ThomasNet Industrial Newsroom -

Ultrasonic Wire Splicer utilizes two welding heads.

info@productnews.com (ThomasNet News) — Wed, 11 Mar 2009 08:33:53 -0500

Able to accommodate tinned or heavily oxidized wires, Dual Head SpliceRite(TM) welds wire bundles that have cross-sectional areas of up to 100 mm². It comes with 3,500 W power supply and utilizes Wedge-Reed system, which directs high frequency ultrasonic energy via welding tips to wires to be welded. Welding heads on each side of weld area enables accelerated splicing of large wire bundles. Up to 250 jobs can be stored/recalled, and welds may be controlled by height, energy, or time.

This story is related to the following:
Welding Equipment and Supplies
Materials and Material Processing
Machinery and Machining Tools

Search for suppliers of: Ultrasonic Welders | Bonding Machinery | Wire Splicers | Splicing Machinery

Desktop Bonder features motorized X-, Y-, or XY-axis table.

info@productnews.com (ThomasNet News) — Fri, 24 Oct 2008 07:44:49 -0500

Unitek Eapro DT-500-PH Desktop Hot Bar Bonding System is suited for applications which require hot bar bonding multiple parts in array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both PCB and LCD. System includes Uniflow2 power supply for selective hot bar soldering, heat sealing, and conductive adhesive bonding applications. Utilizing pulsed heat technology, it provides targeted heating/precision temperature control for flex circuits, ribbon cables, and wires.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Hot Bar Soldering Equipment | Hot Bar Bonders | Wire Bonders | Hot Bonders

Wire Bonders include programmable power supply system.

info@productnews.com (ThomasNet News) — Tue, 25 Mar 2008 07:38:47 -0500

With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Wire Bonders

Placement and Bonding System covers range of processes.

info@productnews.com (ThomasNet News) — Thu, 14 Jun 2007 07:34:30 -0500

Suited for R&D laboratories, universities, and pre-production environments, KADETT provides flexible and open platform for assembly and bonding of devices on variety of substrates. Semi-automatic machine performs accurate pick-and-place functions, and accurate alignment is achieved via vision system with 2 independent video microscopes and high-resolution (0.1 µm) XY alignment stage. Various bonding processes are available for forces up to 75 N.

This story is related to the following:
Materials and Material Processing
Robotics

Search for suppliers of: Bonding Machinery | Pick & Place Units

Capillary is suited for fine pitch wire bonding.

info@productnews.com (ThomasNet News) — Fri, 22 Dec 2006 07:46:44 -0500

Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

This story is related to the following:
Machinery and Machining Tools
Materials and Material Processing
Laboratory and Research Supplies and Equipment

Search for suppliers of: Capillaries | Wire Bonders | Semiconductor Processing Equipment

Ultrasonic Bonder assembles 50-80 filter bags per hour.

info@productnews.com (ThomasNet News) — Thu, 05 Jan 2006 07:06:35 -0500

Suited for chemical and industrial liquid applications, Filter Collar Bonder(TM) ultrasonically attaches rigid plastic circular frames to non-woven filter bags using SureWeld 20(TM) technology. Operator loads plastic ring and filter bag onto center fixture. Start button is activated causing welding head to close on part, ultrasonically weld it, and retract. Operator then manually rotates center fixture 60° and repeats process 6 times to achieve 360° weld.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Bonding Machinery

Stud Bumper targets flip chip market.

info@productnews.com (ThomasNet News) — Thu, 31 Mar 2005 09:20:19 -0500

Using hardware and software technology, ATPremier Stud Bumping Machine bonds 36 standard bumps/sec at 60 µm pitch. Since stud bumping does not require under bump metallurgy, bonding can be performed in single step. Wafer-Mapping interface bonds only known good die.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Flip Chip Bonders | Die Bonders

Portable Hot Bonder utilizes Windows®-like interface.

info@productnews.com (ThomasNet News) — Wed, 02 Mar 2005 07:43:20 -0500

Advanced Composite Repair (ACR) 2 Hot Bonder provides users with everything needed to perform composite and metal bond repairs in one suitcase. To facilitate programming, unit is equipped with color touchscreen, software, and USB data port. Product is offered with vacuum venturi pump, or electric vacuum pump for self-contained system.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Hot Air Bonders

Capillary Flip-Chip Underfill suits lead-free assemblies.

info@productnews.com (ThomasNet News) — Fri, 30 Apr 2004 07:44:52 -0500

Hysol® FP4547FC is compatible with clean and no-clean flux residues. It protects lead-free flip-chip devices and allows them to meet JEDEC Level 3/260°C moisture test requirements. Incorporating 2 additives that remove and neutralize flux residues from between flip-chip die and substrate, product provides moisture resistance and facilitates assembly process. In most cases, post-assembly flip-chip cleaning processes may be eliminated.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Flip Chip Bonders | Undercoatings

Capillary suits copper wire bonding applications.

