AI Technology, Inc.

Adhesives & Sealants

Temporary Bonding Adhesive aids thin wafer handling.

High temperature wafer processing adhesives (WPA) withstand processing up to 330°C and exhibit chemical resistance to acids and bases during etching processes. Thermal and chemical stability promotes continued chemical integrity, allowing thin wafer to be separated from wafer handler/carrier by heat-sliding or laser de-bonding equipment. Facilitating separation, WPA adhesive layer absorbs...

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Adhesives & Sealants

Temporary Bonding Adhesive aids thin wafer handling.

High temperature wafer processing adhesives (WPA) withstand processing up to 330°C and exhibit chemical resistance to acids and bases during etching processes. Thermal and chemical stability promotes continued chemical integrity, allowing thin wafer to be separated from wafer handler/carrier by heat-sliding or laser de-bonding equipment. Facilitating separation, WPA adhesive layer absorbs...

Read More »

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