ThomasNet Industrial Newsroom -

Spring Pin Socket addresses burn-in and test applications.

info@productnews.com (ThomasNet News) — Wed, 11 Nov 2009 08:39:26 -0500

Operating from -55 to +180°C, Model SBT-BGA-6505 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 80°C temperature rise. Featuring floating guide for precise ball to pin alignment, socket tests BGA packages with 17 x 17 mm body size, 0.8 mm pitch, and 20 x 20 ball array.

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Electronic Components and Devices

Search for suppliers of: Spring Sockets | Burn-In Sockets | Ball Grid Array (BGA) Sockets

BGA Socket Adapter accepts Samsung MCP memory device.

info@productnews.com (ThomasNet News) — Tue, 20 Oct 2009 08:41:17 -0500

Consisting of solder balls on bottom side and round pads on topside, Model SF-BGA199B-B-05 accommodates 0.65 mm pitch, 12 x 16 mm body, 18 x 22 array Samsung MCP KMYFE0C0CM-D300 memory ICs. If target circuit board already exists or mounting holes cannot be drilled into target board, then BGA SMT adapter can be used with Ironwood GHz socket. Constructed with high temperature FR-4, adapter assures match with target PCB's CTE and prevents failures that may occur with CTE mismatch.

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Mounting and Attaching Products
Electronic Components and Devices

Search for suppliers of: Socket Adapters | Ball Grid Array (BGA) Sockets

BGA Adapters connect 0.50 mm devices to 1.00 mm boards.

info@productnews.com (ThomasNet News) — Fri, 16 Oct 2009 08:40:24 -0500

Designed to adapt smaller pitch devices to larger footprints, Switch-A-Pitch Adapters eliminate need for laser-drilled microvias on motherboards while enabling use of standard line and trace spacing down to 0.003 in. Adapters have tops with BGA landing pads on 0.50 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch. Operating up to 221°F for FR4 or up to 266°F for lead-free, adapters feature non-solder mask defined pads finished with electroless nickel immersion gold.

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Mounting and Attaching Products
Electronic Components and Devices

Search for suppliers of: Socket Adapters | Ball Grid Array (BGA) Sockets | Printed Circuit Board (PCB) Connectors | Adapters

SMT Latched Header features positive retention latches.

info@productnews.com (ThomasNet News) — Wed, 02 Sep 2009 08:33:37 -0500

Picoflex® SMT Header incorporates positive retention latches to provide reliable wire-to-board connection with retention force necessary for rugged applications and high-vibration environments. Along with standard interface design, features include high-profile polarizing peg that eliminates possibility of header/receptacle mismating and polyphthalamide (PPA) housing material that enables header to tolerate reflow temperatures to +260°C.

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Electronic Components and Devices
Electrical Equipment and Systems Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!

Search for suppliers of: Surface Mount Headers | Pin Headers

Right Angle Sockets suit micro backplane applications.

info@productnews.com (ThomasNet News) — Mon, 24 Aug 2009 08:27:44 -0500

Right Angle SEARAY(TM) Open Pin Field Sockets (SEAF-RA Series) have .050 x .050 in. grid array for maximum grounding and routing flexibility and are optimized to reduce skew and impedance mismatch. They feature Edge Rate(TM) contacts, which are designed for optimal signal integrity, reduced broadside coupling and crosstalk, and high cycles. Sockets are available in 4-row (up to 200 contacts) and 6-row (up to 300 contacts) configurations.

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Electronic Components and Devices
Electrical Equipment and Systems Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!

Search for suppliers of: Contact Sockets | Printed Circuit Sockets | Interconnect Devices | Pin & Socket Connectors

Test Adapters support mulitple boards/tests on single slot.

info@productnews.com (ThomasNet News) — Fri, 24 Jul 2009 08:30:06 -0500

CompactPCI Test Adapters feature plug-in connections on 3 sides, optimizing access, and enable measurement and testing of CompactPCI assemblies in 3U and 6U Eurocard format. Modern BRIDGE design permits up to 3 CompactPCI cards and 1 standard PCI card to be inserted into 1 CompactPCI slot via test adapter. Unit can be used with CompactPCI boards up to 220 mm depth. It also offers Windows support and detects PCI devices via standard PCI BIOS with BIOS extension.

