Technic Inc.
Cranston, RI 02910
New Techni NF Tin 400 LA Concentrate Produces Odorless and Clear Product
Low free acid Tin Methanesulfonate solution offering several benefits in inert anode plating bath applications. Allows customers to increase Tin content during process replenishment without increasing the free acid concentration. Used with rack, barrel, and reel-to-reel equipment for electronic connector and industrial applications.
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Technic Inc. Introduces New Gold Plating Process for Greater Adaptability
An updated version of Technic Inc.'s Elevate Gold 7990 process. Provides a full range of deposit thickness. Works with optimum deposits of 0.5 microns to 100 microns with any toolset. Formulation operates at an acidic pH.
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Technic Introduces Goldeneye Nickel EF Process to Produce Ductile Heavy Deposits with Low Stress
Designed to produce bright, lustrous nickel deposits over a wide range of current densities. Suitable for electroforming applications. Advantages include internal deposit stress, improved corrosion resistance and ductility at high thickness.
Read More »
Latest TechniClean IK73 Residue Cleaner Designed for Advanced Semiconductor Manufacturing
The TechniClean IK73 Residue Cleaner is used for removing highly-inert chemical residues that are created during patterning of high-k dielectric metal oxides such as hafnium, zirconium and tantalum oxides. This removal process is suitable in immersion, batch-spray and single-wafer chemical applications.
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Technic Announces the Commercial Release of Silver-Free Seed Layer Process for Solar Applications
Cranston, RI - Technic is pleased to announce the global commercial release of its Alternative Seed Layer (ASL) technology for solar cell metallization marketed under the name TechniSol®. Technic, a global leader in advanced engineered solutions, has announced the full commercial release of the TechniSol® suite of chemistries, developed to significantly reduce metallization costs in solar cell...
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New Silflake 741 is Suitable for Fired and Polymeric Systems
Silflake 741 exhibits a D50 particle size of 1.5 to 4.5 micron and tap density of 3.0 to 4.0g/cm³. Product features a specific surface area of 0.7 to 1.2 m²/g and weight loss at 538ºC of less than 0.7%. Silflake 741 is used in photovoltaic inks, component inks and fired applications.
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New Techni Indium HS Plating Eliminates the Need of Indium Strike During Nickel Plating
Techni Indium HS Plating offers a density ranging from 50 ASF to 250 ASF with low metal concentration. The process is used in selective plating of press fit pin connectors for preventing metallic whiskers.
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Silflake 661 features bi-model particle size distribution.
Silflake 661 is suitable conductive adhesives, die attach and polymeric applications. Flake comes with a tap density of 2.2 to 3.5 g/cm³, D50 particle size of 2.5 to 5.5 micron with specific surface area of 1.0 to 1.5 m²/g and weight loss of less than 0.7% at 538ºC. Product acts as residual lubricant in polymeric systems.
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Silflake 556 offers shiny surface finishes.
Silflake 556 is used in conductive adhesives, membrane touch switch, EMI shielding and polymeric applications. Unit features a tap density of 2.2 to 3.2 g/cm³, D50 particle size of 2.5 to 15.0 micron with specific surface area of 0.5 to 1.3 m²/g and weight loss of at 538ºC of less than 1.1%.
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Experimental Silflake 144 Powder is suitable for shiny surface finish applications.
Experimental Silflake 144 Powder offers tap density of 2.0 – 4.5 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and is suitable for conductive inks, epoxies, and adhesive applications. Product comes in D50 particle size of 12 – 18 µm.
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New Techni NF Tin 400 LA Concentrate Produces Odorless and Clear Product
Low free acid Tin Methanesulfonate solution offering several benefits in inert anode plating bath applications. Allows customers to increase Tin content during process replenishment without increasing the free acid concentration. Used with rack, barrel, and reel-to-reel equipment for electronic connector and industrial applications.
Read More »
Technic Inc. Introduces New Gold Plating Process for Greater Adaptability
An updated version of Technic Inc.'s Elevate Gold 7990 process. Provides a full range of deposit thickness. Works with optimum deposits of 0.5 microns to 100 microns with any toolset. Formulation operates at an acidic pH.
Read More »Advanced Gold-Tin Electroplating Process in Spotlight with Growth of 5G, DCI, and LiDAR
Cranston, RI USA – Technic is reporting increased market demand of its advanced gold-tin electroplating process, Elevate® AuSn 8020. The company attributes the increased demand to a significant expansion in the manufacture and use of 5G capable wireless devices, LiDAR remote sensing technology, and Data Center Interconnect (DCI) technology. Due to advances in 5G, LiDAR, and DCI,...
Read More »Technic Equipment Division Appoints Jim Acquaviva Director of Business Development
Pawtucket, RI USA - Technic Equipment Division is pleased to announce the appointment of Jim Acquaviva as Director of Business Development. Jim will add extensive management experience to the leadership team, with a particular emphasis on sales and marketing efforts. Jim has focused his 25-year career on growing technically driven manufacturing companies through a wide range of R&D and commercial...
Read More »Technic Announces Scientific Collaboration with Agilent Technologies on Semiconductor Grade Chemicals Trace Analysis
Saint Denis, FRANCE - Technic, a leading global provider of semiconductor grade ultrapure chemicals, has announced a new collaboration with Agilent Technologies, a leading distributor of analytical and scientific instrumentation for achieving clean room ppt level metal trace analysis capabilities. The collaboration will provide ongoing support to Technic utilizing the Agilent 8900 ICP-QQQ...
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Technic Introduces Goldeneye Nickel EF Process to Produce Ductile Heavy Deposits with Low Stress
Designed to produce bright, lustrous nickel deposits over a wide range of current densities. Suitable for electroforming applications. Advantages include internal deposit stress, improved corrosion resistance and ductility at high thickness.
Read More »
Latest TechniClean IK73 Residue Cleaner Designed for Advanced Semiconductor Manufacturing
The TechniClean IK73 Residue Cleaner is used for removing highly-inert chemical residues that are created during patterning of high-k dielectric metal oxides such as hafnium, zirconium and tantalum oxides. This removal process is suitable in immersion, batch-spray and single-wafer chemical applications.
Read More »
Technic Announces the Commercial Release of Silver-Free Seed Layer Process for Solar Applications
Cranston, RI - Technic is pleased to announce the global commercial release of its Alternative Seed Layer (ASL) technology for solar cell metallization marketed under the name TechniSol®. Technic, a global leader in advanced engineered solutions, has announced the full commercial release of the TechniSol® suite of chemistries, developed to significantly reduce metallization costs in solar cell...
Read More »Techniseal and Tarniban® Proven Protection for Silver Deposits Under the Harshest Conditions
Cranston, RI, USA – Techniseal and Tarniban® KS II are Technic’s premier silver anti-tarnish processes designed to prevent yellow discoloration under the harshest conditions. Both are production proven processes that can be used in barrel, rack, and high-speed reel-to-reel applications. Techniseal is Technic’s most powerful silver anti-tarnish. The electrolytic process deposits a...
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New Silflake 741 is Suitable for Fired and Polymeric Systems
Silflake 741 exhibits a D50 particle size of 1.5 to 4.5 micron and tap density of 3.0 to 4.0g/cm³. Product features a specific surface area of 0.7 to 1.2 m²/g and weight loss at 538ºC of less than 0.7%. Silflake 741 is used in photovoltaic inks, component inks and fired applications.
Read More »
