Ideal Industries, Inc.
Sycamore, IL 60178
Nov 03, 2009 Digital Circuit Breaker Finder and Socket Tester locates correct circuit breaker or fuse supplying power to AC socket or lighting fixture without interrupting circuit. Product features auto-power off, low battery detection, and non-contact voltage sensor mode to sense voltage higher than 50 V. Socket Tester identifies common wiring faults by verifying wiring configuration. Wiring errors are indicated by one or more LEDs failing to light, with pattern of lit LEDs indicating type of fault.

Cascade Microtech Inc.
Beaverton, OR 97006
Oct 28, 2009 Able to be leveraged across multiple platforms, G80 Grypper(TM) accelerates engineering development and failure analysis/QA for 0.8 mm+ pitch BGA devices in ASIC, FPGA, and embedded markets. Contact design minimizes forces required to insert higher-ball-count BGA devices into device-footprint G80 socket. Use allows customers to evaluate, debug, and characterize chipsets in actual system environment without soldering and de-soldering.

Lloyd Instruments Ltd. Forum House
Hampshire Hants  United Kingdom
Sep 10, 2009 Including upper wedge grip and lower fixture containing rollers which can be used in conjunction with low force universal materials test instruments, TG113 is designed for peel strength testing of laminated layers of standard plastic ID cards in accordance with ISO/IEC 10373-1:2006 (E). Jig allows 90° peel tests to be made at forces up to 200 N. Up to 4 test strips per card can be prepared and tested.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 18, 2009 Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on 0.30-0.35 mm pitch, 16 g/contact on 0.40-0.45 mm pitch, and 25 g/contact on pitches of 0.50 mm or larger.

Lloyd Instruments Ltd. Forum House
Hampshire Hants  United Kingdom
Jan 05, 2009 TG4975 performs 3 point bend tests on polystyrene samples measuring 11.81 x 5.91 x 1.97 in. in accordance with standard EN 12089: 1997 (Method B). Designed for use with loads up to 1,000 N, jig consists of extruded aluminium base with fixed center of 9.84 in., and 2 circular supports are fitted to base. Sample is placed centrally between 2 supports and in parallel with them. Upper loading anvil with 5/8 in. eye end is fixed to load cell and driven down onto sample midway between 2 supports.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Nov 17, 2008 Featuring 0.3 mm pitch, Center Probe and CSP/MicroBGA test and burn-in sockets include replaceable interposer sets and require minimal handler tooling for use in CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices for PCBs. Operating from -67 to +302°F, they also include solderless pressure mount compression spring probes, located by 2 molded plastic alignment pins and mounted with 2 SS screws. Signal path of sockets is 1.96 mm and each is rated for minimum of 500,000 cycles.

Interconnect Devices, Inc.
Kansas City, KS 66106
Oct 21, 2008 Consisting of plastic assembly containing semiconductor probe technology, Synergetix Test Socket Interposers facilitate testing of WLCSPs in vertical probing applications. Extremely linear compression against wafer helps maximize mechanical life. Suited for high-current applications, interposers feature average cleaning cycle of every 50,000 touchdowns, and contact replacement is rarely necessary before 500,000 tests.

Interconnect Devices, Inc.
Kansas City, KS 66106
Oct 21, 2008 Suited for testing QFNs, MLFs, and other leadless devices, Synergetix Dyno Contact(TM) features monolithic design, which scrubs across surface of device lead, penetrating contaminants through hundreds of thousands of insertions. Unit is plated with Endura Plating process, which offers resistance to intermetallic contamination. Contact provides 500,000 mechanical life cycles and contact resistance under 20 mW when tested against matte-tin device.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 12, 2008 RF test sockets, for use with PCBs, and CSP/BGA test and burn-in sockets, for use with burn-in-boards (BIB), feature solderless, gold over nickel-plated pressure mount compression spring probes that are mounted with 4 SS screws, which allows for height variations in device thickness. Units also include 4-point spring probe crown to insure scrub on solder ball oxides. Signal path during test is 0.977 in. and units operate from -67 to +302°F and accommodate up to 500,000 cycles.

