Brewer Science, Inc.

Adhesives & Sealants

Bonding Material accommodates ultrathin wafers.

Exhibiting bonded pair rigidity and thermal stability, Brewer Science WaferBOND(TM) HT-10.10 bonds fragile device wafers to rigid carriers to allow thinning and subsequent processing to create through-silicon vias (TSVs). This spin-on polymeric temporary wafer bonding material is resistant to solvents, acids, and bases. Device structure planarization with total thickness variation of less than...

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Paints & Coatings

ARC®29A Anti-Reflective Coating for 65nm Node ArF Processing

Rolla, Missouri, July 11, 2006 - Brewer Science, Inc. - Brewer Science continues to deliver on its twenty-five-year promise to provide solutions to our leading-edge customers by releasing ARC-®29A anti-reflective coating, a high-performance coating that improves process flexibility through its compatibility with a broad range of photoresists. This coating, used for ArF (193nm) processing,...

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Paints & Coatings

ProTEK(TM) Temporary Etch Protective Coatings

July 11, 2006 - Rolla, Missouri, USA. Brewer Science is pleased to announce the development of a new temporary protective coating system for basic etchants, which offer customers an alternative to their current wet-etch process materials. ProTEK(TM) etch protective coatings are spin-applied polymeric coatings designed to give maximum protection, durability, and longevity against harsh etchants...

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Adhesives & Sealants

Temporary Wafer Bonding Product Set Released by Brewer Science

Rolla, Missouri, July 11, 2006 - Brewer Science, Inc. - Continuing with twenty-five years of providing solutions to our lead-edge customers, Brewer Science is introducing a novel product set to the compound semiconductor and MEMS industries. The new WaferBOND(TM) product set allows higher temperature process latitude and increased processing that is more robust than existing alternatives....

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Computer Hardware & Peripherals

EV Group and Brewer Science Cooperate in the Development of Ultrathin Wafer Handling Solutions for the Microelectronics Industry

EV Group (EVG), based in Schärding, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system. As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and process...

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