Aim, Inc.

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO
Materials

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. NC277 Liquid Flux is formulated to offer a very wide process window and is excellent in extended dwell times. NC277 offers a broad activation range, proving...

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AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO
Materials

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. NC277 Liquid Flux is formulated to offer a very wide process window and is excellent in extended dwell times. NC277 offers a broad activation range, proving...

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Materials

Solder Alloy is available in Pb-free bar form.

Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickel- and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does not...

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Materials

Solder Alloy is available in Pb-free bar form.

Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickelÂ- and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does not...

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AIM to Highlight New NC259 Solder Paste at SMTA International 2012
Materials

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the...

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AIM to Highlight New NC259 Solder Paste at SMTA International 2012
Materials

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the...

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AIM to Showcase NC259 Solder Paste at IPC Midwest
Materials

AIM to Showcase NC259 Solder Paste at IPC Midwest

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its new NC259 Solder Paste in Booth #603 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. This...

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AIM to Showcase NC259 Solder Paste at IPC Midwest
Materials

AIM to Showcase NC259 Solder Paste at IPC Midwest

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its new NC259 Solder Paste in Booth #603 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. This...

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VOC-Free Flux passes SIR and corrosion testing requirements.
Materials

VOC-Free Flux passes SIR and corrosion testing requirements.

Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 2.6.3.7 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including...

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VOC-Free Flux passes SIR and corrosion testing requirements.
Materials

VOC-Free Flux passes SIR and corrosion testing requirements.

Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 2.6.3.7 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including...

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