ThomasNet News Logo

Starter Kit offers prototyping platform for SoC FPGAs.

February 6, 2013 - Available on Emcraft Systems 34 x 59 mm mezzanine form factor system-on-module, which connects to SOM-BSB-EXT baseboard, SmartFusion®2 Starter Kit includes FlashPro4 programming and supports Ethernet, USB, SPI, I2C, and UART interfaces. USB-powered system has breadboard area for GPIO or FPGA I/O connection, 64 MB LPDDR, 16 MB SPI flash, and 2 user-controlled LEDs connected to GPIO on SOM. By using included USB WiFi adapter, kit supports RaLink 5370 USB wireless radios.
Original Press release

Microsemi
2381 Morse Ave.
Irvine, CA, 92614
USA


Microsemi Introduces SmartFusion®2 SoC FPGA Starter Kits to Speed Product-Development Efforts


Worldwide Training Sessions on SmartFusion2 Now Open for Registration



ALISO VIEJO, Calif., -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its SmartFusion(®)2 Starter Kit, providing designers with a basic prototyping platform for the company's SmartFusion2 system-on-chip (SoC) field programmable gate arrays (FPGAs).



The SmartFusion2 Starter Kit supports industry-standard interfaces including Ethernet, USB, SPI, I2C and UART and includes a comprehensive breadboard to support unique design requirements. The kit can be used with Microsemi's Libero SoC v11.0 beta software, which includes a free Libero Gold license and comes preloaded with a uClinux demo. By using the included USB WiFi adapter, the kit has support for RaLink 5370 USB wireless radios, allowing uClinux to setup a wireless access point that serves DHCP WiFi connections.



Users can start a HTTPD server and then access the SmartFusion2 device via a smart phone web browser or other wireless device. Emcraft Systems' Linux-based development environment is also supported. The SmartFusion2 device is available on an Emcraft Systems miniature (34mm x 59mm) mezzanine form factor system-on-module (M2S-SOM), which connects to the SOM-BSB-EXT baseboard. The kit is USB powered, includes FlashPro4 programming and features the following user interfaces and capabilities:



--  SmartFusion2 SoC FPGA in the FG896 package (M2S050T-FG896ES)

--  10/100 Ethernet interface and RJ-45 connector

--  USB OTG interface and mini-USB connector

--  USB based Wi-Fi module

--  64MB LPDDR, 16MB SPI flash

--  User push-button connected to GPIO on the SOM

--  Two user-controlled LEDs connected to GPIO on the SOM

--  Breadboard area available for GPIO or FPGA I/O connection

--  Power good LED indicating presence of the +3.3 V SOM power

--  Reset push button, reset-out LED

--  Depending on the design, can provide necessary power supply voltages (+5 V, +3.3 V, +1.5 V for power-optimized SOM operation) from external sources through dedicated pads on the breadboard



About SmartFusion2 SoC FPGAs

Microsemi's next-generation SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, defense, aviation, and industrial and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM(®) Cortex((TM))-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip. For more information about Microsemi's SmartFusion2 SoC FPGAs, visit www.microsemi.com/smartfusion2.



Avent Memec Hosts SmartFusion2 Events Throughout US

Microsemi distributor Avnet Memec North America will host hands-on training sessions on SmartFusion2 with the new starter kits. Attendees will receive a SmartFusion2 starter kit at the completion of the training. For more information on the Avnet Memec North America events, visit www.em.avnet.com/sf2speedway.



About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.



Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.



CONTACT: Gwen Carlson, Director of Corporate Communications, +1-949-380-6135, or Beth P. Quezada, Communications Specialist, +1-949-380-6102, press@microsemi.com



Web Site: www.microsemi.com
Brought to you by Thomasnet.com

News provided by ThomasNet News® (TNN). TNN is a comprehensive source of new and timely product information in the industrial marketplace. TNN supplies new product information to the web sites, e-marketplaces and print publications that serve the industrial marketplace.

Copyright © 2014 Thomas Publishing Company