Mentor Graphics Corp.
Wilsonville, OR 97070
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Mentor Sets New Software Scaling Benchmark for Semiconductor Design Workload on Microsoft Azure
Wilsonville, Ore., June 3, 2019 /PRNewswire/ -- Mentor, a Siemens business, today announced that the Calibre™ platform Physical Verification Suite has achieved a new standard for electronic design automation (EDA) software scalability on the Microsoft Azure cloud platform. The benchmarks were achieved during scaling experiments on 5nm test chips and a full reticle-sized 7nm production design...
Read More »Mentor and AMD Verify Massive Radeon Instinct Vega20 IC Design on AMD EPYC in ~10 hours with Ecosystem Partners Microsoft Azure and TSMC
Wilsonville, Ore., May 30, 2019 /PRNewswire/ -- AMD engineers executed a physical verification pass of the Radeon Instinct™ Vega20 – its largest 7nm chip design – in ~10 hours using the TSMC-certified Calibre™ nmDRC software platform from Mentor, a Siemens business, running on the Microsoft Azure cloud platform using HB-series virtual machines, powered by AMD EPYC™ processors. Using...
Read More »
Mentor Releases Catapult and Calibre Software Kits with Artificial Intelligence and Machine Learning
The Catapult HLS AI Toolkit offers an object detection reference design and IP that helps designers to implement neural network accelerator engines. Calibre mlOPC product predict the OPC output to within single nanometer accuracy using intelligent feature extraction and machine algorithms. Catapult features setup to build an AI/ML demonstrator platform with live feed on FPGA prototyping board.
Read More »
Testing Software Now Equipped With Technology to Capture Defects
The Tessent TestKompress software from Mentor is now available with ATPG, automotive-grade automatic test pattern generation, technology. The technology enables customers to capture defects with its suite of default models and test pattern generation applications. The ATPG allows for ISO 26262 compliance with its ability to capture defects.
Read More »
Software Now Equipped With Technology to Eliminate Communication Barriers
The Tessent SiliconInsight from Mentor is now available with ATE-Connect technology. The ATE-Connect provides an interface to eliminate communication barriers between tester-specific software and design-for-test platforms. It accelerates the debug of IJTAG devices and speeds up product ramps.
Read More »
Mentor Announces New Manufacturing Process with Optimized Flow and Fill Automation
Mentor has announced new compete solutions including its Calibre nmPlatform™, Analog FastSPICE (AFS)™ Platform, Eldo Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) manufacturing processes. Their automated fill flow ensures analog devices are able to leverage full performance. The Mentor...
Read More »
Mentor Extends Solutions to Support TSMC 5nm FinFET and 7nm FinFET Plus Process Technologies
WILSONVILLE, Ore., Oct. 3, 2018 /PRNewswire/ -- Mentor, a Siemens business, today announced certification for TSMC's 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platforms. In addition, Mentor continues to expand features of both the Xpedition™ Package Designer and Xpedition Substrate...
Read More »Xpedition Vibration and Acceleration Solution offers fast and accurate virtual prototyping.
Suitable for military, aerospace, automotive and industrial markets, Xpedition Xpedition Vibration and Acceleration Solution comes with intuitive pre-processor and wizard. Reducing field failure rates, unit can detect components on threshold failure. Capable of analyzing pin-level Von-Mises stress and deformation for failure probability and safety factors, product features automated simulation...
Read More »Tessent DefectSim measures circuit's defect tolerance.
Operated with Mentor's Eldo and Questa ADMS circuit simulators, Tessent DefectSim measures defect coverage of any test applied to mixed-signal or analog circuit. Measuring user defined, opens, shorts, and extreme variation defects in schematic netlist, Defectsim uses statistical method called likelihood-weighted random sampling to minimize number of defects and can also measure circuit's...
Read More »FloMASTER Thermo-Fluid System provides waste heat recovery system.
Including Model-Based Design (MBD), Simulation-Based Characterization (SBC) for component modeling, FloMASTER™ 1D thermo-fluid system enables simulation of components of up to 60 arms, with the automation launcher, system allows models to be driven from automatically generated excel spreadsheet and allows user to harness the power of system simulation. Device is used for vehicle's complex...