Ironwood Electronics, Inc.
St. Paul, MN 55121
Sep 12, 2008 Designed for 11 x 11 mm, 0.65 mm pitch, 15 x 15 array 225 balls, ASE 225 LTFBGA SS-BGA225G-01 is 10 GHz high endurance socket that can be used for hand test and burn-in applications. With 16 g actuation force per ball and -40 to +150°C temperature range, spring pin contactor has self inductance of 1.3 nH, insertion loss of less than 0.25 dB at 4.5 GHz (less than 3dB at 10GHz), capacitance of 0.53 pF, and 2.5 A current capacity.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 28, 2008 Suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices, CSP/MicroBGA Test and Burn-In Socket accommodates up to 500,000 cycles and operates from -67 to 302°F. It offers solderless pressure mount compression spring probes which allow sockets to be mounted to and removed from burn-in-board (BIB). Unit also features pressure pad compression spring that provides proper force against device and allows for height variations in device thickness.

Components Corp.
Denville, NJ 07834
Aug 04, 2008 Featuring 0.125 or 0.100 in. centers, TP-104, -105, and -106 test points can accommodate 0.062 in. thick PCBs. Provided precut to any of 30 positions, loop-style TP-104 and oval-loop style TP-106 test points feature 0.063 in. mounting holes, while TP-105 is available in up to 40 positions, has loop profile for positive loop retention, and fits into 0.035-0.042 in. hole. Devices are designed to ensure secure, non-slip grip of alligator clips, probes, J-hooks, tips, and grabbers.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Feb 14, 2008 Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Feb 07, 2008 Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, socket is suited for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40 mm. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch. Measuring 1.200 x .840 x .440 in., unit provides minimal signal loss for high bandwidth capability via signal path of 0.077 in.

Antares Advanced Test Technologies
Vancouver, WA 98683
Nov 07, 2007 Able to accept QFN packages down to 0.35 mm pitch, 880 Series features compression mount clamshell that allows chipmakers to remove or replace sockets and retain production capacity if they were to be damaged. Specifications include beryllium copper alloy contact, gold contact plating, 20 g contact force, temperature rating of -40 to 155°C, and durability of 30,000 cycles. Socket's wiping-action contact works to create consistent resistance during burn-in, reducing maintenance.

DPS Telecom
Fresno, CA 93727
Oct 17, 2007 With NetGuardian 3288 Test Fixture, network technicians can self-diagnose problems within their own network monitoring. Unit allows for testing of complete monitoring system: remote, transport, and alarm master. Tool has 32 discrete alarm toggles, 8 analog knobs, and 8 control relay LEDs. While discrete alarms indicate only alarm or clear states, analog inputs allow detailed monitoring of temperature, humidity, battery levels, and other analog values.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 15, 2007 High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mm², 14-27 mm², 28-40 mm², and 41-55 mm². With -55 to +150°C operating temperature range, products are used in applications such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with speeds from 1 to more than 10 GHz.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Oct 24, 2006 Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25 g per contact for 0.50 mm pitches and larger.

Agilent Technologies, Inc.
Palo Alto, CA 94303
May 08, 2006 With measurement bandwidth beyond 6 GHz and rise times below 100 ps, N1020A fixture is used in conjunction with Infiniium Oscilloscopes and HDMI Transmitter Compliance Test solution for consumer electronics. Available in K12 and K13 options, it supports test needs for HDMI as specified in HDMI Compliance Test Specification 1.2a. Product is available in Plug-End or Receptacle-End models.

Instron
Norwood, MA 02062-2643
Apr 11, 2006 Designed for static bend/flexure testing on wood and timber products, 2820-04x Series bend fixtures come in 10 and 50 kN capacities with 800 and 1,200 mm max span lower beams. Shear fixture 2820-060, featuring specimen clamp and interchangeable shims, measures compressive shear strength of wood and adhesive products. Incorporating self-aligning coupling and rotatable lower grip, 2820-061 internal bond fixture measures force needed to separate internal wood fibers in chipboard and fiberboard.