Stratedge Corporation
Suite C
Santee, CA 92071
New Packaging and Assembly Services Includes Ribbon Bonding Capability
Provides automatic and manual wedge wire bonding. Full packaging as well as chip-on-tab where StratEdge provides the heat spreading tabs. Specializes in RF and microwave devices, including GaN and gallium arsenide.
Read More »New Packaging and Assembly Services Includes Ribbon Bonding Capability
Provides automatic and manual wedge wire bonding. Full packaging as well as chip-on-tab where StratEdge provides the heat spreading tabs. Specializes in RF and microwave devices, including GaN and gallium arsenide.
Read More »New Semiconductor Packages Operate from DC to 63+ GHz
Dissipates heat from compound semiconductor devices such as gallium nitride gallium arsenide and silicon carbide. Enables compound semiconductor devices to meet critical requirements of markets such as telecom, mixed signal and MEMS.
Read More »New Semiconductor Packages Operate from DC to 63+ GHz
Dissipates heat from compound semiconductor devices such as gallium nitride gallium arsenide and silicon carbide. Enables compound semiconductor devices to meet critical requirements of markets such as telecom, mixed signal and MEMS.
Read More »New Thermally-efficient Packages Operate Efficiently at Frequencies as High as 63+ GHz
Enable compound semiconductor devices to meet the critical requirements of markets. Offers complete automated assembly services including gold-tin solder die attach. Ideal for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs).
Read More »New Thermally-efficient Packages Operate Efficiently at Frequencies as High as 63+ GHz
Enable compound semiconductor devices to meet the critical requirements of markets. Offers complete automated assembly services including gold-tin solder die attach. Ideal for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs).
Read More »StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
San Diego, CA - 1 March 2018 - StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort...
Read More »StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
San Diego, CA - 1 March 2018 - StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort...
Read More »Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...
Read More »Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...
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