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Test & Measuring Instruments ->
Test & Measurement Accessories ->
Test Fixtures
Test Fixtures
(Showing headlines 1 - 20) more ....
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 QC Test Fixtures target pharmaceutical marketplace.Brookfield Engineering Laboratories, Inc.
Middleboro, MA 02346
Apr 13, 2012
Designed for CT3 Tester, which operates in both compression and tension modes, TA-CLT Capsule Loop Tensile Test Fixture measures tensile breaking strength of hard gel capsules. Gel cap is mounted between 2 pins which pull apart, thereby measuring force required to rupture cap. Featuring guillotine type design, TA-BLS Bilayer Shear Jig measures force required to separate layers of multi-layer tablet. Tablet is placed in jig and cutting plate slices into tablet until adhesion fails.
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Hi-Temp CSP Sockets enable testing of any area-array device.Aries Electronics, Inc.
Bristol, PA 19007-6810
Dec 26, 2011
Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with pitch of 0.4 mm or greater as well as mixed pitch environments.
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Elastomer BGA Socket is intended for testing eMMC devices.Ironwood Electronics, Inc.
St. Paul, MN 55121
Nov 15, 2011
Designed for testing 0.5 mm pitch, 14 x 18 mm eMMC BGA device, SG-BGA-7219 connects all pins with 10 GHz bandwidth and operates with less than 1 dB insertion loss. Contact resistance is 20 mohm per I/O (typ), and mounting is accomplished via supplied hardware on target PCB without any soldering. Quick insertion method, using shoulder screws and swivel socket lid, accelerates IC change-out, while floating compression mechanism accommodates package manufacturing variations.
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Extreme Temperature Test Socket handles 4.5 x 4.5 mm QFN devices.Ironwood Electronics, Inc.
St. Paul, MN 55121
Aug 24, 2011
Designed to test 0.4 mm pitch, 32-lead QFN devices with center ground pad, Model CBT-QFN-7008 features temperature range of -55 to +155°C. Etched spring pin contactor, with cycle life of 500,000 insertions, provides 0.95 nH self inductance, insertion loss of less than 1 dB at 7 GHz, and 0.097 pF capacitance. Current capacity of each contactor is 4.1 A at 60°C temperature rise. In addition, socket has wave spring with swivel compression plate for vertical force without distorting device position.
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 BGA Socket supports LTE femtocell SoCs.Ironwood Electronics, Inc.
St. Paul, MN 55121
Jul 01, 2011
Suited for hand test and temperature characterization as well as debugging in femtocell development, Model CBT-BGA-6015 has stamped spring pin contactor with 19 g actuation force per ball and cycle life of 500,000 insertions. Contactor features self inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Specific configuration of package to be tested in socket is BGA, 52.5 x 52.5 mm, 1 mm pitch, 2097 position, 51 x 51 ball array.
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Extreme Temperature Socket accommodates 4 x 4 mm QFN device.Ironwood Electronics, Inc.
St. Paul, MN 55121
Jun 01, 2011
Addressing requirements for testing Amkor 24-lead QFN, CBT-QFN-7005 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 500,000 insertions. Contactor properties include 0.88 nH self inductance, less than 1 dB @ 15.7 GHz insertion loss, 0.097 pF capacitance, and 4 A @ 80°C temperature rise current capacity. Operating from -55 to +180°C, socket offers wave spring with swivel compression plate for vertical force without distorting device position.
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High-Performance BGA Socket accomodates 23 x 23 mm packages.Ironwood Electronics, Inc.
St. Paul, MN 55121
May 16, 2011
Model SM-BGA-9000 for 23 x 23 mm, 0.8 mm pitch BGA packages operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. It dissipates 4.5 W with heat sink compression screw and can be customized up to 100 W with modified fin design and adding axial flow fan. Operating in temperatures from -55 to +150°C, unit offers contact resistance of 15 mW/pin as well as current capacity of 4 A/pin. Socket, constructed with shoulder screw and swivel lid, mounts on PCB with no soldering.
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 Triple Stacked BGA Socket tests processor, memory, and memory probe.Ironwood Electronics, Inc.
St. Paul, MN 55121
Apr 26, 2011
Model CBT-BGA-7007 features 0.5 mm pitch stamped spring pins with 26 g actuation force/ball, and 0.4 mm pitch etched spring pins with 34 g actuation force/ball, both which have cycle life of 500,000 insertions. Socket also features floating guide for precise ball-to-pin alignment. Operating in temperatures from -55 to +180°C, it is designed to test 12 x 12 mm, 0.4 mm BGA package in bottom socket and 12 x 12 mm, 0.5 mm pitch memory BGA in top socket. Unit mounts to PCB without soldering.
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 FPC Testing Socket features horse-shoe shaped contact.Yamaichi Electronics U.S.A. Inc.
San Jose, CA 95134
Mar 31, 2011
Supporting ultra fine pitches down to 0.3 mm, LC Series Clip Type Socket features specially designed contacts that carry out micro wiping action, ensuring stable, low contact resistance. Elevator stage prevents FPC pads from being damaged or scratched while simultaneously protecting contacts during FPC load/unload operation. As output options, customer can choose discrete wiring, MIL Std., or FPC connector.
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WLCSP Socket verifies IC function in development systems.Ironwood Electronics, Inc.
St. Paul, MN 55121
Mar 07, 2011
Operating at bandwidths up to 10 GHz with less than 1 dB insertion loss, SG-BGA-7203 allows testing of 2 different WLCSPs - 0.5 mm pitch, 40-ball WLCSP and 0.4 mm pitch, 30-ball - in one socket, side by side. Contact resistance is 20 mW typ per I/O, and socket connects all pins with 10 GHz bandwidth on all connections. Mounted without soldering on target PCB using supplied hardware, socket incorporates insertion method using shoulder screws and swivel socket lid to accelerate IC change-out.
