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Clear Epoxy Encapsulant has pourable formulation.

info@productnews.com (ThomasNet News) — Fri, 20 Nov 2009 08:27:12 -0500

Bio Clear 810(TM) is solvent free, clear epoxy used for object encapsulation (marine, electronic, and gift industries) as well as poured-on bar top and table top applications. Features include low exotherm kick, slow UV epoxy yellowing, and low viscosity, making it suited for poured applications between 1/4 and one inch thick. Bio Clear 810 has a 2:1 mix ratio.

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Potting Compound features 6 hr working life.

info@productnews.com (ThomasNet News) — Fri, 30 Oct 2009 08:45:06 -0500

Qualified for filament winding applications, EP29LP-1 exhibits physical strength that enhances component resistance to thermal shock. It adheres to various substrates, including optical fibers and fibrous reinforcements, and has bond strength of greater than 3,500 psi. With peak exotherm as low as 50°C, this 2-part, optically clear epoxy is resistant to chemicals and offers compound flow, setup, and handling properties suited for large potting and encapsulating applications.

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Epoxy Adhesive has linear shrinkage of 0.0003 in./in.

info@productnews.com (ThomasNet News) — Thu, 29 Oct 2009 08:32:07 -0500

Low viscosity, optically clear, two part epoxy compound, EP30LV-1 is formulated to cure at room temperatures, and forms bonds with both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Electrical insulator adhesive requires only contact pressure for curing. Suitable applications include optical, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries.

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Epoxy Adhesive conducts static electricity through filters.

info@productnews.com (ThomasNet News) — Mon, 26 Oct 2009 08:54:04 -0500

Magnobond® 133-351 A/B is 2-part epoxy adhesive that bonds fuel filter media to filter end caps. Its conductive carbon filler allow static electricity to be discharged safely, enabling filter manufacturers to use it to create static discharge circuit. Designed to bond dissimilar substrates, low-viscosity adhesive also offers chemical resistance.

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Epoxy Adhesive suits temperatures up to 600°F.

info@productnews.com (ThomasNet News) — Wed, 14 Oct 2009 08:33:09 -0500

Designed to withstand severe and repeated thermal cycling, Master Bond EP46HT-1 has continuous service operating temperature range of -100 to +550°F and can withstand intermittent exposures up to 600°F. It has glass transition temperature of over 235°C and provides adhesion to metals, glass, vulcanized rubbers, and most plastics. Product cures rapidly at elevated temperatures, is 100% reactive, and does not contain any solvents or diluents. Hardened system is electrical insulator.

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Thermal Adhesive Film provides electrical insulation.

info@productnews.com (ThomasNet News) — Fri, 02 Oct 2009 08:29:28 -0500

Formulated to function as preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices, FL901AO epoxy film can cure in 1 hr at 250°F or 30-40 min at 300°F. B-stage, 100% solid adhesive-preform offers thermal conductivity of 10 BTUoin./ft²hr°F and volume resistivity exceeding 10 x 1012 W-cm, providing no-mess solution to electronic assembly and other industrial bonding and sealing operations.

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Clear Epoxy can be shaped and engraved with ordinary router.

info@productnews.com (ThomasNet News) — Tue, 01 Sep 2009 08:31:41 -0500

Bio Clear 810(TM) is pourable bar- and table-top clear epoxy, which can be shaped, edged, and engraved with ordinary router once it has set and cured. Low viscosity epoxy is available in 1.5 quart, 3 quart, and 3 gal kits, each with mix ratio of 2:1.

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Fire Retardant Adhesive meets aerospace industry needs.

info@productnews.com (ThomasNet News) — Mon, 31 Aug 2009 08:35:46 -0500

As 2-component, room temperature curing epoxy paste adhesive, Magnobond 5925 is designed to bond honeycomb aircraft interior panels as well as for ditch-and-pot applications. Solvent-free solution, in addition to being fire-resistant, also exhibits resistance to chemicals, moisture, and environmental conditions. It can be packaged in any 2:1 mix ratio side-by-side cartridges and will help improve safety of all commercial airliners.

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Dry Film Adhesive cures at 150°C.

info@productnews.com (ThomasNet News) — Fri, 28 Aug 2009 08:33:24 -0500

Pre-manufactured with thickness uniformity, DuPont(TM) PerMX(TM) 3000 can cover or tent holes in substrate and provide reliable bonding in 5 min cycle. Negative tone, photodielectric epoxy material offers both corrosion and chemical resistance. With greater than 4:1 aspect ratio, straight vertical sidewalls, and thermal resistance, product is suited for applications in 3D, through silicon via, and wafer level packaging of electronic components and microelectromechanical systems.

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Epoxy Adhesive features high thermal conductivity.

info@productnews.com (ThomasNet News) — Mon, 03 Aug 2009 08:32:30 -0500

Suited for bonding, sealing, and potting applications, EP30BN optimizes heat dissipation of aerospace, defense, and microelectronic assemblies with minimal weight penalty. Two part boron nitride epoxy adhesive features electrical insulation properties with volume resistivity in excess of 1,014 Wcm and thermal conductivity of 24 Btu/hr/ft²/°F/in. Mechanical strength properties and chemical resistance are maintained over wide temperature range of -60 to 300°F.

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Epoxy repairs defects in corroded linings/stacks to 400°F.

info@productnews.com (ThomasNet News) — Fri, 17 Jul 2009 08:32:32 -0500

Capable of providing tensile shear strength of 2,400 psi and flexural strength of 13,400 psi, Aremco-Bond(TM) 2200 bonds ceramic and metal wear plates. Electrical insulating properties include dielectric strength of 460 V/mil and volume resistivity of 1.0 x 1015. Abrasion, corrosion and impact resistant compound cures at room temperature in 24-48 hr or by heating to 175 °F for 4 hr. Cured product is machinable and features linear shrinkage of .009 in/in and Shore-D hardness of 86.

