FEI Co.
Hillsboro, OR 97124
Automated Mineralogy Analyzer offers turn-key operation.
Extending mineral liberation analysis, MLA EXpress™- provides graphic, mineralogical, and textural information from ore needed to make decisions in diverse mining operations. Bench-top unit. Automated mineralogy involves scanning electron microscope (SEM) and X-ray spectrometer, used to obtain microscopic view of structure and composition of ore. There are multiple analytical modes...
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Automated Mineralogy Analyzer offers turn-key operation.
Extending mineral liberation analysis, MLA EXpress™Ã- provides graphic, mineralogical, and textural information from ore needed to make decisions in diverse mining operations. Bench-top unit. Automated mineralogy involves scanning electron microscope (SEM) and X-ray spectrometer,àusedàto obtain microscopic view of structure and composition of ore. There are multiple analytical...
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Surface Inspection System offer analytical and imaging modes.
Versa 3D™ DualBeam™ is available with UniColore (UC) monochromated electron source, which improves fine surface detail imaging capabilities at low accelerating voltages without compromising analytical performance at high voltages and beam currents. By decreasing energy spread among beam electrons, UC source- reduces chromatic aberration and permits beam to be focused into smaller spot....
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Surface Inspection System offer analytical and imaging modes.
Versa 3D™ DualBeam™ is available with UniColore (UC) monochromated electron source, which improves fine surface detail imaging capabilities at low accelerating voltages without compromising analytical performance at high voltages and beam currents. By decreasing energy spread among beam electrons, UC sourceÃ- reduces chromatic aberration and permits beam to be focused intoÃÂ smaller...
Read More »FEI Announces New NanoManipulator and Gas Injector Solutions for Industry-Leading DualBeam Systems
New accessories enable improved yield of ultrathin sample preparation and enhance flexibility and control of gas-assisted milling and deposition processes Hillsboro, Ore. - FEI (NASDAQ: FEIC), a leading instrumentation company providing imaging and analysis systems for research and industry, today announced significant performance enhancements for its DualBeam(TM) systems. The new EasyLift(TM)...
Read More »FEI Announces New NanoManipulator and Gas Injector Solutions for Industry-Leading DualBeam Systems
New accessories enable improved yield of ultrathin sample preparation and enhance flexibility and control of gas-assisted milling and deposition processes Hillsboro, Ore. - FEI (NASDAQ: FEIC), a leading instrumentation company providing imaging and analysis systems for research and industry, today announced significant performance enhancements for its DualBeam(TM) systems. The new EasyLift(TM)...
Read More »
University of Manchester Installs New Ultra-Powerful Microscope from FEI
The first of its kind in the UK, the Titan G2 80-200 S/TEM is capable of imaging the microstructure of materials at the atomic-scale. Manchester, UK and Hillsboro, Ore.- The University of Manchester and FEI (NASDAQ: FEIC) are pleased to announce the installation of one of the world's most powerful high-resolution microscopes-the Titan(TM) G2 80-200 scanning transmission electron microscope...
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University of Manchester Installs New Ultra-Powerful Microscope from FEI
The first of its kind in the UK, the Titan G2 80-200 S/TEM is capable of imaging the microstructure of materials at the atomic-scale. Manchester, UK and Hillsboro, Ore.- The University of Manchester and FEI (NASDAQ: FEIC) are pleased to announce the installation of one of the world's most powerful high-resolution microscopes-the Titan(TM) G2 80-200 scanning transmission electron microscope...
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FIB/SEM Systems support TEM sample preparation.
Respectively accommodating up to 100 mm samples and full 300 mm wafers, Helios NanoLab(TM) 450HP and 1200HP DualBeam(TM) systems meet requirements for semiconductor process development at 28 nm device geometry node and below. Systems can prepare 15 nm thick samples with less than 2 nm damage layer in 90 min. QuickFlip grid holders facilitate inverted sample preparation, and iFast(TM) automation...
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FIB/SEM Systems support TEM sample preparation.
Respectively accommodating up to 100 mm samples and full 300 mm wafers, Helios NanoLab(TM) 450HP and 1200HP DualBeam(TM) systems meet requirements for semiconductor process development at 28 nm device geometry node and below. Systems can prepare 15 nm thick samples with less than 2 nm damage layer in 90 min. QuickFlip grid holders facilitate inverted sample preparation, and iFast(TM) automation...
Read More »