ThomasNet Industrial Newsroom -

BGA Socket has cycle life of 500,000 insertions.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 12 Sep 2008 07:36:31 -0500

Designed for 11 x 11 mm, 0.65 mm pitch, 15 x 15 array 225 balls, ASE 225 LTFBGA SS-BGA225G-01 is 10 GHz high endurance socket that can be used for hand test and burn-in applications. With 16 g actuation force per ball and -40 to +150°C temperature range, spring pin contactor has self inductance of 1.3 nH, insertion loss of less than 0.25 dB at 4.5 GHz (less than 3dB at 10GHz), capacitance of 0.53 pF, and 2.5 A current capacity.

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Test Sockets accommodate devices with pitches down to 0.3 mm.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 12 Sep 2008 07:36:15 -0500

RF test sockets, for use with PCBs, and CSP/BGA test and burn-in sockets, for use with burn-in-boards (BIB), feature solderless, gold over nickel-plated pressure mount compression spring probes that are mounted with 4 SS screws, which allows for height variations in device thickness. Units also include 4-point spring probe crown to insure scrub on solder ball oxides. Signal path during test is 0.977 in. and units operate from -67 to +302°F and accommodate up to 500,000 cycles.

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BGA Socket accommodates devices up to 6.5 mm².

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 28 Aug 2008 07:42:31 -0500

Suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices, CSP/MicroBGA Test and Burn-In Socket accommodates up to 500,000 cycles and operates from -67 to 302°F. It offers solderless pressure mount compression spring probes which allow sockets to be mounted to and removed from burn-in-board (BIB). Unit also features pressure pad compression spring that provides proper force against device and allows for height variations in device thickness.

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PCB Test Points are offered in 3 sizes and 10 colors.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 04 Aug 2008 07:51:57 -0500

Featuring 0.125 or 0.100 in. centers, TP-104, -105, and -106 test points can accommodate 0.062 in. thick PCBs. Provided precut to any of 30 positions, loop-style TP-104 and oval-loop style TP-106 test points feature 0.063 in. mounting holes, while TP-105 is available in up to 40 positions, has loop profile for positive loop retention, and fits into 0.035-0.042 in. hole. Devices are designed to ensure secure, non-slip grip of alligator clips, probes, J-hooks, tips, and grabbers.

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Test Socket is designed for devices up to 13 sq mm.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 14 Feb 2008 07:14:23 -0500

Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch.

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Center Probe Test Socket handles devices up to 13 mm².

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 07 Feb 2008 07:53:29 -0500

Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, socket is suited for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40 mm. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch. Measuring 1.200 x .840 x .440 in., unit provides minimal signal loss for high bandwidth capability via signal path of 0.077 in.

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Clamshell Burn-In Socket accommodates QFN packages.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 07 Nov 2007 07:47:59 -0500

Able to accept QFN packages down to 0.35 mm pitch, 880 Series features compression mount clamshell that allows chipmakers to remove or replace sockets and retain production capacity if they were to be damaged. Specifications include beryllium copper alloy contact, gold contact plating, 20 g contact force, temperature rating of -40 to 155°C, and durability of 30,000 cycles. Socket's wiping-action contact works to create consistent resistance during burn-in, reducing maintenance.

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RTU Testing Tool targets network technicians.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 17 Oct 2007 07:46:31 -0500

With NetGuardian 3288 Test Fixture, network technicians can self-diagnose problems within their own network monitoring. Unit allows for testing of complete monitoring system: remote, transport, and alarm master. Tool has 32 discrete alarm toggles, 8 analog knobs, and 8 control relay LEDs. While discrete alarms indicate only alarm or clear states, analog inputs allow detailed monitoring of temperature, humidity, battery levels, and other analog values.

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RF Sockets suit devices with pitches as low as 0.40 mm.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 15 May 2007 07:35:16 -0500

High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mm², 14-27 mm², 28-40 mm², and 41-55 mm². With -55 to +150°C operating temperature range, products are used in applications such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with speeds from 1 to more than 10 GHz.

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Test Socket suits devices from 28 to 40 mm².

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 24 Oct 2006 07:51:11 -0500

Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25 g per contact for 0.50 mm pitches and larger.

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HDMI Test Point Access Fixture measures waveform parameters.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 08 May 2006 08:07:49 -0500

With measurement bandwidth beyond 6 GHz and rise times below 100 ps, N1020A fixture is used in conjunction with Infiniium Oscilloscopes and HDMI Transmitter Compliance Test solution for consumer electronics. Available in K12 and K13 options, it supports test needs for HDMI as specified in HDMI Compliance Test Specification 1.2a. Product is available in Plug-End or Receptacle-End models.

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Test Fixtures evaluate mechanical properties of wood.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 11 Apr 2006 08:06:24 -0500

Designed for static bend/flexure testing on wood and timber products, 2820-04x Series bend fixtures come in 10 and 50 kN capacities with 800 and 1,200 mm max span lower beams. Shear fixture 2820-060, featuring specimen clamp and interchangeable shims, measures compressive shear strength of wood and adhesive products. Incorporating self-aligning coupling and rotatable lower grip, 2820-061 internal bond fixture measures force needed to separate internal wood fibers in chipboard and fiberboard.

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IC Socket tests high-speed devices.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 09 Mar 2006 07:06:10 -0500

Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75, 0.8, 1, and 1.27 mm pitches.

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Test Socket suits devices from 28-40 mm².

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 15 Jul 2005 08:08:09 -0500

Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80 mm pitches and larger.

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Test and Burn-In Socket suits applications up to 1 GHz.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 01 Jul 2005 07:52:23 -0500

Test and Burn-In Socket accommodates devices from 41-55 mm² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as CSP, MicroBGA, LCC, LGA, QFP, QFN, and MLF packages.

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Center Probe Socket debugs range of package types.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 15 Dec 2004 07:58:51 -0500

Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for SRAM and DRAM packages.

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Motor Fixture accommodates 6 in. dia. motors.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 12 Mar 2004 07:51:09 -0500

Adjustable Motor Fixture locates and holds motor in place for running any test, while maintaining center height required for coupling to company's HD-106 through HD-715 Hysteresis Short Base Plate Dynamometer. Lead screw adjustment provides centering for motor while T-Slot Base supplies multiple position options for various motor lengths. Adjustable bridge provides clamping anywhere along axis of motor and thumbscrew protects against vibration.

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Test Socket tests devices from 14 to 27 mm² wide.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 16 Oct 2003 08:17:28 -0500

RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Operating temperature is -67 to 302°F.

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Test and Burn-In Socket suits applications under 1 GHz.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 26 Sep 2003 08:14:44 -0500

Designed for use with devices from 14-27 mm², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302°F. Based on device with 0.50 mm pitch, pin inductance is 0.75 nH Max, mutual inductance is less than 0.15 nH, and mutual capacitance is 0.03 pF max.

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Center Probe Test Socket suits devices to 13 mm².

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 09 Sep 2003 07:41:18 -0500

RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80+ mm pitches.

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