Fujipoly America

900 Milik St.
Carteret, NJ 07008

A Better Connection

A Better Connection Carteret, NJ - Saturday, February 25, 2017 - The Zebra® 1002 Carbon Connector from Fujipoly® offers electronic device manufacturers an extremely affordable and reliable option for connecting printed circuit boards to a variety of LCD displays. The unique layered construction of this interconnect device includes 240 alternating layers of conductive and non-conductive silicone...

Materials

New Benchmark for Thin Film Performance

Carteret, NJ - Saturday, January 21, 2017- Fujipoly’s SARCON® 30XR-Um Thin Film sets a new standard for performance and compressibility. The putty-like thermal gap filler pad exhibits a thermal conductivity of 17 watt/m-k and a thermal resistance of only 0.02 °Cin2/W. The unique physical properties of this thermal interface material allow it to be compressed quickly using a very low...

Construction Equipment and Supplies

Gold Series 8000C Connector offers less than 25 m

Transferring both data and power between parallel components and circuit boards, Zebra® Gold Series 8000C connector exhibits remarkably low electrical resistance. Wrapped with 166 parallel rows of flat, gold-plated copper wires per inch, unit offers low durometer silicone core construction. With lengths of .200 to 6.00 and heights of .10” to 1.0”, device’s 0.025mm x 0.076mm gold-plated...

Construction Equipment and Supplies

You Have Our Full Support

Carteret, NJ — Fujipoly-® Self-Supporting Sponge Connectors provide engineers with an excellent, low-force option for connecting LCD displays to circuit boards. The physical characteristics of the sponge dramatically reduce bowing of the PCB due to the minimal force required to make full electrical contact. This also makes the connector a great choice for high-vibration environments and...

Materials

Thermal Interface Materials optimize heatsink performance.

Available in thicknesses of 0.2, 0.3, and 0.45 mm, Sarcon-® GAR Thin Films deliver high thermal conductivity of 3.0 W/m-

Materials

Thermal Interface Thin Film improves heatsink cooling performance.

Available to- electronic packaging engineers, Sarcon-® YR-c delivers- thermal conductivity of 4.0 W/m-

Materials

Thermal Interface Material combines soft touch, high performance.

Exhibiting thermal resistance down to 0.08-

Materials

Gap Filler exhibits low thermal resistance.

Available in sheets from 0.3–3.0 mm thick, Sarcon-® GR80A can be die-cut to fit almost any application shape. Silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas while exhibiting very low pressure. When placed between heat source such as semiconductor and nearby heat sink, thermal interface material provides thermal conductivity of...

Construction Equipment and Supplies

Silver Connector supports LCD to PCB connections.

With current carrying capacity up to 300 mA per square .040 in., Series 5002 Silver Zebra-® Connector exhibits contact resistance of less than 500 mΩ. Interconnect device creates redundant electrical contact through design that incorporates 240 alternating layers of silver-filled conductive elastomer and non-conductive silicone material per inch of connector. Precise construction provides...