J.P. Sercel Associates, Inc.
Manchester, NH 03102
Share:
Laser Wafer Scribers offer frontside/backside capabilities.
All JPSA laser wafer scribing systems support Dual Side Scribe (DSS) processing capability, which lets operators perform frontside and backside scribing for LED, sapphire, GaAs, Si, and metal wafers. Backside camera technology promotes accuracy with accelerated alignment times for DSS systems. In addition to facilitating conversion from frontside to backside scribing, technology supports...
Read More »
Materials Processing Unit suits micromachining applications.
Developed for repairing flat panel displays, micro circuits, and wafers, Model IX-70 ChromAblate(TM) on-target inspection and short deletion system can be configured with IR, visible, or UV wavelengths to process materials from metals to polymers. Adjustable attenuator allows precise control of laser power. IX-70 incorporates co-axial CCD camera with adjustable zoom lens for alignment and...
Read More »
Motorized Rotary Stage suits wafer processing.
Providing non-contact operation, Z-theta Stage is not affected by torque variations because there is no gear interface. Unit provides 360Ã-
Read More »
JPSA Announces Shipments of Automated Cassette-to-Cassette Wafer Processing Systems
Hollis, New Hampshire, USA -- J P Sercel Associates has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These fully automated systems can process more than eighty (80) wafers per hour, and are ideally suited for a wide variety of materials such as:...
Read More »
Wafer Dicing System processes wafers up to 6 in. dia.
ChromaDice(TM) IX-300 UV Laser Wafer Processing System features ProtectoLEDÃ-® Technology, which is based on water-soluble protective coating that prevents contamination of wafer during dry-etch process. Utilizing UV-DPSS laser technology at 355 or 266 nm wavelengths, system operates at cut rates up to 150 mm/sec on GaAs wafers, with kerf widths down to 2.5 Ã-µm.
Read More »
Beam Switching Module facilitates UV laser processing.
With no grease or oil in beam delivery design and no organic materials, laser beam switching module enables user to switch entire beam from one path to another. Its 50 x 50 mm clear aperture allows passage of larger-diameter homogenized beam without beam corner clipping. Used with short-wavelength UV excimer beams, including 157, 193, and 248 nm, vacuum UV product offers opportunity to deflect...
Read More »
Optical Chamber can be used with UV excimer beams.
Accommodating various optics mounts and allowing precision adjustments in X, Y, Z, and theta dimensions, optical chamber allows users to modify, shape, or expand UV excimer laser beam through beam-shaping telescopes, beam homogenizers, imaging lenses, condensing lenses, and other optics. With 50 x 50 mm aperture, chamber allows passage of homogenized beam without corner clipping. Vacuum capable...
Read More »
Laser System scribes 4 in. LED wafers.
Tolerant of wafer warp and bow, ChromaDice(TM) UV diode-pumped solid-state (DPSS) laser system produces well-defined chips with consistently narrow cuts as small as 2.5 microns. Accuracy performance is true, unmapped position radius of 2 microns over 100 x 100 mm square area with stage orthogonality of better than 2 arc sec. Within 60 x 42 in. footprint, self-contained machine incorporates...
Read More »
Beam Delivery System suits UV excimer lasers.
Microtech MBD2 accommodates large-format beam delivery system modules such as turning mirror and beam splitter, both of which feature 50 x 50 mm clear aperture that allows passage of larger diameter homogenized beam without beam corner clipping. Designed for 24/7 production in industrial environments, MBD2 is vibration dampened and structurally sound. It is built on aluminum base and can be used...
Read More »
Turning Mirror Mount is designed for UV laser processing.
Able to hold sub-micrometer accuracy, industrial-grade vacuum UV product turns 157, 193, or 248 nm UV excimer laser beam at 90Ã-
Read More »JPSA Hosting: 'Advances in Laser MicroMachining' Technology Seminar
Manchester, New Hampshire, USA - C J. P. Sercel Associates Inc. (JPSA), will be hosting a technology seminar highlighting laser processing techniques applicable to the solar, LED, semiconductor, microelectronic manufacturing and biomedical industries. This technology seminar, held at Courtyard Marriott, Raleigh Durham Airport on March 1st will be the first in the 2011 series of seminars offered...
