TE Connectivity
Berwyn, PA 19312
New LVDT Position Sensors Withstands High Pressure up to 10,000 psi
Enables system and feedback controls with high accuracy and fast response time. Available in signal conditioning, extensive configuration flexibility for size and stroke length, pressure range, mounting preference, output and electrical connections. Suited for use in industrial and ICT construction and agriculture equipment, boom lifts, material handling and mining vehicle applications.
Read More »
New LEAVYSEAL Connectors Help Vehicles Operate Safe, Clean and Smart
Made of flame-retardant UL 94 V-0 material as well as withstands harsh environment. Available with high temperature range of -40 to 140 degrees C and high level of IP protection IP67, IP69K with cover. Features a lever lock system for strong, sealed mating and in-line, flange or PCB mount options as well as arrangements from 15 to 120 positions and mixed terminal sizes in one housing.
Read More »
New STRADA Whisper Cable Receptacles Optimizes Signal Integrity at High Frequencies
Allow engineers to start designing for up to 112G PAM-4 data rates in servers, switches and routers. Incorporate STRADA Whisper connectors on one end and connect to a variety of other high-speed solutions on the other, including backplane, mid-board or (I/O) products. Compatible with variety of backplane, mid-board and I/O products including SFP, QSFP, QSFP-DD, silver and OSFP connectors .
Read More »
New Unsealed Connectors Include Reduced Mating Force Below 75 N
AMP MCP 18P monoblock connector uses AMP MCP 2.8 contact system. Fits into bulkhead cut-outs and the required secondary locking feature helps to keep contacts aligned. Ideal for bulkhead, in-cabin and fuse-and-relay-box applications.
Read More »
New HF-20T and HV-20T Terminators Produce 178 kN of Crimp Force
Fine adjust feature allows for fast, more precise crimp height adjustment. Provides sophisticated controls, traceability system as well as ethernet and USB ports. Ability to process wires up to 120 sq.mm.
Read More »
New MULTI-BEAM Plus Power Connectors from TE Connectivity Comes with Low-Profile Dimensions
Provides high current per power contact at maximum of 140A/contact or 100A/contact per four adjacent contacts. Features high-density tail to carry higher current and are suitable for data center and telecom equipment, industrial automation devices, and power systems. Manufactured with thicker material and supports flexibility in configuration and PCB design.
Read More »
New PCIe Gen 4 Card Edge Connectors Meet PCI-SIG CEM Specification 4.0
Available in x1, x4, x8 and x16 (36/64/98/164 positions) configurations and are backward-compatible with footprint and mating interface. Features 1.00mm pitch of PCI Express signaling designs and support speeds of 16 Gbps (PCIe Gen 4), 8.0 Gbps (PCIe Gen 3), 5.0 Gbps (PCIe Gen 2) and 2.5 Gbps (PCIe Gen 1). Comes with three plating options (30u'',15u'' and gold flash), two...
Read More »
New STRADA Whisper R Connectors from TE Connectivity Comes with 92 Ohm Impedance
Ensures low crosstalk noise and enables the migration path from 56G PAM-4 to 112G PAM-4. Available in 4-pair configurations and 92 Ohm impedance for backplane applications and supports 85 Ohm and 100 Ohm impedance system requirements. Applications include data centers, servers, storage devices and wireless infrastructure.
Read More »
New LGA 4189 Socket from TE Connectivity is Designed for Higher Performance and System Scaling
Supports four or eight multi-processor system architectures. Provides fast turnaround time for prototypes at the earliest stages of the design process. Applications include servers, storage systems, data center equipment and high-performance computing systems.
Read More »
New Snap-Cap DEUTSCH DT Connectors are IP67 and IP68 Rated
Improved seal performance, interface compatibility with predecessor parts, and secure seal that is fully serviceable. Comes with snap-in-place rear caps that provide wire seal protection in standard and shrink tube adapted configurations. Ideal for inline wire-to-wire, wire-to-device, and wire-to-board connectivity.
Read More »