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Machinery & Machining Tools, Material Handling & Storage

Fluid Jetting System suits semiconductor packaging applications.

Apr 27, 2012

Based on 1-piece Genius(TM) Jet Cartridge that can be removed without tools, NexJet(TM) System includes precision software control of jetting process, enabling use with low- and high-viscosity fluids. Cartridge has built-in memory that stores usage data such as number of cycles and cartridge type. Accommodating 3, 5, 10, and 30 cc as well as 2.5 and 6 oz reservoirs, system handles range of fluids... Read More

Material Handling & Storage, Paints & Coatings

Film Coater provides 99% fluid transfer efficiency.

May 06, 2011

Available in circulating and non-circulating versions with single valve design, Nordson ASYMTEK Select Coat® SC-280 applies conformal coating material to circuit boards in controlled, uniform film rather than atomized spray, minimizing overspray, masking, and rework. System handles viscosities of less than 100 cps and delivers coating thicknesses from 0.5-8 mils for solvent-based materials.... Read More

Material Handling & Storage

Jet Dispensing System aids manufacturing of side-view LEDs.

Mar 07, 2011

Designed to jet 0.1-0.2 mm dots through windows as small as 0.4 mm into LED cavities, Spectrum(TM) S-920N automatically maintains consistent shot weight with software-managed dispense parameters. Closed-loop dispensing eliminates need for constant operator adjustments. Non-contact fluid dispensing system is suited for manufacturing side-view LEDs, which are used to illuminate displays in devices... Read More

Material Handling & Storage

Stainless Steel Dispenser is certified for cleanroom use.

Sep 02, 2010

Intended for microelectronics manufacturing in Class 100 cleanrooms, Model S-920N-C features stainless steel enclosure with passivated finish. System can be configured with single or dual lanes and up to 6 heat stations with dual lane configuration. Electrical cables are enclosed in cleanroom-certified jacket that minimizes particulation and outgassing. To avoid particle emissions into cleanroom,... Read More

Machinery & Machining Tools, Material Handling & Storage

Inline Flux Jetting System provides edge definition of 0.5-1 mm.

Jul 13, 2010

In conjunction with DJ-2200 DispenseJet® valve with coaxial air technology, Spectrum® S-930N Series enables thin flux coatings as low as 5 microns. Selective flux jetting minimizes flux residue and overspray, while Fluidmove® for Windows® XP software controls amount of flux jetted to accommodate flip chips of varying bump heights. With small footprint of 23.6 x 52.0 in., fully enclosed,... Read More

Machinery & Machining Tools, Material Handling & Storage, Packaging Products & Equipment

Fluid Dispensing System offers dual simultaneous jetting.

Mar 22, 2010

Suited for CSP underfill and LED silicone encapsulation, Spectrum S-920N Series uses 2 DispenseJet® valves to jet fluid, minimizing dispensing time. Dual simultaneous jetting, in conjunction with Calibrated Process Jetting Plus technology, ensures that flow rates for both DispenseJets deliver same mass per part for uniform deposition. Systems automatically compensate for fluid viscosity changes... Read More

Material Handling & Storage

Jetting Technology minimizes process variability.

Nov 09, 2009

Using Fluidmove® for Windows® XP software, integral electro-pneumatic regulators, and precision weigh scale, CPJ+ automatically compensates for fluid viscosity changes over time as well as batch-to-batch variations. At programmed intervals, dispenser measures weight per dot and adjusts each jet to maintain constant mass per part. CPJ+ ensures consistent flow rates for applications such as... Read More

Material Handling & Storage

Material Handling System loads/unloads wide variety of parts.

Oct 20, 2009

Configurable for inline or same-side load and unload operations, MH-900 Series supports both single and dual-lane conveyors and handles variety of parts from very thin strips to large boats and carriers. Programmable transport speed and carrier staging maximize units/hr while multiple carrier sensors, active pinch wheels, and thin strip guides ensure safe handling. Elevator and shuttle operate... Read More

Material Handling & Storage, Packaging Products & Equipment

Dispensing Systems hurdle liquid electrolyte challenges.

Apr 24, 2009

DispenseJet® systems overcome challenges such as material drying, clogging, and difficulty in creating patterns that occur when trying to dispense electrolyte materials in their liquid form. Suited for use in micro-fuel cells and other electro-chemical applications, products deliver precise control of thousands of individual droplets via Mass Flow Control (MFC) feature. Integrated balance scale... Read More

Material Handling & Storage, Packaging Products & Equipment

Non-Contact Dispensers suit electronics manufacturers.

Nov 24, 2008

DispenseJet® DJ-100 series is comprised of 3 models specified for low-, standard-, and high-viscosity fluids. Jet on the Fly(TM) technology enables precision dispensing of fluids in dots, lines, and patterns over part or substrate, and piezo electric technology eliminates need for Z-axis movement. Also included, Calibrated Process Jetting(TM) utilizes weigh scale feedback to maintain consistent... Read More

Material Handling & Storage

Dispenser is suited for jetting abrasive fluids.

