Advanced Thermal Solutions, Inc.

Heat Sinks feature push pin mounting.
Electronic Components & Devices

Heat Sinks feature push pin mounting.

With integral push pin mounting system, maxiFLOW(TM) heat sinks offer accelerated, safe attachment onto BGAs and other hot components. Each heat sink comes with one pair of plastic or brass push pins that run through opposite corners of heat sinks and mount securely into 3.00 mm holes in PCB as laid out in industry standard patterns. While integral spring on each pin provides ~2 lb of retention...

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Thermal Analysis System records temp, velocity, and pressure.
Controls & Controllers

Thermal Analysis System records temp, velocity, and pressure.

Used to profile heat sinks, components, and PCBs, iQ-200(TM) simultaneously measures temperatures for solid materials and surrounding air in addition to tracking air velocity and air pressure at multiple points. Laboratory instrument accommodates inputs from up to 12 J-type thermocouples, 16 air temperature/velocity sensors, and 4 DP sensors. USB interface allows PC-based data management,...

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Test Station enables precise air flow and temperature testing.
Food Processing & Preparation

Test Station enables precise air flow and temperature testing.

Comprised of benchtop laboratory-grade wind tunnel, automated controller, and multiple sensors, iTHERM-100(TM) Test Station precisely manages velocity and direction of airflow within test environment. System can be used for categorizing airflow and measuring pressure drop across heat sinks and over other PCB components. With attached thermocouple, iTHERM-100 is also suited for individual thermal...

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Heat Sinks perform in low airflow velocity conditions.
Electronic Components & Devices

Heat Sinks perform in low airflow velocity conditions.

Featuring spread fin array that maximizes surface area for effective convection cooling, maxiFLOW(TM) heat sinks cool ICs and other hot components in narrow packaging and low airflow velocity conditions. Standard heights are as low as 9.5 mm, and extruded aluminum fabrication minimizes thermal resistance from base to fins. Pre-assembled with ATS maxiGRIP(TM) mounting hardware, sinks meet...

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Electronic Components & Devices

ATS- Digi-Key Partnership Provides Full-Range of BGA Cooling Solutions

Norwood, MA, July 17, 2007 - Advanced Thermal Solutions, Inc. (ATS) has partnered with Digi-Key, the global electronic components distributor, to offer over 380 heat sinks for cooling BGAs and other hot-running semiconductor devices. The heat sinks are available for immediate delivery when purchased through Digi-Key's Web site and printed catalogs. Design engineers can obtain individual ATS sinks...

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Heat Sinks cool 17 x 17 mm BGA packages.
Electronic Components & Devices

Heat Sinks cool 17 x 17 mm BGA packages.

Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and...

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Benchtop Wind Tunnel enables thermal and airflow testing.
Food Processing & Preparation

Benchtop Wind Tunnel enables thermal and airflow testing.

Able to operate on any axis, BWT-104(TM) is designed for thermal characterization of components, circuit boards, and cooling devices. Polynomial shape and internal flow management system includes honeycombs and screens to break up turbulence, providing uniform, homogeneous flow up to 1,200 fpm as generated by 3 independently selectable 24 Vdc fans. While aluminum and Plexiglas® construction...

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Electronic Components & Devices

Heat Sinks help cool linear LED lighting products.

Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape...

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Heat Sink cools communications processors.
Electronic Components & Devices

Heat Sink cools communications processors.

Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7°C/W at its base in air velocity of 200 fpm. Made from black anodized aluminum, heat sink features 14 integral linear fins, 0.5 mm thick, to maximize cooling surfaces in local airflow. Unit...

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Electronic Components & Devices

ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing

NORWOOD, Mass, October 31, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP(TM), the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing. Shock and...

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