Sonics Inc

Communication Systems & Equipment

On-Chip Network enhances SoC design based on physical synthesis.

Expanding on interleaved multi-channel technology (IMT), SonicsGN® 3.0 includes layout optimization features for design flows based on physical synthesis as well as placeÂ- and route tools. SoC designers can eliminate multi-channel DRAM access bottlenecks with IMT and reduce layout tool iterations with flexible user control of hierarchical RTL partitioning and re-timing stage...

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Electrical Equipment & Systems

Sonics is COOL and HOT at DAC!

MILPITAS, Calif. - Sonics, Inc., the world's foremost supplier of on-chip network (NoC) technologies and services, is participating in the Design Automation Conference (DAC) 2015. The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. Sonics will be showing its cool new ICE-Grain™ Power Architecture and participating...

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Software

Power Management Sub-System offers fine-grain partitioning.

Comprised of configurable hardware IP blocks, embedded control software, and integrated design tool environment, ICE-Grain™ (Instant Control of Energy) Power Architecture automatesÂ- grain connection and management tasks for SoC design teams creating energy-sensitive applications. SoC designers can partition chips into fine grains, which enables accelerated and precise power...

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Communication Systems & Equipment

On-Chip Network improves memory subsystem support and QoS.

SonicsGN™ v2.2 on-chip network IP improves support for memory subsystems and promotes performance with bandwidth allocation across multiple SoC flows. Incorporated memory subsystem and non-blocking concurrency technologies enable support for DDR4 and LPDDR4 memories for both compute and communication traffic on multi-core SoCs. Features fully support multi-threading capabilities of OCP...

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Software

Development Environment eases semiconductor IP integration.

With SonicsStudio®, users canÂ- address integration challenges of complex SoC designs that include multiple processor and IP cores. SonicsStudio Director GUI enables users to seamlessly interact with tools for SystemC and logic simulation, performance analysis, dynamic and static verification, logic synthesis, and power partitioning. Starting from schematic view, SonicsStudio...

Read More »
Communication Systems & Equipment

On-Chip Network enhances SoC design based on physical synthesis.

Expanding on interleaved multi-channel technology (IMT), SonicsGN® 3.0 includes layout optimization features for design flows based on physical synthesis as well as placeÂ- and route tools. SoC designers can eliminate multi-channel DRAM access bottlenecks with IMT and reduce layout tool iterations with flexible user control of hierarchical RTL partitioning and re-timing stage...

Read More »
Electrical Equipment & Systems

Sonics is COOL and HOT at DAC!

MILPITAS, Calif. - Sonics, Inc., the world's foremost supplier of on-chip network (NoC) technologies and services, is participating in the Design Automation Conference (DAC) 2015. The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. Sonics will be showing its cool new ICE-Grain™ Power Architecture and participating...

Read More »
Software

Power Management Sub-System offers fine-grain partitioning.

Comprised of configurable hardware IP blocks, embedded control software, and integrated design tool environment, ICE-Grain™ (Instant Control of Energy) Power Architecture automatesÂ- grain connection and management tasks for SoC design teams creating energy-sensitive applications. SoC designers can partition chips into fine grains, which enables accelerated and precise power...

Read More »
Communication Systems & Equipment

On-Chip Network improves memory subsystem support and QoS.

SonicsGN™ v2.2 on-chip network IP improves support for memory subsystems and promotes performance with bandwidth allocation across multiple SoC flows. Incorporated memory subsystem and non-blocking concurrency technologies enable support for DDR4 and LPDDR4 memories for both compute and communication traffic on multi-core SoCs. Features fully support multi-threading capabilities of OCP...

Read More »
Software

Development Environment eases semiconductor IP integration.

With SonicsStudio®, users canÂ- address integration challenges of complex SoC designs that include multiple processor and IP cores. SonicsStudio Director GUI enables users to seamlessly interact with tools for SystemC and logic simulation, performance analysis, dynamic and static verification, logic synthesis, and power partitioning. Starting from schematic view, SonicsStudio...

Read More »

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