Read More »Mentor Sets New Software Scaling Benchmark for Semiconductor Design Workload on Microsoft Azure
Wilsonville, Ore., June 3, 2019 /PRNewswire/ -- Mentor, a Siemens business, today announced that the Calibre™ platform Physical Verification Suite has achieved a new standard for electronic design automation (EDA) software scalability on the Microsoft Azure cloud platform. The benchmarks were achieved during scaling experiments on 5nm test chips and a full reticle-sized 7nm production design...
Read More »Mentor and AMD Verify Massive Radeon Instinct Vega20 IC Design on AMD EPYC in ~10 hours with Ecosystem Partners Microsoft Azure and TSMC
Wilsonville, Ore., May 30, 2019 /PRNewswire/ -- AMD engineers executed a physical verification pass of the Radeon Instinct™ Vega20 – its largest 7nm chip design – in ~10 hours using the TSMC-certified Calibre™ nmDRC software platform from Mentor, a Siemens business, running on the Microsoft Azure cloud platform using HB-series virtual machines, powered by AMD EPYC™ processors. Using...
Read More »
Mentor Releases Catapult and Calibre Software Kits with Artificial Intelligence and Machine Learning
The Catapult HLS AI Toolkit offers an object detection reference design and IP that helps designers to implement neural network accelerator engines. Calibre mlOPC product predict the OPC output to within single nanometer accuracy using intelligent feature extraction and machine algorithms. Catapult features setup to build an AI/ML demonstrator platform with live feed on FPGA prototyping board.
Read More »
Testing Software Now Equipped With Technology to Capture Defects
The Tessent TestKompress software from Mentor is now available with ATPG, automotive-grade automatic test pattern generation, technology. The technology enables customers to capture defects with its suite of default models and test pattern generation applications. The ATPG allows for ISO 26262 compliance with its ability to capture defects.
Read More »
Software Now Equipped With Technology to Eliminate Communication Barriers
The Tessent SiliconInsight from Mentor is now available with ATE-Connect technology. The ATE-Connect provides an interface to eliminate communication barriers between tester-specific software and design-for-test platforms. It accelerates the debug of IJTAG devices and speeds up product ramps.
Read More »
Mentor Announces New Manufacturing Process with Optimized Flow and Fill Automation
Mentor has announced new compete solutions including its Calibre nmPlatform™, Analog FastSPICE (AFS)™ Platform, Eldo Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) manufacturing processes. Their automated fill flow ensures analog devices are able to leverage full performance. The Mentor...
Read More »
Mentor Extends Solutions to Support TSMC 5nm FinFET and 7nm FinFET Plus Process Technologies
WILSONVILLE, Ore., Oct. 3, 2018 /PRNewswire/ -- Mentor, a Siemens business, today announced certification for TSMC's 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platforms. In addition, Mentor continues to expand features of both the Xpedition™ Package Designer and Xpedition Substrate...
Read More »Mentor Xpedition and PADS Professional Design Flow Achieve ISO 26262 Functional Safety Compliance
- The Mentor Xpedition™ and PADS® Professional printed circuit design (PCB) flow meet ISO 26262 requirements for automotive electronics design functional safety - Compliance includes the HyperLynx™ and Valor™ NPI technologies that can be applied to either the Xpedition or PADS Professional flow WILSONVILLE, Ore., Sept. 17, 2018 /PRNewswire/ -- Mentor, a Siemens business, today announced...
Read More »Xpedition Vibration and Acceleration Solution offers fast and accurate virtual prototyping.
Suitable for military, aerospace, automotive and industrial markets, Xpedition Xpedition Vibration and Acceleration Solution comes with intuitive pre-processor and wizard. Reducing field failure rates, unit can detect components on threshold failure. Capable of analyzing pin-level Von-Mises stress and deformation for failure probability and safety factors, product features automated simulation...
Read More »Tessent DefectSim measures circuit's defect tolerance.
Operated with Mentor's Eldo and Questa ADMS circuit simulators, Tessent DefectSim measures defect coverage of any test applied to mixed-signal or analog circuit. Measuring user defined, opens, shorts, and extreme variation defects in schematic netlist, Defectsim uses statistical method called likelihood-weighted random sampling to minimize number of defects and can also measure circuit's...
Read More »
