interface card...
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New DesignCore D3RCM Camera Modules are Housed in IP69K Sealed Enclosures
The DesignCore® D3RCM Rugged Camera Modules are offered with on-sensor and internal image signal processing (ISP). The cameras come with Sony or OmniVision image sensors and FPD-Link III SerDes. The unit’s Power over Coax with multiplexed video stream and control channels simplifies system integration. D3RCM camera modules are designed for high-performance automotive and industrial vision...
Read More »D3 Engineering Collaborates with Microsoft to Deploy Time of Flight Imaging Technology in Industrial Applications
Access to Microsoft’s Azure Depth Platform program enhances D3 Engineering’s deployment of Time of Flight imaging technology Rochester, NY – December 29, 2021 – D3 Engineering announced its collaboration with Microsoft’s Azure Depth Platform program, setup to provide access to Microsoft’s 3D Time of Flight imaging technology to a 3rd party ecosystem. This technology, developed...
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Latest Radar Sensor Enables Algorithms to Measure, Detect, and Track
Features 1 in. cube form factor, heat-spreading metal body, and mounting tabs. Covers 60 GHz with bandwidths up to 4 GHz and offers 2 dBm transmit power and noise figure 15 dB or better across the band. Comes with header for connection to optional baseboards or hosts for additional interfaces and functionality.
Read More »
New mmWave Radar Sensors Feature Heat-Spreading Metal Body
RS-6843AOP and RS-6843AOPU covers 60 GHz with bandwidths up to 4 GHz and includes 1-inch cube form factor. Features 12 dBm transmit power and noise figure 15 dB or improved across the band. Applications include driver monitoring, collision avoidance, people counting and tracking.
Read More »
New RS-1843A mmWave Radar Sensor Evaluation Kit Comes with USB-Serial Interface for Testing and Evaluation
Features single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP, MCU and radar accelerator. Includes C674x DSP for FMCW signal processing, hardware accelerator for radar cube processing, and Cortex-R4F microcontroller for object tracking, classification, and communications. Applications include robotics, autonomous machines, industrial vehicle systems, tracking, and facility...
Read More »
New Rugged ECU Accelerates ADAS and Autonomous System Product Design
RVP-TDA4Vx production-intent kit features TDA4VM SoC processor and configurable SerDes interface. Supports multiple SerDes capture streams with different transport protocols through its configurable personality card. Ideal for automated valet park, neural networks, video analytics, driver notification, multi-camera display, mirror replacement and sensor fusion applications.
Read More »
New DesignCore Sensor Interface Card with On-Board FPGA
Allows user to quickly connect multiple cameras or sensors with NVIDIA Jetson AGX Xavier Developer Kit . Enables engineers to connect up to 16 streams of input data for computing power of Jetson AGX Xavier. Offered with high-speed SerDes input using FPD-Link™ III interface and power-over-coax.
Read More »
New Designcore NVIDIA Jetson RSP-TX2 Development Kit has Wi-Fi, Bluetooth, Gigabit Ethernet and USB 3.0 Interfaces
Features an NVIDIA Jetson TX2 processor and six high-speed SerDes inputs for vision and spatial sensors. SSD and eSATA expansion enable hours of raw data storage. Applications include artificial intelligence at the edge, camera monitoring systems, industrial vehicle systems, machine vision, robotics and autonomous machines.
Read More »
New DesignCore RVP-TDA2Px Development Kit Comes with Advanced Vision Software Framework
The DesignCore RVP-TDA2Px Development Kit is designed for autonomous systems development. The kit is embedded with a TDA2Px SoC processor and a 4Gbps FPD-Link™ III SerDes interface. It is suitable for automotive applications such as multi-camera/multi-display mirror replacement, 3D surround view with car black box and in-vehicle infotainment and telematics. The processor board supports eight...
Read More »
D3 Engineering Announces FPD-Link Module for Use in Transportation and Industrial Vision Systems
D3 Engineering’s new miniature FPD-Link III camera module is a small and lightweight rugged module designed to IP69K and validated for production for use in transportation and industrial vision systems. It is ideal for mirror replacement and camera monitoring systems on trucks, buses, industrial vehicles, heavy transportation machinery and earth moving, mining, construction, agriculture and...
Read More »
New Jetson SerDes Sensor Interface Card Comes with MIPI CSI-2 Input
The Jetson™ SerDes Sensor Interface Card is designed for use with NVIDIA Jetson Xavier™ and Jetson TX1/TX2 Developer Kits. The units allow engineers to interface multiple cameras and sensors to Jetson platform. It comes with FPD-Link™ III and GMSL2 SerDes standards. The sensor streams are offered with over a serial link and can be de-serialized into MIPI CSI-2 data. The interface card...
Read More »