Jul 31, 2008

Featuring jetting-on-the-fly, dot on dot, and Calibrated Process Jetting(TM) technologies, DispenseJet® DJ-9500 is designed for high-speed underfill applications and jetting silicone for LEDs. Fluid jetting valve controls fluid break-off at nozzle tip for clean and consistent dots and line patterns on substrate. Enhanced temperature controls maintain fluid at consistent viscosity for high... Read More

Material Handling & Storage

Automated Dispensing System has dual-shuttle configuration.

May 27, 2008

Offered with Fluidmove® for Windows® XP (FmXP) application software and ESD glass, Spectrum(TM) S-822 allows parallel processing on 2 shuttle stages for continuous dispensing and helps increase productivity in processes such as CSP underfill. It features Jet-on-the-Fly, Calibrated Process Jetting, Dynamic Dispense Control, and Mass Flow Control. System performs with range of fluids, processes,... Read More

Fluid & Gas Flow Equipment, Material Handling & Storage

Slide Valve dispenses repeatable solder paste dots and lines.

Apr 30, 2008

Achieving 20,000 dots/hr on 1 mm grid, SV-100 Slider Valve delivers dots of less than 300 µm for solder paste types 4, 5, and 6 and dots as small as 125 µm in diameter with type 6 paste. Used for dispensing into small and hard to reach places, it is compatible with lead-free and no-clean solder pastes as well as silver-filled epoxies. Valve is suited for solder paste dots for passive components... Read More

Material Handling & Storage

Fluid Dispenser offers calibrated process jetting.

Jan 18, 2008

Dispensing at flow rates up to 500 mg/sec and shot rates up to 200 dots/sec, Spectrum S-920 Series dispensing platforms can be configured with single or dual lanes, and 1, 2, or 3 heat stations. Units measure 23.6 x 52.0, 33.5 x 52.0, and 43.3 x 52.0 in. with single, 2, and 3 heat stations, respectively. Platforms can be upgraded in field and configured to meet specific dispensing requirements,... Read More

Conformal Coating Platform has closed-loop process controls.

Jan 10, 2008

With 750 mm/sec speed and 1 g peak acceleration, Select Coat® SL-940E accommodates product sizes up to 500 mm. Welded 1-piece structure of frame enables high acceleration and velocity with up to 2.5 kg payload, while rotary encoders ensure positional accuracy for precise coating operations. Conformal coating system has dispensing area of 19.7 x 18.7 in. which enables flexibility during... Read More

Ink Jetting Dispensers eliminate need for masking.

Sep 19, 2007

Pulse spray coating and discrete dot dispensing technologies are suited for applying catalyst inks onto membranes in electrode assemblies of proton exchange and direct methanol fuel cells. While pulse spray coating technology provides quick (20 ips) large area coverage with uniform film thicknesses, DispenseJet technology is used for specific patterns with high edge definition and exact film... Read More

Material Handling & Storage

Dispensing System suits Class 100 cleanrooms.

Jan 17, 2007

Featuring stainless steel enclosure, Axiom X-1000 Series is designed for applications that are sensitive to contamination by sub-micron sized particles, such as wafer-level packaging. Configured to minimize particle generation, all pneumatic valves are exhausted to base of machine, and connection to house vacuum avoids downstream particle emissions entering cleanroom. Mass Flow Control and... Read More

Material Handling & Storage

Coating Jet eliminates need for masking.

Oct 23, 2006

Using PWM control and needle design with non-contact jetting action, SC-400 PreciseCoat(TM) applies acrylics, silicones, urethanes, and 1-850 cps water-based materials to selective areas. Small volumes and precision control of coating material enable line widths of 1.2 mm while film thicknesses of 15 µm are achievable when using solvent-based materials. Unit offers optional dual-valve... Read More

Machinery & Machining Tools, Material Handling & Storage

Dispensing System features dual lane capability.

Aug 28, 2006

Enabling underfill flow-out in one lane while jetting underfill in opposite lane, Axiom X-1022 Dual-Lane dispensing system optimizes throughput in multi-pass underfill applications. SMEMA compliant, programmable, flat-belt conveyors are independently controlled, allowing different sized parts to be processed in each lane. System is configured with 6 stations of contact or impingement heating to... Read More

Material Handling & Storage

Dispenser jets pre-applied solder ball reinforcement.

Jul 30, 2004

DispenseJet® DJ-9000 utilizes method for applying solder ball reinforcement material to semiconductor packages that eliminates need for dispensing secondary underfill in PCB assembly. Unit shoots fluid stream of underfill adhesive as small as 100 µm wide between balls on CSPs and other BGA packages during semiconductor packaging process. Cured reinforcement material relieves stress at... Read More

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