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Electrically Conductive Adhesive is used with tin-terminated components.
ABLESTIK ICP-3535M1 is 1-component, pre-mixed electrically conductive adhesive (ECA) that provides low and stable contact resistance when used with 100% tin-terminated components, avoiding need for noble metals such as palladium silver, silver and gold. ECA provide low temperature processability, streamlined manufacturing techniques, low stress assemblies, and regulatory-compliant lead-free...
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Electrically Conductive Adhesive is used with tin-terminated components.
ABLESTIK ICP-3535M1 is 1-component, pre-mixed electrically conductive adhesive (ECA) that provides low and stable contact resistance when used with 100% tin-terminated components, avoiding need for noble metals such as palladium silver, silver and gold. ECA provide low temperature processability, streamlined manufacturing techniques, low stress assemblies, and regulatory-compliant lead-free...
Read More »
Sprayable Ceramic Coating features reusable cartridge dispenser.
Packaged in 90 mL reusable dual-cartridge dispenser, Loctite-® Nordbak® 7255(TM) protects metal surfaces on industrial equipment from wear, abrasion, and corrosion. Two-part, solvent-free, thixotropic epoxy creates smooth, low-friction surfaces and may be used in overhead applications. Suitable for large surfaces and complex or intricate areas, coating can protect tank linings, mixing...
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Sprayable Ceramic Coating features reusable cartridge dispenser.
Packaged in 90 mL reusable dual-cartridge dispenser, LoctiteÃ-® Nordbakî 7255(TM) protects metal surfaces on industrial equipment from wear, abrasion, and corrosion. Two-part, solvent-free, thixotropic epoxy creates smooth, low-friction surfaces and may be used in overhead applications. Suitable for large surfaces and complex or intricate areas, coating can protect tank linings, mixing...
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New Electronic Materials to be Debuted at Productronica 2011 in Munich
Henkel solutions address miniaturization, sustainability and cost-efficiency in modern electronics As the functionality of modern electronics products has increased exponentially in tandem with decreasing dimensions, the demands on performance and reliability of electronic materials have reached an unprecedented level. Today's electronic materials - spanning nearly all market sectors - must...
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New Electronic Materials to be Debuted at Productronica 2011 in Munich
Henkel solutions address miniaturization, sustainability and cost-efficiency in modern electronics As the functionality of modern electronics products has increased exponentially in tandem with decreasing dimensions, the demands on performance and reliability of electronic materials have reached an unprecedented level. Today's electronic materials - spanning nearly all market sectors - must...
Read More »
Polyurethane Adhesive suits wind blades and turbine assemblies.
IWES Test on ENERCON Blade Shows Long-Term Load and Fatigue Strength Rocky Hill, Conn. -- Henkel has introduced a new high-performance polyurethane adhesive that prevents crack propagation on wind blades and delivers excellent long-term structural integrity on turbine assemblies. The first ever Germanischer Lloyd (GL)-approved polyurethane adhesive, Macroplast® UK 1340(TM) cures rapidly at room...
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Polyurethane Adhesive suits wind blades and turbine assemblies.
IWES Test on ENERCON Blade Shows Long-Term Load and Fatigue Strength Rocky Hill, Conn. -- Henkel has introduced a new high-performance polyurethane adhesive that prevents crack propagation on wind blades and delivers excellent long-term structural integrity on turbine assemblies. The first ever Germanischer Lloyd (GL)-approved polyurethane adhesive, Macroplast-® UK 1340(TM) cures rapidly at room...
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Water-Debondable Epoxy facilitates solar silicon wafer slicing.
Providing optimal bond strength to both silicon and glass and metal mounting substrates used during ingot sawing process, Loctite-® 3382(TM) protects against wafer breakage. Two-part epoxy adhesive breaks down on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during wafer cleaning process. Homogenous and stable, Loctite® 3382(TM) sets...
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Water-Debondable Epoxy facilitates solar silicon wafer slicing.
Providing optimal bond strength to both silicon and glass and metal mounting substrates used during ingot sawing process, LoctiteÃ-® 3382(TM) protects against wafer breakage. Two-part epoxy adhesive breaks down on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during wafer cleaning process. Homogenous and stable, Loctiteî...
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