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Thermal & Heating Equipment

Clean Process Oven for semiconductor industry.

LCC2-14 has chamber volume of 14 cu ft, large enough to handle thermal processing of 200 and 300 mm semiconductor wafers. It has stainless steel interior with continuously welded seams to protect work chamber from contamination. Oven is SEMI S2 and CE compliant, can be configured for multiple voltages and 50/60 Hz, and has UL and C-UL listed open control panel with lockable disconnect switch....

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Photoresist Oven allows automated handling of 300 mm wafers.
HVAC

Photoresist Oven allows automated handling of 300 mm wafers.

Company's 300mm Automated Photoresist Bake Oven offers 2 Front-Opening Unified Pod (FOUP) loadport stations with atmospheric Class 1 clean room-compatible robots and optically based Class 1 laser cassette mapping sensors. Its 2 heat treatment chambers hold 25 wafers each during photoresist bake cycle. Temperature uniformity is +/-1.5 deg C at 95 deg C operating temperature (150 deg C max). It...

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Sterilization Oven minimizes floor space requirements.
Thermal & Heating Equipment

Sterilization Oven minimizes floor space requirements.

SD Sterilization and Depyrogenation Oven is 50 in. wide and 96 in. high, with chamber capacity of 30 cu ft. It is available in 3 configurations: ultra performance, with cycle time of 1 1/2 hr; high performance, with 2 1/2 hr cycle time; and standard performance, with cycle time of 6 hr. Recirculation filter system prevents mechanical stress on HEPA filter. Control system minimizes filter supply...

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Conveyorized Oven has NEMA-12 enclosure.
Thermal & Heating Equipment

Conveyorized Oven has NEMA-12 enclosure.

CE-compliant Small Conveyorized Curing/Drying Oven features HEPA-filtered, recirculated airflow for operation at Class 100 conditions and better. Corrosion-resistant, stainless-steel conveyor and Teflon®-coated guide rails minimize particulate generation. Oven features variable-speed conveyor and is available with operating temperatures up to 500°F. It handles small, dense loads with...

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Oven offers atmosphere-controlled tool storage.
Thermal & Heating Equipment

Oven offers atmosphere-controlled tool storage.

Tool Conditioning Oven is designed to keep semiconductor parts and tooling clean, dry, and ready for installation. It is configured to hold either 200 or 300 mm tools. Horizontal airflow keeps temperature uniform up to 95°C. HEPA filter delivers better than Class 100 conditions, and nitrogen atmosphere provides dry environment. Teflon® padding, standard on 300mm units, eliminates...

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Truck-In/Walk-In Ovens include networking software.
Thermal & Heating Equipment

Truck-In/Walk-In Ovens include networking software.

TA Truck-In/Walk-In Ovens are designed to provide process reliability and consistency in aging, drying, curing, bonding, finish baking and heat-treating applications. Ovens operate at up to 650°F and employ uniform, horizontal recirculating airflow systems. UL-listed open industrial control panel can be accessed from front. TA ovens feature programmable, microprocessor-based Protocol...

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Clean Process Oven is used for production environments.
Thermal & Heating Equipment

Clean Process Oven is used for production environments.

Stackable LCC1-51 is programmable with microprocessor-based Protocol Plus controller and configured for 220/240 volts and 50/60 Hz. Non-corrosive, 5.1 cu ft stainless steel interior oven chamber handles 200 and 300 mm wafer processing applications. Continuously welded insulation side seams protect work chamber and product from contamination. Recirculated airflow is HEPA filtered, which is...

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