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Epoxy Adhesive contains no volatiles or hazardous solvents.

info@productnews.com (ThomasNet News) — Mon, 06 Jul 2009 08:34:13 -0500

Exhibiting low shrinkage and offering Tg that exceeds 94°C, epoxy adhesive UV10TK40 offers tensile strength of 8,300 psi and shore D hardness greater than 75, forming high surface hardness. It cures tack free in presence of air and will gel rapidly upon UV light exposure. Environmentally-friendly and 100% reactive, UV cure adhesive is suited for clear coating, sealing and bonding, and any process that requires critical alignment or exact positioning.

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Epoxy System is reinforced with nanosilica fillers.

info@productnews.com (ThomasNet News) — Fri, 03 Jul 2009 08:36:49 -0500

Type UV22 features nano-sized filler (less than 50 nm) that provides cured system with abrasion resistance, optical clarity, low shrinkage, and physical strength, while maintaining low viscosity of 4,000 cps. UV22 cures rapidly upon exposure to UV light at room temperatures, has tensile strength greater than 4,600 psi and tensile modulus greater than 500,000 psi. Single component system has service temperature range of -60 to +300°F, is solvent-free adhesive, and not oxygen inhibited.

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High Strength Epoxy make repairs to 400°F.

info@productnews.com (ThomasNet News) — Mon, 22 Jun 2009 08:25:47 -0500

Aremco-Bond(TM) 2200 glass-fiber and Kevlar reinforced epoxy-novolac compound is suited for bonding ceramic and metal wear plates used to insulate chutes, ducts, and centrifuges, and repairing defects in corroded linings and stacks to 400°F. Tensile shear strength is 2,400 psi and flexural strength is 13,400 psi, and product is resistant to acids, alkalis, organic fluids, and salts. Electrical insulating properties include dielectric strength of 460 V/mil and volume resistivity of 1.0 x 1015.

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Epoxy Potting Compound has low viscosity formulation.

info@productnews.com (ThomasNet News) — Wed, 10 Jun 2009 08:28:09 -0500

Formulated for electronic potting and encapsulating applications, Type 20-3060 Epoxy flows quickly in and around electronic components, self levels, releases air bubbles, and provides smooth, glasslike finish. It offers electrical insulation, chemical resistance, and protection from environment. Potting compound is available in quarts, gallons, and 5 gal pails.

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Conductive Electrical Adhesive suits applications to 500°F.

info@productnews.com (ThomasNet News) — Thu, 21 May 2009 08:28:58 -0500

Offering alternative to silver-filled, electrically conductive epoxies, nickel-filled Duralco 122 cures at room temperature in 16-24 hr at 75°F or can be fast cured in 10 min at 200°F. Resistant to moisture, chemicals, and solvents, 2-part epoxy bonds well to glass, ceramics, plastics, dissimilar materials, and metals, including steel, stainless, aluminum, and lead. It is suited for flexible circuits, semiconductors, EMI shielding, thermistors, wire tacking, and heating elements.

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Thermal Conductive Epoxy Adhesive cures at room temperature.

info@productnews.com (ThomasNet News) — Thu, 14 May 2009 08:30:59 -0500

Exhibiting thermal conductivity and electrical insulation properties, EP21TCHT-1 offers service operating temperature range of 4 K to 400°F. It adheres to metals, ceramics, woods, vulcanized rubbers, and most plastics, and provides bonds resistant to water, fuels, and most organic solvents. NASA qualified for low outgassing applications, adhesive is suited for use in vacuum environments. Product has mix ratio of 100-60 by weight and light paste viscosity.

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Halogen-Free Adhesives suit assembly of handheld electronics.

info@productnews.com (ThomasNet News) — Fri, 03 Apr 2009 08:38:25 -0500

Loctite® line of halogen-free adhesives and sealants are formulated to contain less than 900 ppm bromine and chlorine as well as 1,500 ppm total halogens. Product range includes cyanoacrylates, light cure cyanoacrylates, epoxies, urethanes, UV acrylics, silicones, hot melts, two-part acrylics, and anaerobics used for bonding, sealing, gasketing, and mounting range of components. All meet IPC IEC No. 61249-2-21 requirements.

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Clear Epoxy is for bonding and potting optical devices.

info@productnews.com (ThomasNet News) — Fri, 21 Nov 2008 07:41:34 -0500

Featuring viscosity of 700-800 cps, Master Bond EP29LP multi-purpose 2-part optical epoxy has low exotherm to peak of 120°F . It adheres to optical fibers, connectors, lenses, and glass and forms high strength bonds of more than 3,500 psi in shear. With temperature range of 60-250°F, epoxy has chemical resistance to water, fuels, acids, bases, and salts.

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One Part Epoxy Adhesive works in -60 to +450°F temperatures.

info@productnews.com (ThomasNet News) — Mon, 10 Nov 2008 07:47:00 -0500

Bonding to similar and dissimilar substrates, EP13 single-component epoxy adhesive requires no mixing and has unlimited working life at room temperature. It exhibits dimensional stability, is 100% reactive, and does not contain any solvents or diluents. Able to be applied to vertical surfaces without sagging or dripping, adhesive cures within 60-90 minutes at temperatures of 300 to 350°F. Readily machinable product, upon cure, obtains tensile shear strengths in excess of 3,500 psi.

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