Ansys, Inc.

Software

Strategic Partnership Between ANSYS and Florida International University Provides Valuable Electromagnetic Simulation Tools to Engineering Students

Working with industry technology in college prepares students for life outside the classroom PITTSBURGH and MIAMIÂ- – Students in Florida International University's (FIU) College of Engineering & Computing will be one step ahead of their future employment competition thanks to a new partnership with ANSYS (NASDAQ: ANSS) that provides its robust electromagnetics simulation technology in the...

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Software

ANSYS and GosNIIAS Partner to Increase Safety in Russian Aerospace Industry

Team developing new streamlined platform for integrated modular avionics systems PITTSBURGH - The safety of Russian aircraft will benefit from a new research partnership between ANSYS (NASDAQ: ANSS) and GosNIIAS, a Russian state scientific research institute that supports aviation systems development. With no current process in place for compliance with worldwide aerospace standards in Russia,...

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Software

ANSYS and US Army Partner to Increase Efficiency of Simulating Government Defense Technology

Team develops flexible platform to host complex government code PITTSBURGH - The US Army's Armament Research, Development and Engineering Center (ARDEC) can now increase the access to and scalability of complex government simulation code that is often used to design and analyze defense-related technology thanks to the customizability of the ANSYS (NASDAQ: ANSS) Application Customization Toolkit....

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Software

Electromagnetic Simulation Software offers streamlined process.

ANSYS® HFSS™ v14.5 service pack 2 providesÂ- 3D modeler interface, 3D electrical layout interface, as well as planar Method of Moments (MoM) solver for accurate and streamlined design workflow. While 3D electrical layout interface enables efficient integration with EDA design flows as well as direct import of layout geometry from ODB++ compatible databases, planar MoM solver...

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Software

ANSYS Takes Home DesignCon Award for Second Year in a Row

ANSYS® HFSS(TM) for ECAD with Cadence wins modeling and simulation tools category PITTSBURGH - For the second year in a row, ANSYS (NASDAQ: ANSS) has earned a prestigious award celebrating for offering an innovative, high-quality tool that simplifies the electronic product design process. DesignCon 2013's DesignVision Award for the Modeling and Simulation Tools category was presented to...

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Software

ANSYS and Subsidiary Apache Receive TSMC 20 nm Phase I Certification

PITTSBURGH - ANSYS (NASDAQ: ANSS) and subsidiary Apache Design announced today that their RedHawk(TM) and Totem(TM) products achieved TSMC Phase I 20 nm certification. TSMC certified the tools for 20 nm design rule manuals (DRMs) and SPICE models. Early adopters are using the flows and tools while close collaboration continues between TSMC, ANSYS, Apache and designers. RedHawk and Totem provide...

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Software

SoC Power Design Software supports sub-20 nm process technology.

Providing full-chip dynamic power and reliability simulation, RedHawk(TM)-3DX manages power consumption and optimizes power delivery efficiency of advanced IC designs. Event- and state-propagation technologies with vector-based and VectorLess(TM) modes utilize functional stimulus and statistical probability to determine switching scenario of design. RedHawk-3DX advances electromigration modeling...

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Computer Hardware & Peripherals

ANSYS Users Can Achieve Faster, Higher-Fidelity Simulation Results with New Intel Xeon E5-2600 Processor Family

Innovative Processor Delivered via Collaboration with ANSYS PITTSBURGH - ANSYS® (NASDAQ: ANSS) software users can realize groundbreaking gains in speed, fidelity and productivity with the recent release of the Intel® Xeon® processor E5-2600, realized in collaboration with ANSYS high-performance computing (HPC) experts. By accelerating throughput, the new Intel (NASDAQ: INTC)...

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Software

EDA Software facilitates predictable power budgeting.

As offering to Apache's PowerArtist(TM)-XP, RTL Power Model bridges power gap from register-transfer-language (RTL) design to physical implementation to optimize range for power-sensitive applications such as ultra-low-power (ULP) electronics. IC power behavior is predicted at RTL level with consideration for how design is physically implemented, enabling early chip power delivery network and IC...

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Software

ANSYS and VISTAGY Integrate ANSYS Composite PrepPost and FiberSIM

Bi-directional Integrated Solution Provides Cutting-Edge Design and Analysis Workflow for Composites PITTSBURGH, Pa. and WALTHAM, Mass. - ANSYS, Inc. (NASDAQ: ANSS), a pioneer of engineering simulation, and VISTAGY, Inc., a leading provider of industry-specific engineering software and services, have taken a major step in closing the loop between composites design and analysis by integrating...

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