Development System meets PICMG 3.0 specification.
November 19, 2002 -
AdvancedTCA(TM) incorporates full mesh 14-slot backplane installed in 12U, 84HP subrack. Integral cooling unit, with 3 fans, handles heat dissipation up to 120 W per board. Enclosure provides redundancy through dual Intel® ZT 7101 shelf management controllers and dual 48 V, 60 A power input filters supplying 48 Vdc power. Open, multi-vendor ATCA(TM) architecture suits telecom, datacom, and military applications.
Original Press release
170 Commerce Drive
Warwick, RI, 02886
Schroff® First to Market with 12u 14-Slot Development System Designed for AdvancedTCA(TM)
Warwick, RI, November 2002 - Schroff®, the global leader in electronic enclosure solutions, has released a new AdvancedTCA(TM) 12U 14-slot development system. The enclosure is the first in a series of Schroff packaging solutions designed for the forthcoming PICMG 3.0 specification, called AdvancedTCA (ATCA(TM)), being developed by the PCI Industrial Computers Manufacturers Group (PICMG®).
Schroff's new ATCA development system incorporates a full mesh 14-slot backplane installed in a 12U 84HP subrack; and is designed for heat dissipation of up to 120 W per board, with three cooling fans in an integral fan unit. The enclosure provides redundancy through dual Intel® ZT 7101 shelf management controllers and dual 48 V 60 A power input filters supplying 48 VDC power.
AdvancedTCA is PICMG's designation for the PICMG 3.x family of draft specifications. The open, multi-vendor ATCA architecture is designed to provide extremely high processor density and communications bandwidth, augmented with robust mechanical and electrical definitions. Although PICMG is developing ATCA specifically to address the need for central office grade equipment in the telecom sector, the architecture is also drawing heavy interest from the datacom and military equipment markets.
The new Schroff development system is available immediately. Other height and slot options are available upon request.
For more information about Schroff packaging solutions for AdvancedTCA, please visit www.a-tca.com, call 888-550-9543, or contact Technical Sales, Tel: 401-732-3770; Email: firstname.lastname@example.org; Web: www.a-tca.com.
About Pentair: Pentair Electronic Packaging, headquartered in Warwick, RI, manufactures the complete range of Schroff® products and provides the widest array of custom and off-the-shelf electronic enclosure and packaging solutions. Pentair Electronic Packaging, with 6 manufacturing locations in North and South America, is a subsidiary of Pentair, Inc., St. Paul, MN, (NYSE: PNR) a diversified manufacturer that operates in three principal markets: electrical and electronic enclosures, professional tools and equipment, and water and fluid technologies.
About PICMG: Founded in 1994, PICMG is a consortium of over 600 companies that collaboratively develops open specifications for high performance telecommunications and industrial computing applications. The members of the consortium have a long history of developing leading edge products for these industries. Recently, PICMG announced a new series of specifications for next-generation telecommunications equipment, AdvancedTCA(TM) (for Advanced Telecom Computing Architecture). The AdvancedTCA core specification PICMG 3.0 is targeted for completion by the end of 2002. For more information on AdvancedTCA or to view a short form version of an interim draft of the 3.0 specification, visit http://www.advancedtca.org/.
For information about PICMG membership, or to find out how to obtain PICMG specifications, visit the PICMG website at http://www.picmg.org or call PICMG headquarters at (781) 246-9318.
PICMG is a registered trademark of the PCI Industrial Computers Manufacturers Group. AdvancedTCA and ATCA are trademarks of the PCI Industrial Computers Manufacturers Group.