Ironwood Electronics, Inc

QFN Socket supports 12 x 12 mm devices with 0.5 mm pitch.
Electrical Equipment & Systems

QFN Socket supports 12 x 12 mm devices with 0.5 mm pitch.

Designed to JEDEC STD, Model SBT-QFN-4015 features contact design with outside spring and flat stamped plungers for burn-in and test applications. Contactor provides current capacity of 4 A, self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, and 0.097 pF capacitance. Operating from -55 to +180°C, socket includes IC guide for precise QFD edge alignment, and swivel lid...

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Thermal Management System facilitates IC characterization.
Controls & Controllers

Thermal Management System facilitates IC characterization.

Using direct thermal contact technology, TSL-ST-01 Thermal Socket Lid and Control System enables temperature control of IC devices during thermal characterization. Chiller supplies liquid to thermal socket lid, while controller monitors lid and supplies necessary electrical input to accurately control temperature. With GUI, users can set temperature, tune system, change and save configuration...

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Electrical Equipment & Systems

Socket accommodates 656-pin, 0.8 mm pitch BGA IC.

Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG...

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IC Socket accommodates 0.4 mm pitch, 56-pin QFN packages.
Electrical Equipment & Systems

IC Socket accommodates 0.4 mm pitch, 56-pin QFN packages.

Designed for 7 x 7 mm package size, Model DG-QFN56B-01 operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. Socket is constructed with shoulder screw, swivel lid, and diamond particle interconnect contactor capable of 100,000 insertions. Mounted on target PCB with no soldering, device operates from -70 to +200°C and dissipates 12 W with lid mounted heat sink and fan....

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Electrical Equipment & Systems

BGA Socket connects all pins with 40 GHz bandwidth.

Used to socket 16 x 16 x 0.8 mm BGA packages on any application board, SM-BGA-9006 operates at bandwidths up to 40 GHz with less than 1 dB insertion loss. It dissipates few watts with compression screw and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with elastomer contactor, socket features shoulder screw and swivel lid that...

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Electrical Equipment & Systems

Elastomer BGA Socket is intended for testing eMMC devices.

Designed for testing 0.5 mm pitch, 14 x 18 mm eMMC BGA device, SG-BGA-7219 connects all pins with 10 GHz bandwidth and operates with less than 1 dB insertion loss. Contact resistance is 20 mohm per I/O (typ), and mounting is accomplished via supplied hardware on target PCB without any soldering. Quick insertion method, using shoulder screws and swivel socket lid, accelerates IC change-out, while...

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Electrical Equipment & Systems

BGA Socket accommodates 1 mm pitch, 1760 pin BGA IC's.

Designed for 42.5 x 42.5 mm package size, Model SG-BGA-6348 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Socket dissipates 35 W with active heat sinking and features contact resistance of 20 mW per pin, 0.01 pF capacitance to ground, and current capacity of 2 A per pin. Mounted on target PCB with no soldering, socket is constructed with screw mounting and has...

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Electrical Equipment & Systems

Elastomer Socket accommodates 10-pin optical DFN package.

Mounted using supplied hardware on target PCB without any soldering, SG-MLF-7059 is designed for 3.5 x 2.1 x 0.65 mm package and operates at bandwidths up to 10 GHz with less than 1 dB insertion loss. Socket connects all pins with 10 GHz bandwidth on all connections, and contact resistance is 20 milliohms/pin. Additional specifications include 0.15 nH pin self inductance, 0.025 nH mutual...

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Electrical Equipment & Systems

Extreme Temperature Test Socket handles 4.5 x 4.5 mm QFN devices.

Designed to test 0.4 mm pitch, 32-lead QFN devices with center ground pad, Model CBT-QFN-7008 features temperature range of -55 to +155°C. Etched spring pin contactor, with cycle life of 500,000 insertions, provides 0.95 nH self inductance, insertion loss of less than 1 dB at 7 GHz, and 0.097 pF capacitance. Current capacity of each contactor is 4.1 A at 60°C temperature rise. In...

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BGA IC Socket is designed for 27 x 27 mm package size.
Electrical Equipment & Systems

BGA IC Socket is designed for 27 x 27 mm package size.

Designed to socket 27 x 27 mm, 1 mm pitch, 616-pin BGA ICs on any PCB, SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket dissipates 4.5 W with passive heat sinking and 40 W with active. Contact resistance is 20 mohms typ per pin, and mounting to target PCB is accomplished without any soldering. Socket is constructed with shoulder screw and swivel lid, which...

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