Read More »JPSA Completes Building Expansion
Manchester, New Hampshire, USA - JP Sercel Associates Inc., (JPSA) announced that construction for expanding their laser manufacturing facility is complete. This expansion is an additional 24,000 sq ft, giving JPSA a total of over 58,000 sq ft of work space. The addition provides JPSA the ability to meet customers' increasing demand for their LED, Solar, and excimer laser micromachining systems....
Read More »JPSA Succeeds in Invalidating QMC's Korean Scribing and Lift-Off (LLO) Patents
Manchester, NH USA - JP Sercel Associates, Inc. (JPSA) a leading manufacturer of laser micromachining systems for LED production, announced that the Korean Intellectual Property Tribunal ruled in favor of claimant JPSA, invalidating two of QMC's Korean patents dealing with scribing and LLO. The invalidated Patents are No. 724540, Laser Beam transmission system and method of the same and lift-off...
Read More »JPSA Announces Partnership with AGK-World in Europe and Asia.
Manchester, New Hampshire, USA - Manchester, New Hampshire, USA - JP Sercel Associates Inc., (JPSA) announced that it has appointed AGK-World as their Business Development Consultant to enhance JPSA Laser's presence in the UK, Ireland and Northern Europe. AGK-World was founded by Alex (AG) Kader, a Business Development veteran with over 28 years in the semiconductor industry. Mr. Kader has...
Read More »JPSA Announces Partnership with BlueON in Korea
04/30/2009 -- Manchester, New Hampshire, USA - J. P. Sercel Associates Inc. (JPSA) announces that it has signed an agreement with BlueON to represent, sell, and service JPSA laser systems and technology products in Korea. BlueON is a fully integrated sales and service company for LED's and solar industrial equipment and technology. In making the announcement, Charles E. Cuneo, President of JPSA,...
Read More »
Laser Wafer Scribers offer frontside/backside capabilities.
All JPSA laser wafer scribing systems support Dual Side Scribe (DSS) processing capability, which lets operators perform frontside and backside scribing for LED, sapphire, GaAs, Si, and metal wafers. Backside camera technology promotes accuracy with accelerated alignment times for DSS systems. In addition to facilitating conversion from frontside to backside scribing, technology supports...
Read More »Cristian Porneala Joins JPSA as Applications Engineer
Manchester, New Hampshire, USA - J. P. Sercel Associates announces the appointment of Cristian Porneala, Ph.D. as an Applications Engineer in JPSA's Applications Lab. Cristian received his doctorate degree from Southern Methodist University in Mechanical Engineering with a concentration area in Laser Applications and Laser Material Interactions. His research focused on thermal and fluid flow...
Read More »JPSA Completes Move to New Manchester, NH Facility
Manchester, New Hampshire, USA - J P Sercel Associates (JPSA) has completed its move to a new, larger manufacturing and administrative facility in Manchester, New Hampshire, a few miles north of its previous Nashua-area location. The new address is 220 Hackett Hill Road, Manchester, NH, 03102 USA; Tel. 603.518.3200, fax 603.518.3298 JPSA is the world's leading designer, supplier, and systems...
Read More »
Materials Processing Unit suits micromachining applications.
Developed for repairing flat panel displays, micro circuits, and wafers, Model IX-70 ChromAblate(TM) on-target inspection and short deletion system can be configured with IR, visible, or UV wavelengths to process materials from metals to polymers. Adjustable attenuator allows precise control of laser power. IX-70 incorporates co-axial CCD camera with adjustable zoom lens for alignment and...
Read More »
Motorized Rotary Stage suits wafer processing.
Providing non-contact operation, Z-theta Stage is not affected by torque variations because there is no gear interface. Unit provides 360Ã-
Read More »