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ThomasNet News® - Adhesives & Sealants
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ThomasNet News® is a service of ThomasNet.com
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UV Cure Adhesive suits microelectronic assembly applications.
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'); document.write('Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony.'); document.write('
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Flexible Adhesives fixture to handling strength in 5 sec or less.
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'); document.write('Cyanoacrylate adhesives Loctite® 4902™ and 4903™ bond reliably to plastics, rubbers, metals, and other substrates. Affording optimal flexibility, Loctite® 4902™ offers elongation of 155% and modulus of 57,900 psi. Loctite® 4903™ offers 85% elongation and modulus of 78,100 psi. Designed for use on close-fitting, flexible parts, these one-part instant adhesives can bond dissimilar substrates and offer ISO 10993 biocompatibility for use on disposable medical devices.'); document.write('
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Copper-Filled Grease suits heat transfer applications.
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'); document.write('Consisting of single-part, 100% solids, thermally conductive, silicone grease, Heat-Away™ 640 is used in heat transfer applications from -60 to 550°F. Product is formulated as thick paste that will not flow after application and maintains stable viscosity over entire temperature range. With thermal conductivity of 4.68 W/m-K, grease optimizes thermal transfer between heaters and process vessels and various heat sinks used in heat exchangers in electrical and electronic applications.'); document.write('
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Gasket Tape is suited for NEMA enclosures and digital signage.
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'); document.write('Available as die cut gaskets and in slit-to-width rolls, 480S Gasket Tape is made from Saint-Gobain R10480S soft, low compression set, closed cell silicone sponge that allows for weather sealing with low closure force. Material is UL JMLU2, UL 50E, and UL 508 recognized for gaskets and seals used in continuous compression and period recompression. Backed by 3M 9485 acrylic adhesive capable of bonding to diverse substrates, tape comes in thicknesses of .125, .188, and .250 in.'); document.write('
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Thermally Conductive Epoxy Adhesive complies with RoHS.
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'); document.write('Available in dual cartridges, EB-127TC exhibits lap shear strength of greater than 3,500 psi. Aluminum metal filled, 2-part adhesive also has low chloride ion content, low outgassing, and 60 minute work life, making it suitable for applications requiring thermal conductivity and high volume efficiency. Product complies with RoHS initiative as well as REACH regulations.'); document.write('
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Translucent Acrylic Pressure-Sensitive Tape bonds clear materials.
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'); document.write('Able to replace mechanical fasteners or welds, PHB1000 provides uniform bond between diverse substrates, including glass and other clear materials, as well as intricate shapes. Product withstands weathering, moisture, and temperatures from -30 to +200°F without losing adhesion and will not harden, stain, or become brittle with age. Also effective in dampening vibration, sound, and shock, 0.010–0.060 in. thick tape comes in widths from 3/16–18 in. and lengths to 216 ft.'); document.write('
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Flooring/Wall Products target restaurant industry professionals.
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'); document.write('Used for floor and wall resurfacing, restoration, and protection, HardCore system creates durable floors and walls over new or damaged concrete and other substrates. System includes application of 5 products in various combinations: HardShield water-based, clear epoxy sealer; HardFlor heavy-duty, ¼ in. bonded industrial flooring surfaces; HardCote customizable coating for walls; HardCure high-bond epoxy primer; and HardCove 100% total solids, trowelable epoxy.'); document.write('
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Conductive Adhesive targets die-attach applications.
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'); document.write('Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules.'); document.write('
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Zinc Aerosol Spray protects metals underwater.
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'); document.write('Offering protection above and below waterline, Prop Coat Barnacle Barrier forms optimal bond to bare metals, inhibiting corrosion and preserving surface integrity. Coating is suitable for use on aluminum, steel, stainless steel, cast iron, copper, bronze, galvanized steel, and lead. Applied with 2-3 spray coats, product provides smooth, hard surface that self-cleans. It is available in flat gray finish and will cover 10 sq ft per 16 oz can.'); document.write('
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Silver-Filled Epoxy Adhesive suits applications up to 480°F.
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'); document.write('Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP.'); document.write('
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Radial Shaft Seal protects wind turbines.
