Aprima Medical Software, Inc
Carrollton, TX 75006
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Prototyping Service suits CMOS and RF processes.
Multi-Project Wafer Service combines several designs from different customers onto one wafer. Customer delivers GDSII-Data's at fixed dates and receives untested packaged samples or dies within 8-10 weeks. CMOS compatible 0.35 -µm Silicon-Germanium BiCMOS technology enables designs of RF circuits with operating frequency up to 10 GHz combined with high-density digital parts on one ASIC, while...
Read More »Prototyping Service suits CMOS and RF processes.
Multi-Project Wafer Service combines several designs from different customers onto one wafer. Customer delivers GDSII-Data's at fixed dates and receives untested packaged samples or dies within 8-10 weeks. CMOS compatible 0.35 Ã-µm Silicon-Germanium BiCMOS technology enables designs of RF circuits with operating frequency up to 10 GHz combined with high-density digital parts on one ASIC,...
Read More »Telephony Switches use software for TISPAN deployment.
MultiNode-B modular Class-5 switches work with software that enables telecom operators to integrate legacy wireline networks into 3GPP IP Multimedia Subsystem (IMS) for PSTN migration to VoIP and fixed mobile convergence. Operators can deploy TISPAN-compliant architectures, delivering consistent telephony services across wireline technologies. Switches control IMAPs using H.248/Megaco to deliver...
Read More »IT Application Software targets large enterprises.
Central Management System for Problem, Change, and Request Management processes service desk tasks in milliseconds. It delivers incremental value to enterprises by providing greater processing capability with fewer resources. CMS works directly with back-end database, requires zero third-party hardware and software, and uses intuitive Graphical User Interface. It works with IBM's OS/390 and z/OS...
Read More »Telephony Switches use software for TISPAN deployment.
MultiNode-B modular Class-5 switches work with software that enables telecom operators to integrate legacy wireline networks into 3GPP IP Multimedia Subsystem (IMS) for PSTN migration to VoIP and fixed mobile convergence. Operators can deploy TISPAN-compliant architectures, delivering consistent telephony services across wireline technologies. Switches control IMAPs using H.248/Megaco to deliver...
Read More »IT Application Software targets large enterprises.
Central Management System for Problem, Change, and Request Management processes service desk tasks in milliseconds. It delivers incremental value to enterprises by providing greater processing capability with fewer resources. CMS works directly with back-end database, requires zero third-party hardware and software, and uses intuitive Graphical User Interface. It works with IBM's OS/390 and z/OS...
Read More »Test Kit aids in 32-bit Flash MCU development.
Supporting AT91SAM7S-series ARM7-®-based Flash microcontrollers, AT91SAM7S64-IAR Development Kit includes evaluation board and J-LINK USB-to-JTAG debug interface along with suite of development tools from IAR Systems. Tools include 20-state version of visualSTATE® for SAM7S and 32 kByte code limited KickStart version of IAR Embedded Workbench® for ARM®. Kit enables users to show proof...
Read More »Test Kit aids in 32-bit Flash MCU development.
Supporting AT91SAM7S-series ARM7Ã-®-based Flash microcontrollers, AT91SAM7S64-IAR Development Kit includes evaluation board and J-LINK USB-to-JTAG debug interface along with suite of development tools from IAR Systems. Tools include 20-state version of visualSTATEî for SAM7S and 32 kByte code limited KickStart version of IAR Embedded Workbenchî for ARMî. Kit enables users...
Read More »Cellular Surface Mounters feature compact design.
Suited for handling 0402 chips, SI-F130 is equipped planetary head and incorporates overlap mounting process that achieves placement tact time of 0.139 sec. It also features PCB loading/unloading system. Fine-pitch SI-F209 uses flying vision and nozzle changing systems in addition to ejector-aided PCB loading/unloading system with recognition technology. Designed for electronic chip mounting,...
Read More »Cellular Surface Mounters feature compact design.
Suited for handling 0402 chips, SI-F130 is equipped planetary head and incorporates overlap mounting process that achieves placement tact time of 0.139 sec. It also features PCB loading/unloading system. Fine-pitch SI-F209 uses flying vision and nozzle changing systems in addition to ejector-aided PCB loading/unloading system with recognition technology. Designed for electronic chip mounting,...
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