Rogers Corporation

Materials

Rogers Corp. to Introduce RO4450B(TM)-dx Bondply at IEEE MTT- S

High frequency performance and low cost circuit fabrication Show: IEEE MTT-S (International Microwave Symposium) Dates: June 13 - 15, 2006 Venue: Moscone Convention Center San Francisco, CA Booth #: 1441 Rogers, CT, April 7, 2006: Rogers Corporation (NYSE: ROG) will be introducing its new RO4450B(TM)-dx Bondply, a high fill/flow version of the industry standard RO4450B(TM) High Frequency Circuit...

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Foam is suited for dust sealing applications.
Materials

Foam is suited for dust sealing applications.

PORON® Soft Seal foam, a formulation of microcellular urethane, is designed for gap filling within sensitive electronic enclosures such as LCDs in cell phones or integrated media players. Product conformability allows LCD panel gaskets to adjust to varying contours and gap thicknesses, while still providing tight seal under harsh conditions. PET supported foam has density of 6.5 pcf and is...

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Cellular Urethanes exhibit little compression set.

PORON® Series 4790-92 products are cast directly onto 0.002 in. polyester film for stability. Finished products exhibit less than 2% compression set, low outgassing, and low fogging. Slow rebound materials retain properties at constant temperatures up to 158°F and can survive intermittent temperatures up to 250°F. Available in 12 and 15 lb densities, they can fill gaps, provide...

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Materials

Laminate suits multi-layer, thin-film PCB construction.

R/flex® 3850 double-clad, Liquid Crystalline Polymer-based laminate offers low dielectric constant of 2.9 for controlled impedance, combined with high dimensional stability for dense fine-line applications. Dissipation factor is 0.002 at 10 GHz and moisture absorption is 0.04% for applications where high-frequency/high-speed circuits are designed. R/flex 3850 is produced in range of copper...

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Materials

Polymer Materials suit electronic applications.

ZYVEX(TM) liquid crystalline polymer circuit materials are designed for flexible circuit applications. RO4350B(R) - R04450B(R) high frequency material system offers 130 deg C Relative Thermal Index (RTI) and UL 94V-0 rating. RT/duroid(R) and TMM(R) Circuit Materials perform over frequencies from 3 to 90 GHz. REFLECTON(TM) white epoxy molding materials withstand high-solder temperatures while...

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Materials

Specialty Foams provide gasketing and sealing.

PORON(R) Urethane foams are low outgassing and demonstrate resistance to compression set. They are available in thin and soft materials cast on PET film, ideal for cushions and seals in small portable electronic devices. V-0 and HF-1 rated, BISCO(TM) Silicone foams retain integrity after long periods under compression and can withstand temperature to 400 deg F. Polyolefin foams are silane,...

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Materials

Liquid Crystalline Polymer is a single-clad laminate.

ZYVEX(TM) liquid crystalline polymer circuit material is designed for high performance electronics where high frequency, chemical resistance, and fine line high density interconnect (HDI) requirements are critical. ZYVEX TeraClad meets industry requirements for low/stable dielectric constant, low/stable dielectric loss, extremely low moisture absorption, high chemical resistance, matched in-plane...

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