Questar Products International, Inc

Automatic Wire Bonder facilitates setup and changeover.
Adhesives & Sealants

Automatic Wire Bonder facilitates setup and changeover.

As fine-pitch, fine-wire (17-75 micron), automatic gold ball bonder, Q2119A meets production demands associated with smaller lot sizes, multiple product variations, and frequent set-up changes. Package conversions can be completed in minutes while accommodating various device configurations, and features such as pattern recognition system, ball bumping and coining capability, and programmable...

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Automatic Wire Bonder facilitates setup and changeover.
Adhesives & Sealants

Automatic Wire Bonder facilitates setup and changeover.

As fine-pitch, fine-wire (17-75 micron), automatic gold ball bonder, Q2119A meets production demands associated with smaller lot sizes, multiple product variations, and frequent set-up changes. Package conversions can be completed in minutes while accommodating various device configurations, and features such as pattern recognition system, ball bumping and coining capability, and programmable...

Read More »

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