Technic Inc.
Cranston, RI 02910
New Silflake 741 is Suitable for Fired and Polymeric Systems
Silflake 741 exhibits a D50 particle size of 1.5 to 4.5 micron and tap density of 3.0 to 4.0g/cm³. Product features a specific surface area of 0.7 to 1.2 m²/g and weight loss at 538ºC of less than 0.7%. Silflake 741 is used in photovoltaic inks, component inks and fired applications.
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New Techni Indium HS Plating Eliminates the Need of Indium Strike During Nickel Plating
Techni Indium HS Plating offers a density ranging from 50 ASF to 250 ASF with low metal concentration. The process is used in selective plating of press fit pin connectors for preventing metallic whiskers.
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Silflake 661 features bi-model particle size distribution.
Silflake 661 is suitable conductive adhesives, die attach and polymeric applications. Flake comes with a tap density of 2.2 to 3.5 g/cm³, D50 particle size of 2.5 to 5.5 micron with specific surface area of 1.0 to 1.5 m²/g and weight loss of less than 0.7% at 538ºC. Product acts as residual lubricant in polymeric systems.
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Silflake 556 offers shiny surface finishes.
Silflake 556 is used in conductive adhesives, membrane touch switch, EMI shielding and polymeric applications. Unit features a tap density of 2.2 to 3.2 g/cm³, D50 particle size of 2.5 to 15.0 micron with specific surface area of 0.5 to 1.3 m²/g and weight loss of at 538ºC of less than 1.1%.
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Experimental Silflake 144 Powder is suitable for shiny surface finish applications.
Experimental Silflake 144 Powder offers tap density of 2.0 – 4.5 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and is suitable for conductive inks, epoxies, and adhesive applications. Product comes in D50 particle size of 12 – 18 µm.
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Experimental Silflake 608 Powder features residual lubricant.
Experimental Silflake 608 Powder offers tap density of greater than 5.0 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and comes with high packaging density. Product comes in D50 particle size of 5.0 to 8.0 micron and is suitable for conductive adhesives, die attach polymeric and thermal conductive applications.
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Silpowder 590 is suitable for photovoltaic industry.
Silpowder 590 feature spherical morphology, narrow particle size distribution and functional surfactant that is compatible for fired ink systems. With narrow PSD of D10 = 1.1 µm and D90 = 3.4 µm, product has a tap density range of 4.5 - 5.5 g/cm³ and D50 of 1.7 - 2.2 µm. Powder is used in PV and automotive back light applications. Silpowder 590 has a specific surface density of 0.3 – 0.5...
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Platinum Powder 700 comes in spherical shape.
Experimental Platinum Powder 700 offers high packaging density. Unit is suitable for ceramic thick film inks, catalysts and medical applications. Product features tap density of 3.0 - 5.0 g/cm3 and specific surface area of 1.5 - 2.4 m2/g. Platinum Powder comes with D50 of 8.0 - 13.0 µm and weight loss less than 0.6 %.
Read More »TechniEtch TBR19 Aqueous Etchant is fluoride free.
With consistent yield in packaging applications, TechniEtch TBR19 is designed to selectively remove titanium or titanium alloy barrier layers in semiconductor fabrication and packaging applications. Demonstrating high selectivity for Ti or Ti alloys, unit results in significant reduction in undercut of less than 200 nm in Cu pillar applications. Featuring tunable etch rate with long process life,...
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Bright Tin Acid Process suits rack and barrel electroplating.
Based on sulfuric acid electrolyte, Technibrite HT 1000 has low current density bright range, even when plating bath temperature and tin concentration parameters are higher than normal. Process can run without chiller, and will produce bright deposit at low current densities at process temperatures as high as 35°C, and with tin concentrations as high as 40 g/L. Cathode efficiencies of up to...
Read More »Techniseal and Tarniban® Proven Protection for Silver Deposits Under the Harshest Conditions
Cranston, RI, USA – Techniseal and Tarniban® KS II are Technic’s premier silver anti-tarnish processes designed to prevent yellow discoloration under the harshest conditions. Both are production proven processes that can be used in barrel, rack, and high-speed reel-to-reel applications. Techniseal is Technic’s most powerful silver anti-tarnish. The electrolytic process deposits a...
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New Silflake 741 is Suitable for Fired and Polymeric Systems
Silflake 741 exhibits a D50 particle size of 1.5 to 4.5 micron and tap density of 3.0 to 4.0g/cm³. Product features a specific surface area of 0.7 to 1.2 m²/g and weight loss at 538ºC of less than 0.7%. Silflake 741 is used in photovoltaic inks, component inks and fired applications.
Read More »Technic Announces US Distributor Partnership with OrigaLys ElectroChem
Cranston, RI USA – Technic has announced an agreement with OrigaLys ElectroChem of Lyon France for distribution of their product line to the US market. OrigaLys manufactures an extensive line of electrochemistry instruments , including Potentiostats (mono and multi-channel), Galvanostats, Impedance Meter or Rotating Disc Electrodes. The company also distributes software and accessories...
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New Techni Indium HS Plating Eliminates the Need of Indium Strike During Nickel Plating
Techni Indium HS Plating offers a density ranging from 50 ASF to 250 ASF with low metal concentration. The process is used in selective plating of press fit pin connectors for preventing metallic whiskers.
Read More »Technic Launches New Global Website
Redesign Driven by Mobile Trends and Improving End-User Experience Cranston, RI, USA – Technic is pleased to announce the launch of a new global website aimed at improving the overall user experience for both desktop and mobile visitors. The site has been designed to offer visitors quick and easy access to a wealth of information about Technic products, applications, and expertise, as well as...
Read More »Technic Joins Distribution Partner Galber for Surface Finishing Mexico 2018
Cranston RI, USA - Technic, along with its Mexican distribution partner Galber, will be participating in the upcoming Surface Finishing Mexico Exhibition (SFM) being held on March 19-21 at the Querétaro Convention Center in Querétaro, Mexico. Featuring more than 100 companies from 14 countries, SFM 2018 will offer training courses, technical presentations, and networking opportunities for more...
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Silflake 661 features bi-model particle size distribution.
Silflake 661 is suitable conductive adhesives, die attach and polymeric applications. Flake comes with a tap density of 2.2 to 3.5 g/cm³, D50 particle size of 2.5 to 5.5 micron with specific surface area of 1.0 to 1.5 m²/g and weight loss of less than 0.7% at 538ºC. Product acts as residual lubricant in polymeric systems.
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Silflake 556 offers shiny surface finishes.
Silflake 556 is used in conductive adhesives, membrane touch switch, EMI shielding and polymeric applications. Unit features a tap density of 2.2 to 3.2 g/cm³, D50 particle size of 2.5 to 15.0 micron with specific surface area of 0.5 to 1.3 m²/g and weight loss of at 538ºC of less than 1.1%.
Read More »
Experimental Silflake 144 Powder is suitable for shiny surface finish applications.
Experimental Silflake 144 Powder offers tap density of 2.0 – 4.5 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and is suitable for conductive inks, epoxies, and adhesive applications. Product comes in D50 particle size of 12 – 18 µm.
Read More »
Experimental Silflake 608 Powder features residual lubricant.
Experimental Silflake 608 Powder offers tap density of greater than 5.0 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and comes with high packaging density. Product comes in D50 particle size of 5.0 to 8.0 micron and is suitable for conductive adhesives, die attach polymeric and thermal conductive applications.
Read More »