ThomasNet Industrial Newsroom -

Substrates supports sub-45 nm applications and architectures.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 25 Jul 2008 07:42:28 -0600

Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to ±10 Angstroms. Top silicon layer of wafers is available in thicknesses ranging from 20-110 nm, while BOX can be as thin as 10 nm. Substrates are suited for partially depleted and fully depleted devices, including multi-gate transistor architectures.

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Materials and Material Processing

Search for suppliers of: Silicon Wafers | Substrates

Aluminum Substrate offers thermal management for power LEDs.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 16 May 2008 07:35:12 -0600

Consisting of thermally conductive aluminum alloy substrate with thermally conductive glass dielectric material, Anotherm® Plus withstands high voltages, and enables increased light output for LEDs. Anodized aluminum material provides thermal transfer for LED assemblies that are mounted directly onto substrates. Applications include vending machines, outdoor signage and display, aquarium lighting, emergency vehicle lighting, as well as architectural and general lighting.

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Materials and Material Processing

Search for suppliers of: Metal Insulated Substrates | Dielectric Materials

Heat Spreader Substrates are suitable for VLED applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 17 Mar 2008 07:36:56 -0600

Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in.

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Computer Hardware and Peripherals
Materials and Material Processing

Search for suppliers of: Heat Dissipators | Substrates

Ceramic Support Media resist thermal shock and spalling.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 03 Mar 2008 07:49:52 -0600

KRYPTOKNIGHT(TM) inert ceramic support media for catalyst beds suits chemical processing, ethanol, oil, gas, and petrochemical refining. KRYPTOKNIGHT A is 99% alumina ceramic support media, and is suited for processes where steam may cause leaching of silica. Used in fixed-bed conditions, KRYPTOKNIGHT H aluminosilicate ceramic support media has 23% alumina content. KRYPTOKNIGHT M aluminosilicate ceramic support media suits molecular sieve and desiccant dryer applications.

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Materials and Material Processing
Printing and Duplicating Equipment

Search for suppliers of: Dense Heat Exchanger Ceramic Honeycomb Catalyst Supports | Heat Transfer Equipment | Heat Conductive Ceramics

Pin Fin Coolers suit hybrid vehicle IGBT applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 03 Mar 2008 07:49:41 -0600

Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling. Product also facilitates IGBT assembly by eliminating need for stress compensation layers.

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Materials and Material Processing

Search for suppliers of: Substrates | Metal Matrix Composites

Sapphire Optics can be customized for critical applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 12 Dec 2007 07:49:59 -0600

Customized Sapphire optics are available as lenses, windows, domes, prisms, tubes and rods in various sizes and as balls measuring 0.1 mm to 1/2 in. dia. with 0.000025 in. per ball sphericity. Surface finishes come in 20-5 scratch-dig, flatness to 1/4 wave, and parallelism from 20 to 2 arc/secs. Options include drilled holes, slots, wedges, stepped edges, elliptical edge shaping, metallization, and A/R coatings featuring Moh 9 hardness for use in critical applications.

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Materials and Material Processing
Optics and Photonics

Search for suppliers of: Sapphire Windows | Sapphire Substrates | Sapphire Balls | Optical Components

Catalyst Substrates utilizes porous structure.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 03 Dec 2007 07:42:17 -0600

Models NEXT(TM) and VORTEX(TM) substrate catalysts work with round and rectangular catalyst elements respectively. These models feature porous design to fosters resistance to telescoping, and increased catalyst performance while still accommodating back pressure limits. NEXT(TM) substrate utilizes foil grooves to interrupt air flow and create more turbulence for metal-pollutant mixing. VORTEX(TM) substrate uses angled overlapping channels to create similar airflow turbulence.

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Materials and Material Processing

Search for suppliers of: Catalysts | Substrates

Bendable Substrate can reach 6 in. radius.

info@productnews.com (ThomasNet Industrial Newsroom) — Fri, 16 Nov 2007 07:54:43 -0600

Featuring 2-ply construction, econoKORE offers balanced panel that is calibrated for consistent size and thickness. It can be bent and attached to ribbed frame by use of nails and is installed with traditional fabricating tools and methods. Sizes include ¼, 3/8, and ¾ in. thicknesses with MDF core and poplar plywood face in 4 x 8 and 8 x 4 ft panel sizes. Additionally, ¼ and 3/8 in. versions are available with high-density fiberboard face. Boards weigh 1 lb/ft².

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Materials and Material Processing
Architectural and Civil Engineering Products Sponsored by: Siemens Corporation - Banner w/DoubleClickTags

Search for suppliers of: Substrates | Architectural Panels

Bendable Substrate targets radius applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 07 Nov 2007 07:48:02 -0600

Suitable for producing stable architectural panels, FlexGreen is environmentally friendly with no added formaldehyde in face, core, or glue. Face is made from FSC certified eucalyptus fiber hardboard attached to particleboard substrate core made from 100% recovered and recycled fiber. Designed to bend down to 10 in. radius prior to lamination, FlexGreen is available in 48 x 96, 96 x 48, 48 x 120, and 120 x 48 in. sizes, all ¾ in. thick.

