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Smart Gate Driver Photocoupler offers embedded protection.

May 29, 2014 - Housed in thin SO16L package, Model TLP5214 drives medium-power IGBTs and power MOSFETs. Maximum propagation delay time of 150 ns and propagation delay skew of ±80 ns are provided within defined operating temperature range up to 110°C. To prevent IGBT from reaching overcurrent conditions, photocoupler integrates IGBT desaturation detection, active miller clamp, and Fault detection. Device is suited for factory automation, home PV power systems, digital home appliances, and UPS systems.
Original Press release

Toshiba America Electronic Components (TAEC)
9775 Toledo Way
Irvine, CA, 92618-1811

Toshiba Debuts New Smart Gate Driver Photocoupler with Embedded Protection Features

Improves Power Efficiency, Reduces Systems Costs

IRVINE, Calif., May-- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it has enhanced its portfolio of photocouplers with the addition of a smart gate driver photocoupler.  Housed in a thin SO16L package, the new TLP5214 is suited to driving medium-power IGBTs and power MOSFETs.

Used to protect circuits between electronic devices or to block noise by electrically isolating the input and output blocks, photocouplers are a suitable choice for industrial applications that will be installed in electrically noisy environments.  Combined with Toshiba's high-reliability infrared LED, the TLP5214 is suited for a wide range of applications - including those that require high thermo-stability - such as factory automation, home photovoltaic power systems, digital home appliances and UPS.  A maximum propagation delay time of 150ns and a propagation delay skew of ±80ns are provided within the defined operating temperature range (up to 110 degrees Centigrade), to reduce dead time in the inverter circuit for improved operating efficiency.

The TLP5214 integrates many functions to prevent the IGBT from reaching overcurrent conditions, including: IGBT desaturation detection, active miller clamp and FAULT detection.  With the ability to detect and handle malfunctions in a single chip, the TLP5214 helps improve power efficiency and reduce overall system cost. The SO16L package provides a creepage distance of 8mm (min), suitable for applications that require higher isolation specifications.  It has the additional benefit of being only 2.3mm (max) in height.

Key Specifications

Part Number


Electrical Characteristics

Peak output current

+/-4.0A (max)

Total Output Supply Voltage

15V ~ 30V

Supply Current

3.5mA (max)

Threshold Input Current 3350 (L/H)

6mA (max)

Switching Characteristics

 Propagation delay time

150ns (max)

Propagation delay skew

-80ns ~ 80ns

Protecting Functions

IGBT desaturation detection

DESAT Threshold Voltage: 6.5V (typ)

Soft turn-off

DESAT Sense to 10% Delay: 3.5 s (typ)

Miller clamping (Off-state)

Clamp Pin Threshold Voltage: 3.0V (typ)

Undervoltage lockout (UVLO)

VUVLO+: 11.6V (typ)

VUVLO-: 10.3V (typ)


 Isolation voltage

5000 Vrms (min)


8.0mm (min)

Creepage Distance

8.0mm (min)

 Insulation Thickness

0.4mm (min)


Pricing and Availability

Mass production of the new photocouplers is scheduled for the end of May 2014.

*About Toshiba Corp. and TAEC

About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, December 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 206,087 employees worldwide. Visit Toshiba's web site at


Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications

Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes

For additional company and product information, please visit

© 2014 Toshiba America Electronic Components, Inc. All rights reserved.

Information in this press release, including product pricing and specifications, content of services and contact information,  is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.  Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

CONTACT: Rebecca Bueno, Toshiba America Electronic Components, Inc., Tel.: (949) 462-7885,

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