Ulvac Technologies, Inc.    Methuen, MA 01844
Sep 12, 2011 Equipped with automatic R-Theta stage, UNECS-3000A measures thickness and refractive index of transparent or semi-transparent thin film. Automatic mapping function can handle 300 mm dia wafer substrates, and non-contact instrument can measure 106 points on 300 mm dia wafer within 120 sec. Max measurement speed is 20 ms/point, and other features include automatic height adjustment, editable materials table file, and ability to concurrently analyze up to 6 layers of film thickness.

Rudolph Technologies, Inc.    Flanders, NJ 07836
Jul 10, 2006 Utilizing FOCUS(TM) beam ellipsometry, S3000(TM) (300 mm) and S2000(TM) (200 mm) measure transparent films throughout device fabrication process. Laser light sources are used for optimal accuracy, stability, spot size, and tool-to-tool matching. Also provided, optional deep UV and visible reflectometry capabilities offer flexibility in addressing various applications throughout fabrication. Built on Vanguard(TM) platform, products incorporate Cognex® PatMAX® geometric pattern-matching technology.