DKN Research

DKN Research Develops a Low Cost Flexible EL System Using a Screen-Printing Process
Architectural & Civil Engineering Products

DKN Research Develops a Low Cost Flexible EL System Using a Screen-Printing Process

DKN Research, a leading engineering firm specializing in microelectronics and packaging technology, now carries a variety of flexible devices and materials for printable & flexible electronics. DKN Research continues to develop a wide range of screen-printing technologies for advanced thick film circuits, including fine line conductors down to 30 microns, multi-layer circuits with printed via...

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Printing & Duplicating Equipment

Fine Silver Conductor Kit supports trials to 50 micron.

Capable of producing 50 micron fine silver conductor traces on flexible substrates, Fine Silver Conductor Trial Kit accommodates companies interested in producing high-density thick film circuits. Components include screen mask with standard fine patterns, printing table, bottle of special silver ink, flexible substrates, squeegee, and all other materials necessary for screen-printing....

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Architectural & Civil Engineering Products

Cut & Paste Printed Resistors and Capacitors for Flexible Film Substrates

DKN Research, a leading engineering firm specializing in micro electronics and packaging technology, recently developed a new passive component series of Printed Resistors and Capacitors built with fine silver thick film circuits on flexible film substrates for cut & paste applications. This is possible through an advanced screen-printing process using special silver inks, carbon inks, dielectric...

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Printing & Duplicating Equipment

DKN Research Provides Fine Silver Conductor Trial Kit Down to 80 micron

DKN Research, a leading engineering firm specializing in micro electronics and packaging technology, is now offering a Fine Silver Conductor Trial Kit (capable of producing fine lines down to 80 microns) to companies interested in producing high density thick film circuits. The Trial Kit provides a low cost practical solution for companies to experiment and overcome challengers with fine polymer...

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DKN Research Provides Fine Silver Trace Technology Down to 50 Micron
Architectural & Civil Engineering Products

DKN Research Provides Fine Silver Trace Technology Down to 50 Micron

DKN Research, a leading engineering firm specializing in micro electronics and packaging technology is can now provide a fine thick film circuit technology down to 50 micron line/space. This is possible through an advanced screen-printing process using special silver inks and related materials that include substrates and insulating materials as the fundamental technology for Printable...

Read More »
Printing & Duplicating Equipment

DKN Research Group Develops New Embedded Components Technologies

DKN Research, a premier research and engineering firm specializing in printable electronics and NY Industries, a leading flexible circuit manufacturer from Ohtsu Japan have co-developed a new embedded passive technology built on thin multi-layer thick film flexible substrates. This new embedded passive technology could prove to be valuable in the construction of Printable Flexible Electronics....

Read More »
DKN Research Develops a Low Cost Flexible EL System Using a Screen-Printing Process
Architectural & Civil Engineering Products

DKN Research Develops a Low Cost Flexible EL System Using a Screen-Printing Process

DKN Research, a leading engineering firm specializing in microelectronics and packaging technology, now carries a variety of flexible devices and materials for printable & flexible electronics. DKN Research continues to develop a wide range of screen-printing technologies for advanced thick film circuits, including fine line conductors down to 30 microns, multi-layer circuits with printed via...

Read More »
Printing & Duplicating Equipment

Fine Silver Conductor Kit supports trials to 50 micron.

Capable of producing 50 micron fine silver conductor traces on flexible substrates, Fine Silver Conductor Trial Kit accommodates companies interested in producing high-density thick film circuits. Components include screen mask with standard fine patterns, printing table, bottle of special silver ink, flexible substrates, squeegee, and all other materials necessary for screen-printing....

Read More »
Architectural & Civil Engineering Products

Cut & Paste Printed Resistors and Capacitors for Flexible Film Substrates

DKN Research, a leading engineering firm specializing in micro electronics and packaging technology, recently developed a new passive component series of Printed Resistors and Capacitors built with fine silver thick film circuits on flexible film substrates for cut & paste applications. This is possible through an advanced screen-printing process using special silver inks, carbon inks, dielectric...

Read More »
Printing & Duplicating Equipment

DKN Research Provides Fine Silver Conductor Trial Kit Down to 80 micron

DKN Research, a leading engineering firm specializing in micro electronics and packaging technology, is now offering a Fine Silver Conductor Trial Kit (capable of producing fine lines down to 80 microns) to companies interested in producing high density thick film circuits. The Trial Kit provides a low cost practical solution for companies to experiment and overcome challengers with fine polymer...

Read More »
DKN Research Provides Fine Silver Trace Technology Down to 50 Micron
Architectural & Civil Engineering Products

DKN Research Provides Fine Silver Trace Technology Down to 50 Micron

DKN Research, a leading engineering firm specializing in micro electronics and packaging technology is can now provide a fine thick film circuit technology down to 50 micron line/space. This is possible through an advanced screen-printing process using special silver inks and related materials that include substrates and insulating materials as the fundamental technology for Printable...

Read More »
Printing & Duplicating Equipment

DKN Research Group Develops New Embedded Components Technologies

DKN Research, a premier research and engineering firm specializing in printable electronics and NY Industries, a leading flexible circuit manufacturer from Ohtsu Japan have co-developed a new embedded passive technology built on thin multi-layer thick film flexible substrates. This new embedded passive technology could prove to be valuable in the construction of Printable Flexible Electronics....

Read More »

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