Aries Electronics, Inc.
Bristol, PA 19007-6810
Feb 14, 2008 Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Feb 07, 2008 Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, socket is suited for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40 mm. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch. Measuring 1.200 x .840 x .440 in., unit provides minimal signal loss for high bandwidth capability via signal path of 0.077 in.

Antares Advanced Test Technologies
Vancouver, WA 98683
Nov 07, 2007 Able to accept QFN packages down to 0.35 mm pitch, 880 Series features compression mount clamshell that allows chipmakers to remove or replace sockets and retain production capacity if they were to be damaged. Specifications include beryllium copper alloy contact, gold contact plating, 20 g contact force, temperature rating of -40 to 155°C, and durability of 30,000 cycles. Socket's wiping-action contact works to create consistent resistance during burn-in, reducing maintenance.

DPS Telecom
Fresno, CA 93727
Oct 17, 2007 With NetGuardian 3288 Test Fixture, network technicians can self-diagnose problems within their own network monitoring. Unit allows for testing of complete monitoring system: remote, transport, and alarm master. Tool has 32 discrete alarm toggles, 8 analog knobs, and 8 control relay LEDs. While discrete alarms indicate only alarm or clear states, analog inputs allow detailed monitoring of temperature, humidity, battery levels, and other analog values.

Aries Electronics, Inc.
Bristol, PA 19007-6810
May 15, 2007 High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mm², 14-27 mm², 28-40 mm², and 41-55 mm². With -55 to +150°C operating temperature range, products are used in applications such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with speeds from 1 to more than 10 GHz.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Oct 24, 2006 Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25 g per contact for 0.50 mm pitches and larger.

Agilent Technologies, Inc.
Palo Alto, CA 94303
May 08, 2006 With measurement bandwidth beyond 6 GHz and rise times below 100 ps, N1020A fixture is used in conjunction with Infiniium Oscilloscopes and HDMI Transmitter Compliance Test solution for consumer electronics. Available in K12 and K13 options, it supports test needs for HDMI as specified in HDMI Compliance Test Specification 1.2a. Product is available in Plug-End or Receptacle-End models.

Instron
Norwood, MA 02062-2643
Apr 11, 2006 Designed for static bend/flexure testing on wood and timber products, 2820-04x Series bend fixtures come in 10 and 50 kN capacities with 800 and 1,200 mm max span lower beams. Shear fixture 2820-060, featuring specimen clamp and interchangeable shims, measures compressive shear strength of wood and adhesive products. Incorporating self-aligning coupling and rotatable lower grip, 2820-061 internal bond fixture measures force needed to separate internal wood fibers in chipboard and fiberboard.

Advantest America Corp.
Santa Clara, CA 95054
Mar 09, 2006 Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75, 0.8, 1, and 1.27 mm pitches.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 15, 2005 Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80 mm pitches and larger.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 01, 2005 Test and Burn-In Socket accommodates devices from 41-55 mm² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as CSP, MicroBGA, LCC, LGA, QFP, QFN, and MLF packages.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Dec 15, 2004 Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for SRAM and DRAM packages.

Magtrol, Inc.
Buffalo, NY 14224-1322
Mar 12, 2004 Adjustable Motor Fixture locates and holds motor in place for running any test, while maintaining center height required for coupling to company's HD-106 through HD-715 Hysteresis Short Base Plate Dynamometer. Lead screw adjustment provides centering for motor while T-Slot Base supplies multiple position options for various motor lengths. Adjustable bridge provides clamping anywhere along axis of motor and thumbscrew protects against vibration.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Oct 16, 2003 RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Operating temperature is -67 to 302°F.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 26, 2003 Designed for use with devices from 14-27 mm², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302°F. Based on device with 0.50 mm pitch, pin inductance is 0.75 nH Max, mutual inductance is less than 0.15 nH, and mutual capacitance is 0.03 pF max.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Sep 09, 2003 RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80+ mm pitches.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 18, 2003 Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over 500,000 and can handle up to 2 A continuous current.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jul 14, 2003 Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact for 0.80 mm pitches and larger. Socket operating temperature is -67 to 302°F.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Jan 10, 2003 Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is 5-194°F, with max differential temperature of 158°F.

Aries Electronics, Inc.
Bristol, PA 19007-6810
Aug 14, 2002 Integra 27 has molded PPS plastic components designed to minimize space without sacrificing repeatability and durability. Device-specific spring probe insert can be machined to match testing needs. Socket's contacts are IDI spring probes, some which are electrically characterized to 10 GHz. Contacts are durable enough to handle burn-in and HAST testing. User replaceable contacts have current capacity of 3-6 A per and durability of 500,000 actuations.