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Electronic Components and Devices

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Vertical Socket Connector has 0.1 mm lead coplanarity.

info@productnews.com (ThomasNet News) — Wed, 15 Jul 2009 08:31:55 -0500

RoHS-compliant, vertical surface-mount DDR2 DIMM socket connector, FCN-078J series uses precision stamping and molding technology to achieve 0.1 mm coplanarity before and after reflow. Available with footprint of 22.7 x 140 mm, 240-position unit has operating temperature range between -55 to +85°C, voltage rating of AC 25 V and maximum current rating of 0.5 A/contact. Suitable applications include blade servers, switches, routers, telecom racks, and test and measurement equipment.

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Electronic Components and Devices

Search for suppliers of: Dual Inline Memory Module (DIMM) Sockets | Card Edge Connectors | Surface Mount Connectors

Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.

info@productnews.com (ThomasNet News) — Tue, 23 Jun 2009 08:27:45 -0500

Designed for Burn-in and Test applications, SBT-BGA-7003 is stamped spring pin with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor has self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and temperature range of -55 to +180°C. Socket also features floating guide for precise ball to pin alignment, while current capacity of each contactor is 4 A at 80°C temperature rise.

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Electronic Components and Devices
Electrical Equipment and Systems Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!

Search for suppliers of: Ball Grid Array (BGA) Sockets | Contactors | Spring Sockets

BGA SMT Adapters are available in many different pin counts.

info@productnews.com (ThomasNet News) — Mon, 08 Jun 2009 08:30:33 -0500

Giga-snaP(TM) BGA SMT adapter pair consists of SF-BGA316C-B-62F female sockets with machined pins epoxy over-molded into assembly that matches male pin LS-BGA316C-61. Soldered to PCB using standard soldering methods without warping, SF-BGA316C-B-62F allows 0.8 mm pitch, 17 x 17 mm body, 20 x 20 array Analog Device ADSP-BF539/ADSP-BF539F ICs to be socketed and operate in demanding automotive applications. Both adapters are constructed with high temperature FR-4 bodies.

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Electronic Components and Devices
Mounting and Attaching Products

Search for suppliers of: Ball Grid Array (BGA) Sockets | Socket Adapters | Integrated Circuit Connectors | Printed Circuit Board (PCB) Connectors

Test Sockets handle small and fragile devices.

info@productnews.com (ThomasNet News) — Mon, 18 May 2009 08:40:04 -0500

Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on 0.30-0.35 mm pitch, 16 g/contact on 0.40-0.45 mm pitch, and 25 g/contact on pitches of 0.50 mm or larger.

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Test and Measuring Instruments
Electronic Components and Devices

Search for suppliers of: Test Sockets | Burn-In Sockets | Ball Grid Array (BGA) Sockets

BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.

info@productnews.com (ThomasNet News) — Fri, 15 May 2009 08:26:48 -0500

Suited for 15 x 15 mm package size, SG-BGA-6286 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Product can can handle up to 100 W with custom heat sink, and contact resistance is 20 m<font face='Symbol'>W</font>/pin. Constructed with high performance and low inductance elastomer contactor, unit features operating temperature range between -40°C to +100°C, pin self inductance of 0.15 µH, and current capacity of 2 A/pin.

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Electronic Components and Devices

Search for suppliers of: Contact Sockets | Ball Grid Array (BGA) Sockets | Integrated Circuit Sockets

Relay Sockets accept devices with I/O pins on .100 in. grid.

info@productnews.com (ThomasNet News) — Wed, 15 Apr 2009 08:35:50 -0500

Assembled with precision screw machine receptacles and packaged in high temperature thermoplastic insulators, series 110...10-00X (2-5) relay sockets can be exposed to reflow temperatures. They are available in 4, 6, 8, 14, and 16 pin configurations and use MM#1001 receptacles assembled with hi-rel, 4 finger #30 contact rated at 3 A. Available in RoHS and non-RoHS plating configurations, sockets are provided bulk in tubes and can be modified to meet application-specific requirements.

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Electronic Components and Devices

Search for suppliers of: Relay Sockets

Submounts and TVS Diodes increase UHB LED protection.

info@productnews.com (ThomasNet News) — Mon, 30 Mar 2009 08:32:23 -0500

Intended for use in ultra high brightness (UHB) LED lighting applications, LuxGuard products include silicon submounts that provide integrated ESD protection at levels exceeding 15 kV HBM (Human Body Model) while also helping cushion LED from stress due to thermal expansion coefficient differences between LED and lead frame. TVS diodes, available for customers who utilize ceramic submounts, mount next to LED die within LED fixture and deliver ESD ratings between 8 and 15 kV HBM.

