ThomasNet Industrial Newsroom -

Fan/Heatsink Assembly comes with 3 embedded heatpipes.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 20 Aug 2008 07:36:36 -0500

Combining forging and heatpipe technology, Model HS-008 fan/heatsink combo delivers 0.08ÂºC/W in compact 160 x 160 mm footprint. It has segmented high density fins that break down laminar flow layers periodically along flow path to increase turbulence. Suited for high power IGBTs, power converter modules, and high power laser sources, unit is available with 2 high power 60 mm fans, one fan duct, and one terminal block for connection to power supplies.

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Computer Hardware and Peripherals
HVAC
Thermal and Heating Equipment Sponsored by: TEMPCO - Electric Heater Corporation

Search for suppliers of: Fan Component Parts | Heatsink Assemblies

Low-Noise CPU Cooler exhibits 16-25 dBA during operations.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 23 Jul 2008 07:35:52 -0500

Measuring 137 x 120 x 123 mm, Triton 85 is designed with top flow 120 mm fan and features high-density fins, dynamic fan speed control, and 4 pure copper heat pipes. PWM function controls fan speed (1,400 rpm Â±10%) depending on CPU temperature. Suited for users who need to overclock past 130-180 W and retain quiet operation, cooler supports IntelÂ® Core(TM)2, Core(TM)2 Quad/Duo, and PentiumÂ® processors as well as AMD Athlon(TM) 64/X2/FX and Phenom(TM) FX/X2/X4 processors.

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Computer Hardware and Peripherals
HVAC

Search for suppliers of: Central Processing Unit (CPU) Coolers

Copper-Encased Vapor Chambers cool microprocessors.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 25 Mar 2008 07:37:41 -0500

NanoSpreader Vapor Chambers are 2-phase chambers into which pure water is vacuum-sealed, absorbed by copper wick, and passed as vapor through micro-perforated copper sheet and returned as liquid to wick. Contained in packages from 1.5-70 mm, they attach directly to heat source and can cool power densities up to 150 W/cm<sup>2</sup> while offering multidirectional thermal spreading as low as 0.02Â°C/W. Units can withstand clamping forces up to 90 psi and repeated exposure from -40 to +100Â°C.

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Computer Hardware and Peripherals
HVAC

Search for suppliers of: Electronic Component Coolers | Central Processing Unit (CPU) Coolers

Heat Spreader Substrates are suitable for VLED applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 17 Mar 2008 07:36:56 -0500

Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/mÂ°K thermal conductivity, and 1.8Â°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in.

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Computer Hardware and Peripherals
Materials and Material Processing

Search for suppliers of: Heat Dissipators | Substrates

Memory Module Cooler uses integrated heat pipe.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 22 Feb 2008 07:45:43 -0500

Available in black, blue, and plain aluminum, HXR-5500 features aluminum extrusion heatsink with integrated 5 mm dia heat pipe used to cool memory modules. Heat pipe transports heat from memory module onto detached aluminum heat sink on top of module. By using this product, memory module temperature can be reduced by 13 to 14Â°C.

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Computer Hardware and Peripherals
Thermal and Heating Equipment Sponsored by: TEMPCO - Electric Heater Corporation

Search for suppliers of: Aluminum Heat Sinks

Thermoelectric Cold Plate suits high-power fiber lasers.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 16 Jan 2008 07:35:00 -0500

Intended for fiber laser OEM or laboratory cooling applications, Model OCP-110 provides 110 W cooling capacity when set temperature is same as ambient. Set temperature can be 48Â°C below ambient when heat load is zero. All thermoelectric coolers in device are environmentally sealed so that OCP-110 can operate at below dew point set temperatures. Side-cooled by ducting air through high-density heatsinks, copper plate accommodates lasers made by QPC, LIMO, and nLight.

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Computer Hardware and Peripherals

Heat Sinks cool 17 x 17 mm BGA packages.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 02 Apr 2007 07:47:32 -0500

Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42Â°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11Â°C/W, and employs maxiGRIP(TM) attachment solution with plastic frame clip that snaps securely around chip.

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Computer Hardware and Peripherals

Search for suppliers of: Heat Sinks

Heat Sinks help cool linear LED lighting products.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 06 Feb 2007 07:02:49 -0500

Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape or without, products have been tested on OSRAM's DRAGONstickÂ® LEDs.

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Computer Hardware and Peripherals

Search for suppliers of: Heat Sinks

Heat Sink cools communications processors.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 31 Jan 2007 06:56:56 -0500

Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7Â°C/W at its base in air velocity of 200 fpm. Made from black anodized aluminum, heat sink features 14 integral linear fins, 0.5 mm thick, to maximize cooling surfaces in local airflow. Unit is preassembled with ATS maxiGRIP(TM) mounting system.

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Computer Hardware and Peripherals

Search for suppliers of: Heat Sinks

Graphics Cooler features micro thermofluidic core.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 07 Dec 2006 07:42:56 -0500

Iceon(TM) 1000CG graphics card cooling product offers manufacturers of graphics cards, boards, and PCs quiet operation while maintaining very low temparatures. Product includes fan packaged with NanoSpreader(TM) thin and light heat spreader technology, which enables slow fan speeds to increase fan life and decrease noise.

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Computer Hardware and Peripherals
HVAC

Search for suppliers of: Electronic Component Coolers | Central Processing Unit (CPU) Coolers

Cooler suits heat-intensive consumer and gaming CPUs.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 26 Oct 2006 07:45:40 -0500

With micro thermofluidic casing, Iceon(TM)1000C desktop cooler is built for cooling computers that are used for heat-intensive graphic and video-rich processing applications. Cooler includes fan along with lightweight 2-phase NanoSpreader(TM) heat spreader which uses razor-thin plates or tubes that integrate with any electronic device. Product offers quiet operation under extreme conditions.

