Goepel Electronics LLC

Test & Measurement

GOEPEL Electronic Establishes Boundary Scan Technology in Asia

GOEPEL electronic announces another strategic partnership in the Asian region, by the inclusion of the Chinese technology company Pansino Solutions, into the GATE Alliance Program (GOEPEL Associated Technical Experts). The main focus of the cooperation is special application development and practical implementation of new JTAG/Boundary Scan solutions as well as their integration into existing...

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Test & Measurement

GOEPEL Electronic Establishes Boundary Scan Technology in Asia

GOEPEL electronic announces another strategic partnership in the Asian region, by the inclusion of the Chinese technology company Pansino Solutions, into the GATE Alliance Program (GOEPEL Associated Technical Experts). The main focus of the cooperation is special application development and practical implementation of new JTAG/Boundary Scan solutions as well as their integration into existing...

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Test & Measurement

New Distribution Cooperation for French Market between GOEPEL Electronics and Orion Industry

GOEPEL electronics introduces a new distribution partner for sales of Automatic Optical (AOI) and Automatic X-ray Inspection (AXI) systems on the French market. The company named Orion Industry, located in the region Île-de-France, is now responsible for the distribution of inspection systems from GOEPEL electronics. GOEPEL electronics have a strong presence in the French market with its...

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Test & Measurement

New Distribution Cooperation for French Market between GOEPEL Electronics and Orion Industry

GOEPEL electronics introduces a new distribution partner for sales of Automatic Optical (AOI) and Automatic X-ray Inspection (AXI) systems on the French market. The company named Orion Industry, located in the region Île-de-France, is now responsible for the distribution of inspection systems from GOEPEL electronics. GOEPEL electronics have a strong presence in the French market with its...

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Electronic Components & Devices

Emulation Technology supports TI TMS570LSxx processor compatibility.

VarioTAP-® technology, used for universal processor emulation, is available for Texas Instruments TMS570LSxx models of Hercules™ series. Processor is configured to provide design-integrated test and programming instruments via native debug port. As part of IP library, VarioTAP® model contains all relevant access information for respective target processor. Users can, due to...

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Electronic Components & Devices

Emulation Technology supports TI TMS570LSxx processor compatibility.

VarioTAPÂ-® technology, used for universal processor emulation, is available for Texas Instruments TMS570LSxx models of Hercules™ series. Processor is configured to provide design-integrated test and programming instruments via native debug port. As part of IP library, VarioTAP® model contains all relevant access information for respective target processor. Users can,...

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Electronic Components & Devices

Universal Processor Emulation is available for TI AM355x series.

VarioTAP-® technology is available for universal processor emulation for Texas Instruments AM355x products of Sitara™ series. Configuration provides design-integrated test and programming instruments via native debug port. Respective VarioTAP® model, as part of IP library, contains all relevant access information for respective target processor. Users can select processor corresponding to...

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Electronic Components & Devices

Universal Processor Emulation is available for TI AM355x series.

VarioTAPÂ-® technology is available for universal processor emulation for Texas Instruments AM355x products of Sitara™ series. Configuration provides design-integrated test and programming instruments via native debug port. Respective VarioTAP® model, as part of IP library, contains all relevant access information for respective target processor. Users can select processor...

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3D Inspection System is capable of sintering paste evaluation.
Software

3D Inspection System is capable of sintering paste evaluation.

With- hardware and software adaptions, SPI-LINE 3D electronic solder paste inspection system handles inspection of printed sintering paste in electronic assemblies manufacturing. High-speed 3D camera head can capture thin sintering paste layers with precision, while integrated algorithms enable evaluation of sintered paste printing in addition to accurate and rapid measurement of height, volume,...

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3D Inspection System is capable of sintering paste evaluation.
Software

3D Inspection System is capable of sintering paste evaluation.

WithÂ- hardware and software adaptions, SPI-LINE 3D electronic solder paste inspection system handles inspection of printed sintering paste in electronic assemblies manufacturing. High-speed 3D camera head can capture thin sintering paste layers with precision, while integrated algorithms enable evaluation of sintered paste printing in addition to accurate and rapid measurement of height,...

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