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Materials and Material Processing
Architectural and Civil Engineering Products Sponsored by: Siemens Corporation - Banner w/DoubleClickTags

Search for suppliers of: Substrates | Architectural Panels

Thick Film Copper Substrates suit high-current applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 18 Sep 2007 07:47:59 -0600

Able to be laser-scribed or green-scored, TFC Series features copper formulation that utilizes screen-printing process where copper traces are printed on alumina ceramic substrate and fired temperatures to 1,000°C. Solderable copper substrates exhibit adhesive copper strength greater than 20 N/mm², thermal expansion of 7.3 ppm/°C, and sheet resistivity of 0.2 mW (180 µ thick). Conductor thickness ranges from 20-250 µ, with space between conductors of 0.5 mm.

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Materials and Material Processing

Search for suppliers of: Printed Thick Film Substrates | Alumina & Steatite Substrates | Soldering Coppers | Thick Film Material

Ceramic Substrate suits thick-film applications.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 25 Jul 2007 07:49:13 -0600

Designed to address miniaturization and higher-power applications, DuraStrate consists of fine-grained (1.5-2.0 micron) microstructure material optimized for biaxial flexural strength, consistent thicknesses, camber flatness, and aged adhesion. Ceramic substrate material is designed for optimal performance in very thin (10-15 mil) varieties of thick-film substrates.

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Materials and Material Processing

Search for suppliers of: Printed Thick Film Substrates | Ceramic Materials

Ceramic Substrates reduce in-circuit transmission line losses.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 31 Jan 2006 07:20:47 -0600

Available in 0.010, 0.015, and 0.025 in. thicknesses, polished ceramic substrates provide approximately 0.2 dB improvement in line loss per inch on 0.025 in. thick alumina transmission line. Allowing for smaller circuit and element geometries, as well as reduced circuit size, substrates are suitable for use in routers and switches, servers, computers, wireless applications, RF and microwave applications.

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Communication Systems and Equipment
Materials and Material Processing

Search for suppliers of: Substrates | Superconductor Substrates | Ceramic Substrate Power Splitters

Metallized Ceramic Substrates are RoHS compliant.

info@productnews.com (ThomasNet Industrial Newsroom) — Mon, 30 Jan 2006 07:05:23 -0600

Offering substitute for thick film materials containing platinum-palladium, LCMC metallized ceramic substrates are manufactured by process that combines thick film processing with Ni-Au plating. They can withstand multiple SMT reflow solder cycles and repairs without solder leaching. Featuring tracks resistivity of 1-2 mohm/sq, substrates can be fabricated in 5 x 7 in. format and are suited for thermally demanding applications up to 170°C continuous.

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Materials and Material Processing

Search for suppliers of: Metallized Ceramics | Substrates

Aluminum Alloy Substrate is thermally conductive.

info@productnews.com (ThomasNet Industrial Newsroom) — Thu, 15 Dec 2005 07:06:57 -0600

Providing thermal conductivity to polymer-based insulated metal substrates, Anotherm(TM) is insulated by chemically grown, anodized dielectric layer with solderable screen printed conductors. It eliminates need for additional heatsinks and features uniform thickness of 35 microns, with no potential for delamination or peeling. Max operating voltage is 250 Vac, with thermal impedance at 0.2°C/W, and max continuous operating temperature is 400°C without solder mask.

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Materials and Material Processing

Search for suppliers of: Metal Insulated Substrates

Ceramic Substrate offers 180 W/mK thermal conductivity.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 08 Dec 2004 07:52:59 -0600

Non-toxic Alunit® aluminum nitride ceramic substrate delivers 10 times more insulating power and heat conductivity than aluminum oxide. Material is suited for thin-film and thick-film applications, and is offered in 4 surface finishes: fired, fired superior, ground, and polished. It can be used for high-density components and hybrids in applications such as power electronics, IGBT modules, telecom components, cooling devices, direct copper bonding, and LEDs.

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Materials and Material Processing

Search for suppliers of: Aluminum Nitride | Aluminum Nitride Substrates

GaN Substrates are offered in 2 in. diameters.

info@productnews.com (ThomasNet Industrial Newsroom) — Wed, 26 Nov 2003 07:44:07 -0600

Free-standing gallium nitride (GaN) substrates have uniform dislocation density of 106cm-2 and are available with diameters of 2 in. and smaller. As solid-state blue light emitter, GaN is suited for blue laser diodes, which quadruple data storage on DVDs and print resolution in laser printers, make biomedical laser surgery safer, and double effective range for radar and satellites while increasing bandwidth.

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Materials and Material Processing

Membrane Electrode Assembly suits automotive fuel cells.

info@productnews.com (ThomasNet Industrial Newsroom) — Tue, 15 Apr 2003 07:36:44 -0600

GOREâ"¢ PRIMEA® Series 57 MEA (Membrane Electrode Assembly), suited for automotive PEM fuel cells, utilizes micro-reinforced membrane technology combined with gas diffusion technologies and material innovations. Components and associated technology enable product to withstand challenges of chemical degradation and voltage decay in harsh environments.

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Materials and Material Processing

Search for suppliers of: Membranes