Aries Electronics, Inc.

Test Socket suits devices from 28 to 40 mm².
Electrical Equipment & Systems

Test Socket suits devices from 28 to 40 mm².

Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25...

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Test Socket suits devices from 28 to 40 mm-².
Electrical Equipment & Systems

Test Socket suits devices from 28 to 40 mm-².

Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25...

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DIP to SOIC Adapter features RoHS-compliant construction.
Electrical Equipment & Systems

DIP to SOIC Adapter features RoHS-compliant construction.

FRENCHTOWN, N.J., September 2006 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a RoHS-compliant version of its DIP to SOIC Correct-A-Chip(TM) adapter that offers an easy method of converting DIP style packaging to SOIC PCB layouts. The top of the new RoHS-compliant adapter is available in DIP pin counts from eight...

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DIP to SOIC Adapter features RoHS-compliant construction.
Electrical Equipment & Systems

DIP to SOIC Adapter features RoHS-compliant construction.

FRENCHTOWN, N.J., September 2006 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a RoHS-compliant version of its DIP to SOIC Correct-A-Chip(TM) adapter that offers an easy method of converting DIP style packaging to SOIC PCB layouts. The top of the new RoHS-compliant adapter is available in DIP pin counts from eight...

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PLCC-to-DIP Adapter is RoHS-compliant.
Electrical Equipment & Systems

PLCC-to-DIP Adapter is RoHS-compliant.

With current rating of 1 A, PLCC to DIP Correct-A-Chip(TM) adapter is available with PLCC sockets or pads on top and with 28-84 DIP pins on bottom. Body is constructed of 0.062 in. FR406 or IS410 with 1 oz of copper traces on both sides; pins are 360--½ hard brass alloy with 10 µ in. (min) gold plating over 100 µ in. nickel plating. PLCC sockets are made from UL 94V-0 Ryton, socket...

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PLCC-to-DIP Adapter is RoHS-compliant.
Electrical Equipment & Systems

PLCC-to-DIP Adapter is RoHS-compliant.

With current rating of 1 A, PLCC to DIP Correct-A-Chip(TM) adapter is available with PLCC sockets or pads on top and with 28-84 DIP pins on bottom. Body is constructed of 0.062 in. FR406 or IS410 with 1 oz of copper traces on both sides; pins are 360-Â-½ hard brass alloy with 10 µ in. (min) gold plating over 100 µ in. nickel plating. PLCC sockets are made from UL 94V-0 Ryton,...

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Socket is available for 0.50-0.80 mm pitch packages.
Electrical Equipment & Systems

Socket is available for 0.50-0.80 mm pitch packages.

Suited for applications using BGA, LGA, CSP, and other devices on 0.50 mm or larger pitch, PinBall(TM) Socket can be soldered side-by-side, directly to existing footprint of PC board. Clearances range from 0.5-2.0 mm, depending on pitch. Constructed of FR-4 material, socket features 63/37 tin-lead solderballs on PCB mating side and male spring probe on device mating side, which offers contact...

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Socket is available for 0.50-0.80 mm pitch packages.
Electrical Equipment & Systems

Socket is available for 0.50-0.80 mm pitch packages.

Suited for applications using BGA, LGA, CSP, and other devices on 0.50 mm or larger pitch, PinBall(TM) Socket can be soldered side-by-side, directly to existing footprint of PC board. Clearances range from 0.5-2.0 mm, depending on pitch. Constructed of FR-4 material, socket features 63/37 tin-lead solderballs on PCB mating side and male spring probe on device mating side, which offers contact...

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