Ironwood Electronics, Inc
Burnsville, MN 55337
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BGA Socket targets 0.8 mm pitch BGA 194 pin ICs.
Designed for 12 x 12 mm package size, CG-BGA-4010 socket operates at bandwidths up to 6.5 GHz with less than 1 dB of insertion loss. It features clamshell lid with integrated heat sinking mechanism and is mounted on PCB using supplied hardware, with no soldering. Contact resistance and current capacity per pin are 20 mW and 2 A, respectively, while pin self inductance is 0.11 nH and mutual...
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BGA Socket targets 1 mm pitch BGA 1924 pin IC's.
Designed for 45 x 45 mm package size, SG-BGA-6296 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mW/pin. Unit has operating temperature range of -35 to +100°C, and has pin self inductance of 0.11 nH, mutual inductance of 0.028 nH, capacitance to ground of 0.028 pF, and current capacity of 2 A/pin. Socket can handle up to...
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QFN Socket is designed for 0.4 mm pitch QFN 84 pin ICs.
Designed for 10 x 10 mm package size, CG-QFN-7003 socket operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Operating temperature ranges between -35°C to +100°C, self inductance is at 0.11 nH and mutual inductance is at 0.028 nH. Capacitance to ground is 0.028 pF, while current capacity is at 2 A/pin. Unit can dissipate up to several watts without extra heat...
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Spring Pin Socket addresses burn-in and test applications.
Operating from -55 to +180°C, Model SBT-BGA-6505 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 80°C temperature rise. Featuring floating guide for precise ball to pin...
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BGA Socket Adapter accepts Samsung MCP memory device.
Consisting of solder balls on bottom side and round pads on topside, Model SF-BGA199B-B-05 accommodates 0.65 mm pitch, 12 x 16 mm body, 18 x 22 array Samsung MCP KMYFE0C0CM-D300 memory ICs. If target circuit board already exists or mounting holes cannot be drilled into target board, then BGA SMT adapter can be used with Ironwood GHz socket. Constructed with high temperature FR-4, adapter assures...
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Chip Size BGA Adapter suits automotive applications.
Constructed with Torlon 5530 material, SFS-BGA104A-52 allows 0.5 mm pitch, 8 x 8 mm body, and 15 x 15 array BGA devices to be socketed and operate without compromising performance. Giga-snaP(TM) BGA SMT adapter pair consists of SFS-BGA104A-52 female sockets with machined pins and sleeve spring that matches male pin LSS-BGA104A-51. Required force per pin of 40 g facilitates plugging/removal, and...
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Adapter allows prototyping of BGA ICs.
Constructed with gold plated solder-tail machined pins, PA-BGA117C-P-S-01 prototyping adapter interfaces 117 position 0.075 in. pitch BGA SMT land pattern to 0.100 in. center pin grid array. Clam-shell spring pin ZIF socket, SS-BGA117C-01 can be used with adapter for access to address and data lines. Socket operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss, and can handle...
Read More »Chip Size BGA 0.8mm Board-to-Board Connector
Users can connect their 676 pin 0.8mm pitch BGA footprint on mother board to the same footprint on upgraded daughter board using B2B connector with excellent signal integrity BURNSVILLE, MN - July, 2009 - Ironwood Electronics' releases over 100 products for its new board-to-board connector product line. Board-to-board high performance connector consists of two modules (female socket module and...
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Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.
Designed for Burn-in and Test applications, SBT-BGA-7003 is stamped spring pin with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor has self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and temperature range of -55 to +180°C. Socket also features floating guide for precise ball to pin alignment, while current...
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BGA SMT Adapters are available in many different pin counts.
Giga-snaP(TM) BGA SMT adapter pair consists of SF-BGA316C-B-62F female sockets with machined pins epoxy over-molded into assembly that matches male pin LS-BGA316C-61. Soldered to PCB using standard soldering methods without warping, SF-BGA316C-B-62F allows 0.8 mm pitch, 17 x 17 mm body, 20 x 20 array Analog Device ADSP-BF539/ADSP-BF539F ICs to be socketed and operate in demanding automotive...
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