info@productnews.com (ThomasNet News) — Thu, 22 Apr 2004 07:40:48 -0500

CuPRAâ"¢ handles copper wire from 0.8â�"3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Wire Bonders

DVD Bonding System provides 1,000 W/cm² peak pulse power.

info@productnews.com (ThomasNet News) — Tue, 02 Mar 2004 07:39:17 -0500

CoolCureXL-DVD® Bonding System features pulsed UV curing lamps capable of 0.6 sec cure times for DVD-5 formats. Tilt management is achieved using lamps on top and bottom during curing process. Eliminating need for DVD repositioning while curing, system uses spiral-shaped lamps that match DVD profile and expose full disc to 1,000 W/cm² peak pulse power. Pulsed UV curing lamps provide instant on/off and cool operation.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Bonding Machinery

IC Ball Bonder offers 35 µm fine pitch capability.

info@productnews.com (ThomasNet News) — Tue, 13 Jan 2004 07:37:49 -0500

MaxµmplusT Ultra High Speed Ball Bonder incorporates 2.20 x 2.60 in. bonding area, S-Scan imaging technology, µT-Sonicsâ"¢ transducer, and Precision-Arcâ"¢ EFO system. Servo control system for X-Y Table reduces wire cycle times to 63.0 msecs, and Precision-touchT bondhead technology delivers optimum bond force control. Teaching and calibration software delivers bond placement accuracy to 2.5 µm, and wire feed path handles wire diameters down to 15 µm.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Wire Bonders

Heat Vacuum Applicator offers complete temperature control.

info@productnews.com (ThomasNet News) — Thu, 25 Sep 2003 08:03:19 -0500

AppliPhase HVA enables operators to set control unit for temperature and length of exposure to ensure correct bonding of flexible back-light signage transfers, reflective sheeting, Panaflex signs, backlit awnings, traffic signs, and premask application tape. Features include steel construction and oil-free vacuum pump. Lamp bank and diaphragm may be raised to offer clearance for handling of materials. No special operator training is required.

This story is related to the following:
Machinery and Machining Tools
Materials and Material Processing

Search for suppliers of: Bonding Machinery | Bonding Presses

Flip Chip Bonder offers 8 micron placement accuracy.

info@productnews.com (ThomasNet News) — Mon, 08 Sep 2003 07:39:08 -0500

Mach FC Plus is based on parallel processing, gantry machine platform designed for high-speed bonding. Picking, flipping, fluxing, vision alignment, and controlled die placement are performed with asynchronous parallel motion. Automatic 300 mm wafer changer is compatible with wafer cassette docking carts. Bonder includes closed-loop placement force control, flux dipping station, up to 53 mm² die handling capability, and advanced vision and lighting.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Flip Chip Bonders

Die Bonder suits semiconductor/electronic packaging markets.

info@productnews.com (ThomasNet News) — Thu, 31 Jul 2003 07:17:33 -0500

Able to provide assembly solutions for epoxy die attach, eutectic, and flip chip bonding, MRSI-605 AP Advanced Packaging Die Bonder is based on MRSI-505 platform. Machine includes 6-head, feather-touch tool turret that rotates through full 360° of orientation to align dies no matter how they are presented to system. It also provides feather touch force control with closed loop force feedback, Windows® GUI, XML formatted database, and various vision tools.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Die Bonders

Capillary bonds thicker wires in fine pitch uses.

info@productnews.com (ThomasNet News) — Wed, 28 May 2003 08:15:10 -0500

CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and consistent distribution of inter-metallic coverage.

This story is related to the following:
Materials and Material Processing
Laboratory and Research Supplies and Equipment

Search for suppliers of: Capillaries | Wire Bonders

Bonders cut and seal in one pass without consumables.

info@productnews.com (ThomasNet News) — Fri, 21 Jun 2002 08:52:22 -0500

SureWeld 20 kHz ultrasonic plunge welders can assemble cylindrical filters from pleated HEPA filter media. In overlapping applications, ultrasonic welders bond and trim edges of pleated filter media in one step to create 10 in. filter tube, which maintains HEPA rating. SureWeld bonders feature rectangular support columns, which eliminate deflection and keep filter unit in perfect alignment during assembly process.

This story is related to the following:
Materials and Material Processing
Welding Equipment and Supplies

Search for suppliers of: Bonding Machinery | Ultrasonic Welders

Charging System bonds materials electrostatically.

info@productnews.com (ThomasNet News) — Mon, 06 May 2002 11:07:41 -0500

Model 3000 Autostat(R) uses forces of static electricity for adhering one material to another, such as temporary bonding of protective covering to metal sheets or wood paneling, spot pinning of over-wrapping material prior to heat sealing, edge pinning of web to einsure constant direction, and removal of air pockets during laminating. Power supply has variable output to insure highest degree of bonding necessary to complete holding process.

This story is related to the following:
Materials and Material Processing

Search for suppliers of: Bonding Machinery