Company News

Technic Inc.

47 Molter St., Cranston, RI, 02910, USA

  • 800-303-1743

Latest New Product News from
Technic Inc.

Materials & Material Processing

Experimental Silflake 144 Powder is suitable for shiny surface finish applications.

Nov 09, 2017

Experimental Silflake 144 Powder offers tap density of 2.0 – 4.5 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and is suitable for conductive inks, epoxies, and adhesive applications. Product comes in D50 particle size of 12 – 18 µm.

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Materials & Material Processing

Experimental Silflake 608 Powder features residual lubricant.

Sep 29, 2017

Experimental Silflake 608 Powder offers tap density of greater than 5.0 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and comes with high packaging density. Product comes in D50 particle size of 5.0 to 8.0 micron and is suitable for... Read More

Silpowder 590 is suitable for photovoltaic industry.

Aug 25, 2017

Silpowder 590 feature spherical morphology, narrow particle size distribution and functional surfactant that is compatible for fired ink systems. With narrow PSD of D10 = 1.1 µm and D90 = 3.4 µm, product has a tap density range of 4.5 - 5.5 g/cm³ and D50 of 1.7 - 2.2 µm.... Read More

Platinum Powder 700 comes in spherical shape.

Aug 11, 2017

Experimental Platinum Powder 700 offers high packaging density. Unit is suitable for ceramic thick film inks, catalysts and medical applications. Product features tap density of 3.0 - 5.0 g/cm3 and specific surface area of 1.5 - 2.4 m2/g. Platinum Powder comes with D50 of 8.0 - 13.0 µm and weight loss less than 0.6 %.

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TechniEtch TBR19 Aqueous Etchant is fluoride free.

Dec 15, 2016

With consistent yield in packaging applications, TechniEtch TBR19 is designed to selectively remove titanium or titanium alloy barrier layers in semiconductor fabrication and packaging applications. Demonstrating high selectivity for Ti or Ti alloys, unit results in significant reduction in undercut of less than 200 nm in Cu pillar applications. Featuring tunable etch rate with long process... Read More

Machinery & Machining Tools, Materials & Material Processing, Services

Bright Tin Acid Process suits rack and barrel electroplating.

May 06, 2016

Based on sulfuric acid electrolyte, Technibrite HT 1000 has low current density bright range, even when plating bath temperature and tin concentration parameters are higher than normal. Process can run without chiller, and will produce bright deposit at low current densities at process temperatures as high as 35°C, and with tin concentrations as high as 40 g/L. Cathode efficiencies of up to... Read More

Cleaning Products & Equipment

High-Speed Liquid Cleaner removes soluble 3D support material.

Oct 23, 2015

Supplied in 40x concentrate liquid, Techni Print is compatible for use in all equipment. Blue color signifies active status and viability for continued use. As solution becomes saturated with support material, color changes from blue to white (depending on color of support material used) to indicate need for replacement. With powdered additive (Techni Print Eco-Reclaim Agent), fully saturated... Read More


Electroplating Course emphasizes aerospace industry applications.

Aug 04, 2015

To be held in Birmingham, AL on September 15 and 16, 2015, Kushner Electroplating School's specialized training program is based on Electroplating Know - How Basics II© and tailored to emphasize essential topics specific to aerospace industry electroplating/finishing. Course training is presented in classroom format and consists of 14 hr of materials. Course targets industry professionals... Read More

Machinery & Machining Tools

Electropolishing Systems can be tailored to user requirements.

May 05, 2011

Featuring single point graphical machine operation and monitoring of process parameters from touch screen, Technic Electropolishing Systems provide precise and repeatable electropolishing, sharpening, and deburring. Machines can be custom engineered with robotic parts feeding technologies, fixtures, tanks, tooling, and controls to meet user requirements. Suitable for stainless steels, Monel®,... Read More

Cleaning Products & Equipment

Wafer Plating Tool suits R/D and low-volume applications.

Nov 10, 2010

Featuring single plating cell and dragout rinse cell, SEMCON 1000 provides uniform plating of most patterned wafers, MEMS-based substrates, and similar applications. Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder. Self-contained solution is constructed of white polypropylene with clear PVC process cover... Read More

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Technic Inc.