ThomasNet Industrial Newsroom -

Adhesive gels within 45 sec and is cured within 5 minutes.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 26 Jun 2008 07:37:36 -0500

Formulated for general purpose bonding, Type EP50-1 produces high strength bonds with more than 2,000 psi at room temperature that are resistant to thermal cycling and chemicals including water, oil, and organic solvents. Suited for metals, glass, ceramics, wood, and vulcanized rubbers, product is approved for service over temperature range of -60 to more than 250°F. It comes in premeasured, flexible divider pouches, disposable cartridges, and in pint, quart, gallon, and 5 gal containers.

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Structural Epoxy Anchoring System meets IBC requirements.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 21 May 2008 07:43:24 -0500

Listed as category 1 product for uncracked concrete and dry holes, PE1000+ features 3:1 ratio holding power and meets International Building Code (IBC) requirements for strength design (Cracked Concrete). Dual-component system comes in 13 oz cartridge made from engineered plastic and can be dispensed with manually or pneumatically operated injection tool. Uses include anchoring threaded rod, bolts, reinforcing bars, and smooth dowels into concrete and other solid base materials.

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Epoxy Adhesive is suited for cryogenic applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 06 May 2008 07:40:41 -0500

With mix ratio of 100:65 by weight, EP29LPSP can withstand temperatures to 4 K, and resist cryogenic shocks (room temperature down to liquid helium temperatures in 5-10 min time period). It cures at room temperatures, and can be heat cured at 130-165°F for 6-8 hr. Chemical resistant adhesive features mixed viscosity of 400 cps, tensile strength of 6,500 psi, tensile modulus of greater than 375,000 psi, volume resistivity greater than 1,015 <font face='Symbol'>W</font> cm, and Shore D hardness of 80.

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Epoxy Resin System passes NASA's low outgassing test.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 06 May 2008 07:40:41 -0500

With ability to withstand temperatures up to 500°F, 2-component optically clear EP121CL cures to tough solid with chemical resistance even when exposed to adverse environmental conditions. It features 12,100 psi tensile strength, 17,200 psi compressive strength, volume resistivity greater than 3 x 1,014 ohm<font face='Symbol'>W</font> cm, dissipation factor of 0.020 at 1 MHz, and dielectric constant of 3.34 at 60 Hz. EP121CL is also available in 1-component and thermally conductive versions.

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Epoxy Adhesive offers impact and vibration resistance.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 06 May 2008 07:40:34 -0500

One-component, electrically conductive 40-3910 is formulated for electrical and mechanical bonding of semiconductor, capacitor, and resistor chips in micro and opto-electronic hybrid circuit fabrication. Product does not require dry ice during transit and cures quickly at low temperatures. It provides optimized retention of strength after environmental aging.

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Epoxy Flux can be used for advanced package configurations.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 21 Apr 2008 07:37:41 -0500

Reflow curable encapsulant material, Hysol® FF6000(TM), combines flux functionality and underfill protection into one solution. It is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. In-line approach eliminates neeed for dispensing equipment as well as time required for underfill application and cure. Areas of use include Package-on-Package device configurattions and/or large (23 x 23 mm or up) BGAs and CSPs.

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Thermally Conductive Epoxy withstands up to 400°F.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 18 Apr 2008 07:55:24 -0500

Used to bond aluminum panels and copper heat exchange tubes, Aremco-Bond(TM) 568 is aluminum-filled epoxy system that offers thermal conductivity of 9.0 Btu-in./hr-ft²-°F and flexural and tensile strength of 11,400 and 2,500 psi, respectively. Resistant to acids, bases, salts, and organic fluids, it mixes in 1:1 ratio by weight or volume, cures at room temperature or with low heat, and provides total mass loss of 0.75% at 125ºC and 0.35% of collected volatile condensable materials at 25ºC.

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High-Solids Epoxy targets marine applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 16 Apr 2008 07:45:40 -0500

Free of hazardous air polluting solvents, anti-corrosive SeaGuard 6200 can be applied at temperatures as low as 20°F, making it suited for vessel maintenance during winter lay-up. Product may be used on many prepared steel substrates, including bilges and wet void areas, decks and superstructures, and underwater hulls. Applied by brush, roller, or spray, coating is suited for fabrication and new construction along with maintenance and repair.

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Low-Expansion, Low-Odor Epoxy cures at room temperature.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 09 Apr 2008 07:44:11 -0500

Resistant to electricity, chemicals, and moisture, Duralco(TM) 4463 is 100% solid system that exhibits dimensional stability and adheres to glass, ceramics, metals, and plastics. This 500°F epoxy, suited for bonding and encapsulating applications, contains no VOCs and only requires users to mix and apply.

