Fujipoly America
Carteret, NJ 07008
Silicone-Based Material improves semiconductor performance.
Available as 1.0 mm thick sheet, Sarcon-® XR-Pe delivers thermal conductivity of 11 W/m-
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Easy Handling Thermal Compound
Carteret, NJ — SARCON-® SPG-30A from Fujipoly is an ideal thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material's high viscosity and ultra-low compression force are ideal for applications with...
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Thin Film exhibits high thermal conductivity.
When placed between heat source, such as semiconductor and heatsink, 0.3 mm thick Sarcon-® 30-YR-a Thin Film effectively eliminates near-microscopic air gaps that exist between components. V-0 rated product, available in 36 or 85 mm width rolls or die-cut to requirements, has -60 to +180-
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Electronics Connector has 500 contact points per inch.
Suited for densely packed boards, 2005 Zebra-® Connector features construction with alternating layers of conductive carbon and non-conductive silicone as thin as 0.0004 in. This- allows for 500 conductive layers per inch. Product is commonly used to connect LCDs directly to circuit board with contact spacing as close as .010 in. Current carrying capacity is- 50 mA per .040 x .040 in.- pad,...
Read More »Thermal Interface Pads offer low thermal resistance.
SARCON-® SF-Nd Phase Change Thermal Interface Pads have thermal conductivity of 2.0 W/m-K and thermal resistance of only 0.015-
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Thermal Gap Filler Pads offer elasticity and consistency.
SARCON-® XR-e and XR-j offer thermal conductivity of 11 and 14 watt/m-K, respectively, which produces thermal resistance of 0.11 to 0.14 in-²/W for XR-e and 0.09 to 0.12 in-²/W for XR-j. Both pads offer flame retardant specifications satisfactory to UL94 V-0 class. Made from silicone compound, flexible pads conform to various design considerations and multiple component heights. They adhere to...
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