Akrometrix, Llc
Atlanta, GA 30345
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Convection Reflow Emulation is offered for warpage metrology.
ATLANTA, GA – Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology. The CRE6 is an optional module to the Akrometrix AXP shadow moiré system that allows a user...
Read More »Convection Reflow Emulation is offered for warpage metrology.
ATLANTA, GA- РAkrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology. The CRE6 is an optional module to the Akrometrix AXP shadow moir̩ system that allows a...
Read More »Warpage and Strain Measurement Systems support DIC module.
ATLANTA, GA – Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC is the industry standard for strain (CTE) measurements and Akrometrix's unique dual...
Read More »Warpage and Strain Measurement Systems support DIC module.
ATLANTA, GA- – Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC is the industry standard for strain (CTE) measurements and Akrometrix's unique dual...
Read More »Akrometrix Announces Automated Die Attach Tilt Metrology
ATLANTA, GA – Akrometrix LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moire or DFP systems (AXPs) can be upgraded with the new feature. As die, components or...
Read More »Akrometrix Announces Automated Die Attach Tilt Metrology
ATLANTA, GA- – Akrometrix LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moire or DFP systems (AXPs) can be upgraded with the new feature. As die, components or...
Read More »Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech ATLANTA, GA - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of...
Read More »Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech ATLANTA, GA- - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of...
Read More »PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos
ATLANTA, GA - Akrometrix LLC, the leader in elevated temperature surface characterization, is pleased to announce that its representative PAC Global will exhibit at the SMTA Houston Dallas Expo Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC...
Read More »PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos
ATLANTA, GA - Akrometrix LLC, the leader in elevated temperature surface characterization, is pleased to announce that its representative PAC Global will exhibit at the SMTA Houston Dallas Expo Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC...
Read More »Convection Reflow Emulation is offered for warpage metrology.
ATLANTA, GA – Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology. The CRE6 is an optional module to the Akrometrix AXP shadow moiré system that allows a user...
Read More »Convection Reflow Emulation is offered for warpage metrology.
ATLANTA, GA- РAkrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology. The CRE6 is an optional module to the Akrometrix AXP shadow moir̩ system that allows a...
Read More »Warpage and Strain Measurement Systems support DIC module.
ATLANTA, GA – Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC is the industry standard for strain (CTE) measurements and Akrometrix's unique dual...
Read More »Warpage and Strain Measurement Systems support DIC module.
ATLANTA, GA- – Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC is the industry standard for strain (CTE) measurements and Akrometrix's unique dual...
Read More »Akrometrix Announces Automated Die Attach Tilt Metrology
ATLANTA, GA – Akrometrix LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moire or DFP systems (AXPs) can be upgraded with the new feature. As die, components or...
Read More »Akrometrix Announces Automated Die Attach Tilt Metrology
ATLANTA, GA- – Akrometrix LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moire or DFP systems (AXPs) can be upgraded with the new feature. As die, components or...
Read More »Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech ATLANTA, GA - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of...
Read More »Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech ATLANTA, GA- - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of...
Read More »PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos
ATLANTA, GA - Akrometrix LLC, the leader in elevated temperature surface characterization, is pleased to announce that its representative PAC Global will exhibit at the SMTA Houston Dallas Expo Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC...
Read More »PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos
ATLANTA, GA - Akrometrix LLC, the leader in elevated temperature surface characterization, is pleased to announce that its representative PAC Global will exhibit at the SMTA Houston Dallas Expo Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC...
Read More »