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Computer Hardware and Peripherals
HVAC

Search for suppliers of: Electronic Equipment Coolers | Central Processing Unit (CPU) Coolers

Heat Sinks cool Freescale MPC8641D dual-core processors.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 31 Aug 2006 07:53:41 -0500

Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51Â°C/W with thermal grease. Developed to cool Freescale processors in restricted height enclosures, Anchorage ATS-474 Passive Heat Sink features maxiFLOW(TM) angled fin technology with thermal resistance of 1.05Â°C/W in air velocity of 100 lfm and 0.49Â°C/W in air velocity of 400 lfm.

This story is related to the following:
Computer Hardware and Peripherals
Thermal and Heating Equipment Sponsored by: TEMPCO - Electric Heater Corporation

Search for suppliers of: Printed Circuit Board (PCB) Heat Sinks

Heat Sink cools BGA components in low airflow conditions.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 01 Aug 2006 08:05:39 -0500

Measuring 9 mm in height, Model EX2 is suited for use inside enclosures where space is limited. Case-to-ambient thermal resistance is 1.8Â°C/W within air velocity of 600 fpm. Unit can be securely attached to component with double-sided, thermally conductive adhesive tape. No mechanical hardware is required.

This story is related to the following:
Computer Hardware and Peripherals
Thermal and Heating Equipment Sponsored by: TEMPCO - Electric Heater Corporation

Search for suppliers of: Low Profile Heat Sinks

Heat Sinks cool condensed electronic packages.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 24 Jan 2006 07:13:03 -0500

Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.

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Computer Hardware and Peripherals
HVAC

Search for suppliers of: Heat Sinks | Cooling Devices

Heat Sinks cool components in low air flow conditions.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 22 Apr 2005 07:45:32 -0500

Measuring 4â�"7 mm in height, blueICEâ"¢ Heat Sinks feature thermal resistance as low as 1.23Â°C/W within air velocity of 600 fpm. Double-sided, thermally conductive adhesive tape can be used to attach heat sinks securely to components so no mechanical hardware is needed. Units are suited for use inside most telecommunications enclosures where space is limited.

This story is related to the following:
Computer Hardware and Peripherals
Thermal and Heating Equipment Sponsored by: TEMPCO - Electric Heater Corporation

Search for suppliers of: Low Profile Heat Sinks

Heat Sinks cool DC/DC converters in low-airflow conditions.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 15 Mar 2005 07:40:21 -0500

Low-profile powerICEâ"¢ heat sinks optimize thermal management of PCB-mounted power modules in spatially-constrained applications with bypassed and unducted flow conditions. Measuring 58 x 61 x 4â�"7 mm, products have aluminum fins and base and exhibit thermal resistance down to 1.23Â°C/W with air velocity of 600 fpm. They are provided with double-sided, thermally conductive adhesive tape for assembly without fasteners.

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Computer Hardware and Peripherals

Search for suppliers of: Heat Sinks

Cold Plates are fully compatible with water coolant.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 29 Aug 2003 07:43:22 -0500

Ascentâ"¢ Series all-copper cold plates provide contact cooling of high watt-density electronic components such IGBTs, MOSFETs, resistors, and diodes. Normalized thermal resistance at 1 gpm is 0.58Â°C inÂ²/W, and pressure drop at 0.5 gpm is 3 psi. Internal crisscrossed fin structure offers increased surface area. Available with straight or beaded fittings, plates are pressure tested to 30 psi and have maximum operating temperature of 125Â°F.

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Computer Hardware and Peripherals

Heat Sinks are suited for use with power modules.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 12 Aug 2003 07:35:01 -0500

Low-profile powerICEâ"¢ heat sinks optimize thermal management of pcb-mounted power modules in spatially constrained applications with inadequate airflow. Offered with 100, 200, 400, and 600 ft/min velocities, products provide resistance values from 1.23â�"14.0 Rca. Suited for bypassed and unducted flow conditions, units are offered in 6 package sizes from 7 x 58.2 x 61 to 4.0 x 58.2 x 36 mm.

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Computer Hardware and Peripherals

Search for suppliers of: Heat Sinks

Cold Plates suit high-watt density applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 09 Aug 2002 07:57:39 -0500

High Performance Seriesâ"¢ cold plates offer corrugated aluminum fins, which provide heat transfer surface. Vacuum brazing produces parts with uniform thermal conductivity over large surface area. Cold plates may be customized to any application and are available in sizes from 4 to 700 inÂ² (as thin as 0.10 in.). They are manufactured by inserting aluminum fin into aluminum plate with machined cavity. Plate, lid, and fin are joined with vacuum brazing.

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Computer Hardware and Peripherals

Cold Plates fit in small spaces.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 07 Jun 2002 07:37:43 -0500

Press-Lock IIâ"¢ series uses smaller, tightly packed tubes to improve thermal performance by 40 to 50% over companyâ�(TM)s previous models. Plates are 0.3 in. thick and tubes are 0.25 in. dia, allowing for tight packaging and stack construction. Tubes are coplanar with plate, allowing parts to be mounted on both sides. Applications include cooling electronics, power supplies, lasers, RF transmitters, semiconductor processing equipment, thermoelectrics, and UPSes.

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Computer Hardware and Peripherals