Ferrotec (USA) Corporation

Computer Hardware & Peripherals

Electron Beam Metallization System suits 100 and 150 mm wafers.

Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...

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Computer Hardware & Peripherals

Electron Beam Metallization System ensures uniformity.

Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping...

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Electronic Components & Devices

Ferrotec Updates Line-up of Peltier Coolers for Thermal Cycling

Ferrotec Brings Increased Reliability to Thermal Cycling System Manufacturers with New TMC-Series Extended Life Thermoelectric Modules from SCTB NORD HANNOVER, Germany, Oct. 9 / -- Biotechnica Hall 9, Stand G75 -- Ferrotec Corporation, a global supplier of materials, components, precision systems, and a worldwide leader in thermoelectric cooling solutions, today announced that it has updated its...

Read More »
Computer Hardware & Peripherals

Electron Beam Metallization System suits 100 and 150 mm wafers.

Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...

Read More »
Computer Hardware & Peripherals

Electron Beam Metallization System ensures uniformity.

Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping...

Read More »
Electronic Components & Devices

Ferrotec Updates Line-up of Peltier Coolers for Thermal Cycling

Ferrotec Brings Increased Reliability to Thermal Cycling System Manufacturers with New TMC-Series Extended Life Thermoelectric Modules from SCTB NORD HANNOVER, Germany, Oct. 9 / -- Biotechnica Hall 9, Stand G75 -- Ferrotec Corporation, a global supplier of materials, components, precision systems, and a worldwide leader in thermoelectric cooling solutions, today announced that it has updated its...

Read More »

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