DuPont

Leading Photovoltaic Module Manufacturers Adopt DuPont(TM) Solamet® Metallizations for Higher Efficiency Solar Cells and Modules
Adhesives & Sealants

Leading Photovoltaic Module Manufacturers Adopt DuPont(TM) Solamet® Metallizations for Higher Efficiency Solar Cells and Modules

Sunways & Heckert Solar Latest to Qualify PV17x Series for Frontside Silver BRISTOL, U.K. - DuPont Microcircuit Materials (MCM) recently added two key accounts, Sunways AG and Heckert Solar AG, to a growing list of leading photovoltaic manufacturers using DuPont(TM) Solamet® PV17x photovoltaic metallization pastes to produce higher efficiency solar cells and modules. Since their introduction in...

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Metallization Paste supports solar cell processing.
Materials

Metallization Paste supports solar cell processing.

Designed for rotary screen printing, DuPont(TM) Solamet-® PV414 enables high-speed roll to roll processing of thin and flexible solar cells and modules. Formula is engineered to ensure optimal printability and line resolution while maintaining adhesion to Transparent Conductive Oxide layer, low contact resistance, and maximum conductivity.

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DuPont(TM) Solamet® Photovoltaic Metallizations Enable Canadian Solar's High-Efficiency Metal Wrap Through Solar Cells
Adhesives & Sealants

DuPont(TM) Solamet® Photovoltaic Metallizations Enable Canadian Solar's High-Efficiency Metal Wrap Through Solar Cells

New Canadian Solar ELPS(TM) Solar Cell Reaching 19.5 Percent Conversion Efficiency MUNICH,- DuPont(TM) Solamet® photovoltaic metallization pastes from DuPont Microcircuit Materials continue to advance critical solar cell technologies to enable more cost-effective, high-efficiency solar cell and module designs. The latest collaboration with Canadian Solar Inc., one of the world's largest solar...

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DuPont Microcircuit Materials Launches New Generation Frontside Silver Photovoltaic Metallizations
Adhesives & Sealants

DuPont Microcircuit Materials Launches New Generation Frontside Silver Photovoltaic Metallizations

Solamet-® PV17x Series Helps Set New Standard for Solar Cell Efficiency RESEARCH TRIANGLE PARK, N.C., - DuPont Microcircuit Materials (MCM) is introducing a new series of frontside silver photovoltaic metallization pastes using new and novel chemistry formulated to deliver advanced efficiency and adhesion for solar cells. DuPont(TM) Solamet-® PV17x series photovoltaic metallizations also will...

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Adhesives & Sealants

Photovoltaic Metallization Pastes target local BSF designs.

Outperforming conventional aluminum compositions, DuPont(TM) Solamet-® PV36x Pastes deliver up to 0.8% greater conversion efficiency for solar cells when used in Local Back Surface Field designs. Products maximize adhesion and minimize voids, with controlled local alloying combined with high lateral conductivity. PV361 is designed for laser fired local contact formation, while PV362 is optimized...

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PV Metallization Paste increases MWT solar cell efficacy.
Materials

PV Metallization Paste increases MWT solar cell efficacy.

Employed as paste and p-contact metallization for back side tabbing interconnects, Solamet-® PV701 is formulated to maximize efficiency for Metal Wrap Through (MWT) silicon solar cell designs. Composition enables manufacture of back contact cell designs delivering up to 0.4% greater solar cell conversion efficiency. paste exhibits properties that optimize electrical contact to front side silver...

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Photovoltaic Metallization Pastes boost solar cell efficiency.
Adhesives & Sealants

Photovoltaic Metallization Pastes boost solar cell efficiency.

DuPont(TM) Solamet-® PV16x series photovoltaic metallizations are frontside metallization pastes that can raise efficiency of crystalline silicon solar cells by up to 0.4%. Products are capable of contacting shallow emitters of up to 85 W/square as well as deep emitters. Featuring low-contact resistance, they are available in options suitable for various printing requirements, including fine...

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Screen Printed Ink Material for PCBs facilitates electroplating.
Packaging Products & Equipment

Screen Printed Ink Material for PCBs facilitates electroplating.

Removable conductive silver plating link, CB500, is typically applied by screen or stencil printing via manual/automated equipment. Composition compliments traditional PCB manufacturing processes by enabling use of additive processing to rigid and flexible substrates. In addition to eliminating need for copper bus bars and other plating connections, product reduces or eliminates need for front,...

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Adhesives & Sealants

Photovoltaic Metallization Paste is lead free.

Targeted at PV cell and module manufacturers, environmentally friendly DuPont(TM) Solamet-® PV173 photovoltaic metallization paste for crystalline silicon solar cells provide high adhesion, and enable advanced fine line designs down to 80 microns. It is compatible with lead free Solamet-® PV502 and PV505 tab silver pastes, and PV38x aluminum pastes.

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