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Epoxy Resin offers dimensional stability.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 08 Apr 2008 07:55:14 -0500

Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic solvents over temperature range of -65 to +250°F.

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Adhesives are suited for magnet bonding.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 03 Apr 2008 07:36:34 -0500

Loctite® 331(TM) Structural Adhesive is acid-free, 2-step acrylic that fixtures in 20 sec and develops full strength in 30 min, bonding magnets and metals of all sizes. Designed for filling large gaps, Loctite® 3060(TM) Structural Adhesive is acid-free, 2-component, external-mix acrylic featuring 2 cascading adhesive streams that automatically mix together. Loctite® E-220IC(TM) Hysol® Epoxy Adhesive is acid-free, 1-component epoxy designed for induction cure operations.

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Epoxy Resin resists temperatures up to 500°F.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 31 Mar 2008 07:41:16 -0500

Designed for use in high performance composite structures and potting/casting applications, polyfunctional epoxy resin EP34CA can be combined with hardeners to provide low viscosity liquid which is suited for filament windings. Mechanical properties vs. time/temperature of unidirectional graphite composites based on Modmore Type II T fiber and matrix of EP34CA/EP34C yield flexural strength of 236,000 psi, flexural modulus of 17.8 x 106 psi, and interlaninar shear strength of 12,700 psi.

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Low Expansion Epoxy withstands temperatures to 500°F.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 31 Mar 2008 07:40:54 -0500

Offering dimensional stability, Duralco(TM) 4463 consists of 100% solid system that is mixed, applied, and cured at room temperature. Product resists electricity, chemicals, and moisture. With low odor and no VOCs, epoxy adheres to most glass, ceramics, metals, and plastics, and is suitable for bonding and encapsulated applications.

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Conductive Epoxy Adhesives offer cure times from 7-10 sec.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 18 Mar 2008 07:34:24 -0500

Featuring thermal stability and chemical resistance, 124-34A/B-187 consists of 2-component syringe dispensable, isotropically electrically conductive, epoxy adhesive, while 125-01A/B-187 offers 2-component syringe dispensable, anisotropically conductive version of product. Cure times as fast as 7-10 seconds can be achieved at elevated temperatures. Applications include assembly of electrical and electronic components.

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Potting Compound has flexible, low-viscosity formulation.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 07 Feb 2008 07:53:21 -0500

Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound exhibits electrical insulation properties and resistance to water.

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Conductive Adhesive withstands severe conditions.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 06 Feb 2008 07:55:55 -0500

Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300°F. Gel time at 300°F is 20-25 min while cure is 40-50 min at 347°F. Performance properties include volume resistivity less than 0.001 ohm-cm, surface resistance of less than 1 ohm/square, and thermal conductivity of 7.9 W/meter-°K.

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Two-Component Epoxy Adhesive gels in 3 minutes.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 05 Feb 2008 07:54:54 -0500

Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250°F range. Product adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics.

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Tougheners are based on self-assembling block copolymer.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 14 Jan 2008 07:28:24 -0500

Suited for use in amine, DICY, anhydride, and phenolic cured epoxy systems, FORTEGRA(TM) Epoxy Tougheners are available in 4 forms, and provide adhesion and corrosion and chemical resistance. FORTEGRA 100 is epoxy toughening agent, while FORTEGRA 383-50 and 383-5 are blends of D.E.R(TM) 383 liquid epoxy resin with 50 and 5 weight percent, respectively, of toughening material. Used in powder coatings, FORTEGRA 664-12 is 12 weight percent blend of toughening material in D.E.R. 664.

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Polymer System suits high temperature bonding applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 11 Jan 2008 07:29:27 -0500

One-component Polymer System EP11HT cures in 110 min at 250°F or 75 min at 300°F. It attains tensile shear strength of greater than 3,300 psi to form rigid and dimensionally stable bonds. Resistant to acids and solvents, service temperature range is -60 to 400°F and it bonds to substrates including metals, glass, ceramics, and plastics. EP11HT is available in pint, quart, 5 gal containers, and non-drip version EP11HTND-2.

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Underfill Material offers CSP and BGA support.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 12 Dec 2007 07:50:10 -0500

Suitable for laptops and gaming consoles that may experience only occasional vibration, 1-component Loctite® 3508 is pre-applied at corners of CSP pad site using standard dispensing system. It can be applied in-line with existing equipment with curing taking place during normal solder reflow process. Reworkable, lead-free compatible material enables total ball collapse and self-alignment properties to compensate for slight component-to-pad misalignment during placement.

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