Ironwood Electronics, Inc

Electrical Equipment & Systems

Spring Pin BGA Socket tests digital camera processors.

Configured to test 13 x 13 mm, 0.65 mm pitch, 293 position, 19 x 19 ball array, CBT-BGA-7005 features contactor with stamped spring pin, 26 g actuation force per ball, and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. Designed with floating guide for precise ball to pin alignment, socket...

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Spring Pin Socket helps test power management devices.
Electrical Equipment & Systems

Spring Pin Socket helps test power management devices.

Model SSK-QFN-7000 includes contactor that is spring pin with offset plunger, which allows 2 spring pins to contact one device lead or pad. Featuring current capacity of 2.8 A at 80°C temperature rise, each contactor has self inductance of 0.97 nH, insertion loss of less than 1 dB at 11.2 GHz, and capacitance 0.58 pF. Kelvin spring pins have 28 g actuation force per ball and cycle life of...

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BGA Package Converter speeds system board development.
Electrical Equipment & Systems

BGA Package Converter speeds system board development.

Model PC-BGA256B/BGA256E-B-01 is designed to receive 23 x 23 mm BGA, 16 x 16 array, 1.27 mm pitch on top and converts 1:1 pin mapping to 17 x 17 mm BGA, 16 x 16 array, 1 mm pitch on bottom, allowing new development system board to be tested with previous version of BGA device. Convertor can also be reversed by removing solder balls from 1 mm pitch side and adding them on 1.27 mm pitch side, and...

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Electrical Equipment & Systems

Elastomer Socket accommodates 0.5 mm pitch, 25-pin WCSP.

Designed for 2.75 x 2.75 mm package size, Model SG-BGA-7188 verifies function of IC in development system. Unit operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss and contact resistance of 20 mW per I/O. Mounted using supplied hardware on target PCB with no soldering, socket incorporates quick insertion method using integrated compression plate. Temperature range is -35 to...

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Electrical Equipment & Systems

BGA Socket provides accessibility for thermal control.

Designed for 13.5 x 8 x 1.2 mm package, Model SG-BGA-7199 supports 0.65 mm pitch 176 ball BGA and operates at bandwidths up to 10 GHz with less than 1 dB insertion loss. Contact resistance is typically 20 mW per I/O. Socket incorporates quick insertion method and has mechanism for attaching thermal stream accessories. Operating from -35 to +100°C, device verifies function of IC in...

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Electrical Equipment & Systems

Device Converter simplifies multilayer PCB prototyping.

Actel device converter - DC-AX2000/RTAX2000S-01 allows users to implement commercial Axcelerator® FG896 package during prototyping, and then switch to equivalent CQ352 package for production. Soldered directly onto SMT QFP pads, product is designed to receive AX2000 Actel Axcelerator® Family FPGAs on top and converts pin mapping to RTAX2000S Actel Radiation-Tolerant FPGAs. Unit...

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QFN Socket survives temperatures from -55 to +155°C.
Electrical Equipment & Systems

QFN Socket survives temperatures from -55 to +155°C.

Addressing performance requirements for 0.4 mm pitch devices, SBT-QFN-4008 is designed to JEDEC STD.MO-220 and features contact design with outside spring and flat etched plungers. Contactor is stamped spring pin with 34 g actuation force per pin and cycle life of 100,000 insertions. Self inductance of contactor is 1 nH, insertion loss is less than 1 dB at 7 GHz, and capacitance is 0.4 pF....

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Xilinx Device Converter allows conversion to upgraded modules.
Electrical Equipment & Systems

Xilinx Device Converter allows conversion to upgraded modules.

With Model DC-QFP/PLCC84-J-01, Xilinx XC95216 160-pin QFP can be used on existing 84-position PLCC SMT lands. Converter is designed to receive XC95216 Xilinx CPLD on top and convert pin mapping to XC95108 Xilinx CPLD. Compatible with both hand soldering and reflow processes, unit consists of footprint and pin out conversion multi-layer PCB with true j-lead adapter for SMT processing. J-leads are...

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Stamped Spring Pin Socket enables UART testing to 5 Mbps @ 1.8 V.
Electrical Equipment & Systems

Stamped Spring Pin Socket enables UART testing to 5 Mbps @ 1.8 V.

Designed for testing 7 x 7 mm QFN packages with 0.5 mm pitch, 48 positions, and center ground pad, CBT-QFN-7002 addresses requirements for testing UART serial to parallel data converter. Contactor consists of stamped spring pin with 26 g actuation force per ball and cycle life of 500,000 insertions; self inductance is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097...

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