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Electronic Components and Devices
Optics and Photonics

Search for suppliers of: Transient Suppressor Diodes | Laser Diode Submounts | LED Mounts

Socket holds 1,156-pin, 1 mm pitch BGA packages.

info@productnews.com (ThomasNet News) — Fri, 27 Mar 2009 08:38:07 -0500

Designed for 35 x 35 mm package size, SG-BGA-6230 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Sockets can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink, and connects all pins with 10 GHz bandwidth on all connections. Socket mounts to target PCB with no soldering and operates in temperatures from -40 to +100°C. It is manufactured with high-performance/low-inductance elastomer contactor.

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Electronic Components and Devices

Search for suppliers of: Integrated Circuit Sockets | Ball Grid Array (BGA) Sockets

QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.

info@productnews.com (ThomasNet News) — Wed, 04 Mar 2009 08:32:12 -0500

Mountable on any existing PCB, SG-MLF-7028 is designed for 9 x 9 x 1.6 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Unit features temperature range of -40 to +100°C, pin self inductance of 0.11 nH and mutual inductance of 0.028 nH, capacitance to ground of 0.028 pF, and 5 A/pin current capacity.

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Electronic Components and Devices

Search for suppliers of: Integrated Circuit Sockets | Printed Circuit Sockets

BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.

info@productnews.com (ThomasNet News) — Tue, 24 Feb 2009 08:34:09 -0500

Suited for 27 x 27 mm package size, CG-BGA-4002 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. It can handle up to 100 W with custom heat sink, and has contact resistance of 20 m<font face='Symbol'>W</font>/pin. Constructed with high performance and low inductance elastomer contactor, unit features temperature range of -40 to +100°C, pin self-inductance of 0.11 nH, mutual inductance of 0.028 nH, 0.028 pF of capacitance to ground, and current capacity of 5 A/pin.

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Electronic Components and Devices

Search for suppliers of: Integrated Circuit Sockets | Ball Grid Array (BGA) Sockets

PCB Connection System supports applications to 30.0 A.

info@productnews.com (ThomasNet News) — Mon, 23 Feb 2009 08:33:15 -0500

Providing single and multi-pocket PCB solutions, Stac64(TM) Connection System is based on 0.64 mm terminal and includes 8-, 12-, 16-, and 20-circuit connections in vertical and right-angle headers. Ten-circuit version, supporting power applications for 1.50 and 2.80 mm terminal systems, is also available in vertical and right-angle configurations. Stackable system is based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications.

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Electronic Components and Devices
Electrical Equipment and Systems Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!

Search for suppliers of: Printed Circuit Board (PCB) Connectors | Electronic Headers

Box Headers and Mates minimize possibility of mismating.

info@productnews.com (ThomasNet News) — Mon, 16 Feb 2009 09:09:41 -0500

Engineered for board-to-board or board-to-cable connections, dual-row SBH Series Fully Shrouded Box Headers come in 1.27 x 1.27, 1.27 x 2.54, 2, and 2.54 mm versions, with straight or right angle dip solder terminations. Units have current ratings of 1-3 A max per contact and are available in 3-50 positions. Provided in corresponding contact positions with box headers, SFH Series Female Mates may be ordered with polarizing keys to ensure proper mating alignment.

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Electronic Components and Devices

Search for suppliers of: Surface Mount Headers | Board To Cable Connectors | Board To Board Connectors

Transistor Sockets facilitate field insertion and removal.

info@productnews.com (ThomasNet News) — Tue, 03 Feb 2009 08:31:43 -0500

Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize high-temperature thermoplastic suitable for wave-soldering and reflow soldering.

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Electronic Components and Devices

Search for suppliers of: Transistor Sockets

Hybrid Socket provides test or burn-in down to 0.30 mm pitch.

info@productnews.com (ThomasNet News) — Thu, 15 Jan 2009 08:35:05 -0500

CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact on 0.80 mm pitch or larger. Operating temperature is from -67 to +302°F.

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Electronic Components and Devices

Search for suppliers of: Printed Circuit Sockets | Integrated Circuit Sockets