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'); document.write('Designed with integrated deflector lip, Merkel Radiamatic R 55 Radial Shaft Sealing Ring protects wind turbine systems against harsh environment elements and eliminates need to use second seal, which is common in existing wind systems. In addition, seal minimizes installation space and can even offset radial play or shaft eccentricity without neglecting sealing and deflecting functions.'); document.write('
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Low Molecular Weight Polymers promote adhesion.
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'); document.write('Dispersed in water, Ricobond® 7002 and 7004 produce low-viscosity, stable dispersions with small particle size. Both can be formulated with other emulsions for optimized adhesion to different polar and non-polar substrates. Adding dispersions to standard latexes such as SBR and VP emulsions can also improve water resistance and mechanical properties. Other uses include water-based adhesives, coatings, paper sizing, construction materials, and composites.'); document.write('
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Epoxy Adhesive suits microelectronic assembly applications.
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'); document.write('Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.'); document.write('
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Conductive Adhesive suits die attach applications.
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'); document.write('Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces.'); document.write('
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Silane-Modified Polymer Adhesives seal seams and joints.
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'); document.write('Designed for elastic bonding, coating, and sealing of seams and joints on most metal, plastic, and composite substrates, Teroson® MS 930™ and Teroson® MS 939™ require no primers and offer both UV and weather resistance. Solvent- and isocyanate-free, one-part adhesives cure rapidly with exposure to ambient moisture. Supplied in sausage packs, products experience limited shrinkage on cure and are paintable, making them suitable for applications where aesthetics are important.'); document.write('
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Oil-Tolerant Anaerobic Adhesives can cure through contaminants.
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'); document.write('Formulated as wax-like, semi-solid adhesives packaged in self-feeding stick applicator, Loctite® 248™ Medium Strength Blue and Loctite® 268™ High Strength Red Threadlocker Sticks securely lock and seal threaded assemblies, fill gaps between threads, and prevent corrosion. These anaerobic threadlocker sticks can be used on oil-contaminated surfaces without requiring primers or accelerators and will not leak or drip when carried in pocket, stored in toolbox, or used in overhead applications.'); document.write('
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Thermally Conductive Epoxy serves applications up to 572°F.
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'); document.write('Used for bonding, potting, tooling, and molding, Aremco-Bond™ 805 adheres to high-temperature plastics, glass, ceramic, and high-expansion metals. This 2-component, 100% solids, aluminum-filled epoxy cures at room temperature in 24 hr with final cure at 200°F in 2 hr. Cured material exhibits thermal conductivity of 12.5 Btu-in/hr-ft²-°F and dielectric strength of 50 V/mil. Respective tensile shear and flexural strengths are 1,800 and 15,500 psi, and Shore D Hardness is 87.'); document.write('
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Vinyl Foam Tape can be used in adverse environments.
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'); document.write('Used for sealing, cushioning, and gasketing in HVAC, packaging, weatherproofing, and OEM applications, Pres-On VF20200 tapes are coated on both sides with permanent acrylic adhesive featuring functional temperature range of -20 to +200°F. Closed cell structure resists absorption of water while maximizing load bearing capacity, and conformability makes tapes suited for joining irregular surfaces. Standard rolls come in ¼–54 in. with thickness of 1/32, 1/16, or 1/8 in.'); document.write('
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Epoxy Potting Compound provides chemical resistance.
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'); document.write('Stable from -55 to 200°C for potting applications, EPOXICAST EC-1027E withstands thermal cycling and thermal shock, and does not shrink, crack, or delaminate under extreme conditions. Product also provides resistance to ammonia related electrical shorting of encapsulated sensors. Two-part, heat cure only compound comes in various sizes ranging from pint kits to 5-gallon kits.'); document.write('
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Assembly Adhesive suits edgebonding applications.
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'); document.write('Designed for rapid ruggedization of circuit board components, Ultra Light-Weld® 9309-SC cures upon exposure to UV/visible light. Adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Formulated with patented See-Cure technology, 9309-SC is bright blue in uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure. As product cures, blue color transitions to colorless.'); document.write('
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