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CEVA, Inc.

Software

Application Optimization Toolset is entirely C-based.

Application Optimizer, part of CEVA-Toolbox(TM) SDE, lets application developers build software for CEVA DSPs purely in C-Level. This eliminates hand-written assembly coding and accelerates design cycle for SoCs. Solution creates optimized build configurations by simulating and profiling multiple application scenarios based on application and exact system conditions. Other features include DSP...

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Computer Hardware & Peripherals

Programmable DSP Core targets wireless communications.

Incorporating up to 4 Vector Units into CEVA-X framework to deliver up to 200 billion operations/sec, CEVA-XC(TM) supports full transceiver processing for multiple air interfaces in software, including 4G mobile standards; LTE class 5 and WiMAX II, as well as 3G, 3.5G, Wi-Fi, GPS, and MobileTV. Core integrates Power Scaling Unit, supporting multiple clock and voltage domains and low power...

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Computer Hardware & Peripherals

Single-Core DSP suits HD audio applications.

Based on 32-bit CEVA-TeakLite-III(TM) DSP core running at speeds up to 550 MHz, CEVA-HD-Audio(TM) includes configurable memory subsystem, set of audio codecs that support 2-7.1 channels with various bit rates, and software development kit for integration into SoC. CEVA-HD-Audio meets requirements of products ranging from entry-level, memory-constrained devices such as digital TVs and...

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Architectural & Civil Engineering Products

Subsystem Platforms promote DSP integration.

While CEVA XS-1100A is optimized for wireless baseband applications, and CEVA XS-1200A is aimed at multimedia and other applications requiring high-performance signal processing, both configurable hardware platforms offer verified approach for integrating CEVA-X DSP cores into complex system on chips (SoCs). Use of industry-standard system buses enables designers to add their own hardware blocks...

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Computer Hardware & Peripherals

CEVA Extends Its CDMA Market Reach with VIA Telecom's Latest Design Wins

Dopod, Inventec Applicances and Cal-Comp Electronics join growing list of handset ODMs and OEMs deploying CEVA-powered, VIA Telecom CDMA chipsets BARCELONA, Spain, Feb. 11 -- Mobile World Congress 2008 -- CEVA, Inc.[(NASDAQ:CEVA); ], the leading licensor of silicon intellectual property platform solutions and DSP cores, today announced the CEVA-TeakLite(TM) DSP Core is at the heart of VIA...

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Computer Hardware & Peripherals

Spreadtrum Ships Thirty Millionth CEVA-Powered Baseband Chipset

CEVA's DSPs power Spreadtrum's SC6600, SC6800 and SC8800 families of wireless chipsets BARCELONA, Spain, Feb. 11 / / -- Mobile World Congress 2008 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile handsets, consumer electronics and storage applications and Spreadtrum Communications, Inc. (NASDAQ:SPRD), one of...

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Computer Hardware & Peripherals

Mobile Multimedia Platform supports any video standard.

Enabled by CEVA-X DSP core and CEVA-XS subsystem, MM2000(TM) supports any existing and future video codec via firmware upgrade to existing silicon. This provides in-software, programmable approach to mobile multimedia. Designed around single DSP core without requiring any accelerators or dedicated engines for video processing, solution supports video standards for RealVideo-® 8/9/10 and VC-1 as...

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Communication Systems & Equipment

CEVA Leads the Way at Mobile World Congress 2008 with Industry Leading Portfolio of Mobile Intellectual Property

More than forty Customers, Partners and OEMs to demonstrate CEVA-powered solutions for Wireless Baseband, Mobile Multimedia, Portable Audio, Voice-over-IP and Bluetooth at the show SAN JOSE, Calif., Jan. 24 - CEVA, Inc. (NASDAQ:CEVA), the leading licensor of silicon intellectual property platform solutions and DSP cores, today announced that it will showcase its leadership in Mobile intellectual...

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Controls & Controllers

Renesas Technology Deploys CEVA Bluetooth IP in High Volume Consumer and Automotive Chipsets

SAN JOSE, Calif., Nov. 19 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced that Renesas Technology Corp. has commenced high-volume shipments of their chipsets with integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has...

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Controls & Controllers

CEVA and ROHM Partner for Bluetooth 2.0+EDR Reference Design Platform

SAN JOSE, Calif., Nov. 19 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced a collaboration with ROHM Co., Ltd. (Kyoto, Japan) to offer a complete reference design platform for Bluetooth 2.0+EDR. Addressing the burgeoning Bluetooth market, the...

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