S-Bond Technologies, LLC

Materials

S-Bond Technologies Takes License to EWI Sonicsolder

S-Bond to Sell EWI's Lead-free, Fluxless Solder (Lansdale, PA) - S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI's patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum,...

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Explosives, Armaments, and Weaponry

S-Bond Joining Materials and Services for the Manufacture of Sputtering Targets

S-Bond® active solders enable the joining of dissimilar metals and ceramics to each other and to other metals. S-Bond's patented alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the metallic and/or ceramic surfaces prior to bonding. S-Bond filler metal alloys produce reliable joints with...

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S-Bond Technologies Provides Solutions for Joining Sensors and Sensor Housings
Mechanical Components and Assemblies

S-Bond Technologies Provides Solutions for Joining Sensors and Sensor Housings

Many sensors need to be enclosed for protection. S-Bond joints are hermetic and can bond a wide range of dissimilar metals, ceramics, and glass that are typically used in enclosures or housings. Sensors and Sensor housings require metal to metal and/or metal to ceramic bonds that make electrical connections or hermetic seals. S-Bond active solders and related processes are being used to make a...

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Materials

S-Bond Technologies Takes License to EWI Sonicsolder

S-Bond to Sell EWI's Lead-free, Fluxless Solder (Lansdale, PA) - S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI's patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum,...

Read More »
Explosives, Armaments, and Weaponry

S-Bond Joining Materials and Services for the Manufacture of Sputtering Targets

S-Bond® active solders enable the joining of dissimilar metals and ceramics to each other and to other metals. S-Bond's patented alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the metallic and/or ceramic surfaces prior to bonding. S-Bond filler metal alloys produce reliable joints with...

Read More »
S-Bond Technologies Provides Solutions for Joining Sensors and Sensor Housings
Mechanical Components and Assemblies

S-Bond Technologies Provides Solutions for Joining Sensors and Sensor Housings

Many sensors need to be enclosed for protection. S-Bond joints are hermetic and can bond a wide range of dissimilar metals, ceramics, and glass that are typically used in enclosures or housings. Sensors and Sensor housings require metal to metal and/or metal to ceramic bonds that make electrical connections or hermetic seals. S-Bond active solders and related processes are being used to make a...

Read More »
Company News

S-Bond Technologies Produces Their New Website to Introduce New Capabilities in the Bonding Services & Active Solder Industry

S-Bond Technologies in Lansdale, PA has developed a new website to fully explain our products & services. At the core of all SBT products and bonding services is its Active Solder Technology. S-Bond alloys are conventional solders that are made active when modified by the addition of key elements which create a more chemically reactive solder that forms a bond with surfaces, including surfaces...

Read More »
Company News

S-Bond Technologies Produces Their New Website to Introduce New Capabilities in the Bonding Services & Active Solder Industry

S-Bond Technologies in Lansdale, PA has developed a new website to fully explain our products & services. At the core of all SBT products and bonding services is its Active Solder Technology. S-Bond alloys are conventional solders that are made active when modified by the addition of key elements which create a more chemically reactive solder that forms a bond with surfaces, including surfaces...

Read More »

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