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IC Test Adapter supports 0.8 mm pitch, 96-position BGA ICs.Ironwood Electronics, Inc.
St. Paul, MN 55121
Feb 22, 2011
Model PA-BGA96C-Z-01 probing and prototyping adapter for testing clock driver ICs includes GHz BGA socket. It features pin self-inductance of 0.11 nH and mutual inductance of 0.028 nH, while capacitance to ground is 0.028 pF and current capacity is 2 A/pin. Operating over temperature range of -35 to +100°C, unit is mounted on PCB which interfaces BGA socket to 0.100 in. center pin grid array on bottom side. It also has gold plated solder-tail machined pins for maximized reliability.
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 BGA Socket addresses burn-in characterization requirements.Ironwood Electronics, Inc.
St. Paul, MN 55121
Feb 08, 2011
Featuring floating guide for precise ball to pin alignment, Model CBT-BGA-6011 supports 9 x 12 mm, 1 mm pitch, 48-position, 9 x 11 ball array configuration. Contactor delivers 0.93 nH self inductance, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Current capacity for each contactor is 8 A at 80°C temperature rise. Operating from -55 to +180°C, socket is mounted using supplied hardware on target PCB with no soldering.
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Spring Pin BGA Socket tests digital camera processors.Ironwood Electronics, Inc.
St. Paul, MN 55121
Jan 18, 2011
Configured to test 13 x 13 mm, 0.65 mm pitch, 293 position, 19 x 19 ball array, CBT-BGA-7005 features contactor with stamped spring pin, 26 g actuation force per ball, and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. Designed with floating guide for precise ball to pin alignment, socket temperature range is -55 to +180°C and current capacity of each contactor is 4 A at 80°C temperature rise.
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 Spring Loaded Probe tests orally disintegrating tablets.Brookfield Engineering Laboratories, Inc.
Middleboro, MA 02346
Dec 23, 2010
Designed to measure rate of decay of orally disintegrating tablets (ODTs), spring loaded probe adapter utilizes natural force linearity of its internal spring to relate decrease in force to shrinking size of tablet. Operator touches ODT with adapter, pressing until spring is compressed distance equal to length of tablet. Appropriate liquid is then added, and spring relaxes as tablet disintegrates. Product is compatible with CT3 Texture Analyzer.
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 Spring Pin Socket helps test power management devices.Ironwood Electronics, Inc.
St. Paul, MN 55121
Dec 14, 2010
Model SSK-QFN-7000 includes contactor that is spring pin with offset plunger, which allows 2 spring pins to contact one device lead or pad. Featuring current capacity of 2.8 A at 80°C temperature rise, each contactor has self inductance of 0.97 nH, insertion loss of less than 1 dB at 11.2 GHz, and capacitance 0.58 pF. Kelvin spring pins have 28 g actuation force per ball and cycle life of 500,000 insertions. Product operates over -40 to +150°C temperature range.
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Elastomer Socket accommodates 0.5 mm pitch, 25-pin WCSP.Ironwood Electronics, Inc.
St. Paul, MN 55121
Oct 28, 2010
Designed for 2.75 x 2.75 mm package size, Model SG-BGA-7188 verifies function of IC in development system. Unit operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss and contact resistance of 20 mW per I/O. Mounted using supplied hardware on target PCB with no soldering, socket incorporates quick insertion method using integrated compression plate. Temperature range is -35 to +100°C and current capacity is 2 A/pin.
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 Semiconductor Test Socket has modular design.Yamaichi Electronics U.S.A. Inc.
San Jose, CA 95134
Aug 02, 2010
Y-RED volume test socket features top side removable insert and tool-free cover mounting to minimize changeover times when testing semiconductors. Unit includes spring probe with crown plunger tip for BGA, and conical plunger tip for LGA and QFN packages. Its 2-piece pin has contact resistance below 50 mW and is stable for up to 500,000 mating cycles. Available for standard temperature range of -40 to +125°C, pin is also offered for temperature range of -55 to +150°C.
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 Double Stacked BGA Socket simultaneously tests processor and memory.Ironwood Electronics, Inc.
St. Paul, MN 55121
Jul 02, 2010
Facilitating simultaneous testing of processor and memory, CBT-BGA-7002 has stamped spring pin contactor with 26 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. Featuring floating guide for precise ball to pin alignment, socket is mounted using supplied hardware on target PCB with no soldering, and handles temperatures from -55 to +180°C.
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 Boundary Scan Fixture enables structural test of AMC modules.GOEPEL electronics LLC
Austin, TX 78759
Jun 17, 2010
Compatible with Advanced Mezzanin Cards (AMC) for ATCA systems, CION Fixture(TM)/AMC interface test fixture comes with preset AMC slot in which card is inserted and connected to TAP (Test Access Port) at same time. Integrated IEEE 1149.1 and IEEE1149.6 test channels allow structural test of all high- and low-speed signal pins. Solution supports compact, mid-size, and full-size modules with AMC B+ interface and is compatible with PICMG AMC.0 R2.0 standard.
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 Burn-In and Test Sockets feature clam-shell lid design.Robson Technologies, Inc.
Morgan Hill, CA 95037
May 20, 2010
Suitable for most any package type, Burn-In and Test Sockets feature floating Z-axis pressure plate that allows for tolerances in package thickness. Sockets use flat pin technology for 0.4 mm, 0.5 mm, and larger pitch devices. Highest performance pin provides bandwidth up to 30 GHz at -1 db with current capacity of 3.0 A. Built with plastic and aluminum, machined semi-custom pogo pin sockets have temperature range from -50 to +155°C and life span of more than 25,000 insertions.
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